Substrate Conveyance Method and Substrate Conveyance System
First Claim
1. A wafer conveyance method, comprising:
- moving a holding surface of a conveyance robot having an electrode for electrostatic attraction to the vicinity of a wafer supported by a supporting surface of a support member; and
transferring the wafer from the supporting surface to the holding surface while applying a voltage to the electrode.
1 Assignment
0 Petitions
Accused Products
Abstract
[Object] To provide a wafer conveyance method and a wafer conveyance system that are able to quickly transfer a wafer without losing positional accuracy.
[Solving Means] Using an electrostatic chuck mechanism in the holding of a wafer (W) by the holding surface (210) of a conveyance robot, the wafer (W) is transferred from a supporting surface (303) to the holding surface (210) in the state where an electrostatic attraction force is generated at the holding surface (210). As a result, since it is possible to hold the wafer by means of the electrostatic attraction force starting immediately after the wafer (W) has been transferred to the holding surface (210), it is possible to rapidly execute a wafer (W) conveying operation and thus it is possible to reduce the conveying time of the wafer between processing chambers.
7 Citations
7 Claims
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1. A wafer conveyance method, comprising:
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moving a holding surface of a conveyance robot having an electrode for electrostatic attraction to the vicinity of a wafer supported by a supporting surface of a support member; and transferring the wafer from the supporting surface to the holding surface while applying a voltage to the electrode. - View Dependent Claims (2, 3)
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4. A wafer conveyance system, comprising:
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a conveyance robot including a holding surface having an electrode for electrostatic attraction; a supporting surface for supporting a wafer; and a controller capable of carrying out an operation control for moving the holding surface relative to the supporting surface, and a control for supplying a voltage to the electrode, and configured to cause the conveyance robot to transfer the wafer frorn the supporting surface to the holding surface while a voltage is applied to the electrode. - View Dependent Claims (5, 6, 7)
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Specification