MOBILE WIRELESS COMMUNICATIONS DEVICE HAVING IMPROVED ANTENNA IMPEDANCE MATCH AND ANTENNA GAIN FROM RF ENERGY

• US 20130130754A1
• Filed: 01/02/2013
• Published: 05/23/2013
• Est. Priority Date: 04/04/2005
• Status: Active Grant

• Current Assignee: Malikie Innovations Limited (Key Patent Innovations Limited)
• Original Assignee: Research In Motion Limited (Blackberry Limited)
• Inventors: ZHU, LIZHONG, QI, YIHONG, CORRIGAN, MICHAEL STEPHEN, BANDURSKA, KRYSTYNA, MAN, YING TONG
• Granted Patent: US 8,594,750 B2
• Time in Patent Office: Days
• US Class Current: 455/575.1
• CPC Class Codes: H04M 1/0202 Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04M 1/6008 in the transmitter circuit
• CPC Class Codes: H04M 1/6016 in the receiver circuit

Abstract

A mobile wireless communications device and associated method of making same includes a housing and circuit board having a ground plane. Radio frequency (RF) circuitry and a processor are carried by the circuit board and operative with each other. An antenna is carried by the housing and operative with the RF circuitry. Audio circuitry is carried by the circuit board and operative with the RF circuitry and processor. An audio transducer assembly such as a receiver is carried by the circuit board and engages audio circuitry for carrying audio signals between the audio circuitry and speaker. A filter is mounted at the speaker for blocking RF energy from the antenna through the speaker to the ground plane and decoupling the antenna from the speaker and any other components on the circuit board to minimize any detuning of antenna impedance match and degradation in antenna gain.

Claims

1-28. -28. (canceled)

29. A mobile wireless communications device comprising:

at least one circuit board having a ground plane;

radio frequency (RF) circuitry carried by said at least one circuit board;

audio circuitry carried by said at least one circuit board;

an audio transducer assembly carried by said at least one circuit board and comprising an audio transducer, a transducer housing for said audio transducer, and at least one electrical contact pad member on said transducer housing and coupled to said audio circuitry; and

at least one filter within said transducer housing and coupled between said audio transducer and said at least one electrical contact pad member.

30. The mobile wireless communications device according to claim 29, further comprising an antenna coupled to said RF circuitry.

31. The mobile wireless communications device according to claim 30, wherein said antenna is carried by said at least one circuit board.

32. The mobile wireless communications device according to claim 29, further comprising a processor coupled to said RF circuitry and said audio circuitry.

33. The mobile wireless communications device according to claim 32, wherein said processor is carried by said at least one circuit board.

34. The mobile wireless communications device according to claim 29, wherein said at least one filter is operative for low DC resistance and high impedance from 500 MHz to 3 GHz.

35. The mobile wireless communications device according to claim 29, wherein said at least one electrical contact pad member comprises at least one resilient contact pad.

36. The mobile wireless communications device according to claim 29, wherein said at least one filter comprises at least one ferrite bead.

37. The mobile wireless communications device according to claim 29, wherein said at least one filter comprises at least one serial coupled inductor.

38. The mobile wireless communications device according to claim 29, wherein said at least one filter comprises at least one or shunt coupled capacitor.

39. A mobile wireless communications device comprising:

at least one circuit board;

radio frequency (RF) circuitry carried by said at least one circuit board;

an antenna coupled to said RF circuitry;

audio circuitry carried by said at least one circuit board;

a processor coupled to said RF circuitry and said audio circuitry;

an audio transducer assembly carried by said at least one circuit board and comprising an audio transducer, a transducer housing for said audio transducer, and at least one electrical contact pad member on said transducer housing and coupled to said audio circuitry; and

at least one filter within said transducer housing and coupled between said audio transducer and said at least one electrical contact pad member.

40. The mobile wireless communications device according to claim 39, wherein said antenna is carried by said at least one circuit board.

41. The mobile wireless communications device according to claim 39, wherein said processor is carried by said at least one circuit board.

42. The mobile wireless communications device according to claim 39, wherein said at least one filter is operative for low DC resistance and high impedance from 500 MHz to 3 GHz.

43. The mobile wireless communications device according to claim 39, wherein said at least one electrical contact pad member comprises at least one resilient contact pad.

44. The mobile wireless communications device according to claim 39, wherein said at least one filter comprises at least one ferrite bead.

45. The mobile wireless communications device according to claim 39, wherein said at least one filter comprises at least one serial coupled inductor.

46. The mobile wireless communications device according to claim 39, wherein said at least one filter comprises at least one or shunt coupled capacitor.

47. A method for making a mobile wireless communications device comprising:

mounting radio frequency (RF) circuitry and audio circuitry on at least one circuit board having a ground plane;

mounting an audio transducer assembly on the at least one circuit board and comprising an audio transducer, a transducer housing for the audio transducer, and at least one electrical contact pad member on the transducer housing and coupled to the audio circuitry; and

mounting at least one filter within the transducer housing and coupled between the audio transducer and the at least one electrical contact pad member.

48. The method according to claim 47, further comprising coupling an antenna the RF circuitry;

and mounting the antenna on the at least one circuit board.

49. The method according to claim 47, further comprising coupling a processor to the RF circuitry and the audio circuitry;

and mounting the processor on the at least one circuit board.

50. The method according to claim 47, wherein the at least one filter is operative for low DC resistance and high impedance from 500 MHz to 3 GHz.

51. The method according to claim 47, wherein the at least one electrical contact pad member comprises at least one resilient contact pad.

52. The method according to claim 47, wherein the at least one filter comprises at least one ferrite bead.

53. The method according to claim 47, wherein the at least one filter comprises at least one serial coupled inductor.

54. The method according to claim 47, wherein the at least one filter comprises at least one or shunt coupled capacitor.