Circuit Board Heatsink and Heatframe Structures With Heater Element For Circuit Board Operation At Below Zero Temperature
First Claim
1. A circuit board assembly including a heating device operated during a cold startup condition, comprising:
- a printed circuit board;
a central processing unit (CPU) mounted to the printed circuit board;
a thermal transfer device connected to the printed circuit board acting when the CPU is operating to remove heat generated by the CPU; and
a heating device operating to heat the thermal transfer device, the heating device energized when a temperature defining a cold startup condition of the CPU or the thermal transfer device is sensed, the heating device inducing heat energy input into the thermal transfer device to heat the thermal transfer device and the CPU to above the temperature of the cold startup condition.
12 Assignments
0 Petitions
Accused Products
Abstract
A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.
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Citations
29 Claims
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1. A circuit board assembly including a heating device operated during a cold startup condition, comprising:
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a printed circuit board; a central processing unit (CPU) mounted to the printed circuit board; a thermal transfer device connected to the printed circuit board acting when the CPU is operating to remove heat generated by the CPU; and a heating device operating to heat the thermal transfer device, the heating device energized when a temperature defining a cold startup condition of the CPU or the thermal transfer device is sensed, the heating device inducing heat energy input into the thermal transfer device to heat the thermal transfer device and the CPU to above the temperature of the cold startup condition. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A circuit board assembly including a heating device operated during cold boot startup, comprising:
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a circuit board having a computer component; a thermal transfer device connected to the circuit board acting when the computer component is operating to remove heat generated by the computer component; a heating device operating to heat the thermal transfer device; a field programmable gate array acting to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed, the thermal transfer device when heated by the heating device heating the computer component to greater than the temperature of the cold startup condition; and a control device connected to the heating device providing an operational mode of the heating device. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for transferring heat to and from components of a circuit board assembly including a central processing unit (CPU), a printed circuit board, a thermal transfer device and a heating device operated during a cold startup condition, the method comprising:
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positioning the thermal transfer device in contact with the printed circuit board; and energizing the heating device when a CPU temperature equals a temperature defining a cold startup condition to heat the thermal transfer device, the thermal transfer device thereafter heating the CPU. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29)
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Specification