HEAT DISSIPATING SYSTEM

• US 20130128438A1
• Filed: 07/26/2012
• Published: 05/23/2013
• Est. Priority Date: 11/18/2011
• Status: Abandoned Application

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: HUANG, CHENG-YEN, SU, SHENG-WEI
• Application Number:
  US13/559,561
• Publication Number:
  US 20130128438A1
• Time in Patent Office: Days
• US Class Current: 361/679.4
• CPC Class Codes: G06F 1/206 comprising thermal management

Abstract

An exemplary heat dissipating system includes a motherboard, a plurality of temperature sensors connected to the motherboard for sampling a temperature of the motherboard, a FCB establishing a wireless communication with the motherboard, and a plurality of fans. The motherboard receives and processes the temperature data from the plurality of temperature sensors to transform the temperature data into a wireless signal. The FCB obtains the temperature data through the wireless communication, and controls the rotation speed of the plurality of fans according to the temperature data.

Claims

1. A heat dissipating system, comprising:

a motherboard;

a plurality of temperature sensors connected to the motherboard and configured for sampling a temperature of the motherboard;

a fan control board (FCB) establishing a wireless communication with the motherboard; and

a plurality of fans connected to the FCB;

wherein the motherboard receives and processes the temperature data from the plurality of temperature sensors to transform the temperature data into a wireless signal, the FCB obtains the temperature data through the wireless communication, and controls the rotation speed of the plurality of fans according to the temperature data.

2. The heat dissipating system of claim 1, wherein the motherboard comprises a baseboard management controller (BMC) connected to the plurality of temperature sensors, the BMC obtains the temperature data from the plurality of temperature sensors, and transforms the temperature data into the wireless signal.

3. The heat dissipating system of claim 2, wherein the motherboard comprises a data transmitter connected to the BMC, and used to receive and transmit the wireless signal.

4. The heat dissipating system of claim 3, wherein the FCB comprises a data receiver established the wireless communication with the data transmitter, and used to obtain the temperature data.

5. The heat dissipating system of claim 4, wherein the FCB comprises a processing unit connected to the data receiver, and used to receive the temperature data, and control the rotation speed of the plurality of fans.

6. The heat dissipating system of claim 4, wherein the data transmitter and the data receiver are separately a BLUETOOTH transmitter and a BLUETOOTH receiver, and the data transmitter establishes the wireless communication with the data receiver through BLUETOOTH technology.

7. The heat dissipating system of claim 4, wherein the data transmitter and the data receiver are separately an infrared data association (irDA) transmitter and an irDA receiver, and the irDA transmitter establishes the wireless communication with the irDA receiver through infrared technology.

8. The heat dissipating system of claim 4, wherein the data transmitter and the data receiver are separately a radio frequency identification (RFID) label and a RFID reader, and the RFID label establishes the wireless communication with the RFID reader through radio identification technology.

9. The heat dissipating system of claim 1, wherein the plurality of temperature sensors are mounted on the motherboard.

10. The heat dissipating system of claim 1, wherein the plurality of temperature sensors are mounted on an impressible position of the motherboard.

11. The heat dissipating system of claim 10, wherein the impressible position is an air inlet of the motherboard.

12. The heat dissipating system of claim 10, wherein the impressible position is an air outlet of the motherboard.

13. The heat dissipating system of claim 4, wherein the data transmitter of the motherboard transmits corresponding registered information to the data receiver via wireless network to apply register when the motherboard is inserted in a container data center (CDC), and the data receiver determines if the motherboard is inserted in the CDC according to the registered information, thereby supporting a hot-swap function.

14. A heat dissipating system, comprising:

a motherboard comprising;

a data transmitter; and

a FCB comprising;

a data receiver;

wherein the data receiver establishes a wireless communication with the data transmitter through BLUETOOTH technology, infrared technology, or radio identification technology.

15. The heat dissipating system of claim 14, wherein the data transmitter and the data receiver are separately a BLUETOOTH transmitter and a BLUETOOTH receiver, and the data transmitter establishes the wireless communication with the data receiver through the BLUETOOTH technology.

16. The heat dissipating system of claim 14, wherein the data transmitter and the data receiver are separately an irDA transmitter and an irDA receiver, and the irDA transmitter establishes the wireless communication with the irDA receiver through the infrared technology.

17. The heat dissipating system of claim 14, wherein the data transmitter and the data receiver are separately a RFID label and a RFID reader, and the RFID label establishes the wireless communication with the RFID reader through the radio identification technology.