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Substrate Conveyance Method and Substrate Conveyance System

  • US 20130129462A1
  • Filed: 07/25/2011
  • Published: 05/23/2013
  • Est. Priority Date: 07/27/2010
  • Status: Active Grant
First Claim
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1. A wafer conveyance method, comprising:

  • moving a holding surface of a conveyance robot having an electrode for electrostatic attraction to the vicinity of a wafer supported by a supporting surface of a support member; and

    transferring the wafer from the supporting surface to the holding surface while applying a voltage to the electrode.

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