LED SUBSTRATE STRUCTURE, LED UNIT AND LIGHTING MODULE HAVING THE SAME

• US 20130134471A1
• Filed: 07/10/2012
• Published: 05/30/2013
• Est. Priority Date: 11/30/2011
• Status: Active Grant

• Current Assignee: Lite-On Electronics Company Limited (Lite-On Technology Corporation)
• Original Assignee: Lite-On Technology Corporation, Silitek Electronic Company Limited (Lite-On Technology Corporation)
• Inventors: LEE, HOU-TE, YING, TSUNG-KANG, CHU, CHIA-HUNG, YU, SHIH-PO
• Granted Patent: US 8,803,186 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED substrate structure has a substrate and a conducting portion. The substrate has a bottom surface and two opposite first lateral surfaces connected with the bottom surface. The bottom surface has the conducting portion formed thereon, and the conducting portion has a first cutting segment located on a contact border defined between one of the two first lateral surfaces and the bottom surface. The conducting portion further has an expansion region connected with the first cutting segment. The length of the first cutting segment is shorter than any segment taken on the expansion region parallel thereto.

Claims

1. A lighting module, comprising:

a carrier board;

a substrate disposed on the carrier board, having a bottom surface, a mounting surface opposite to the bottom surface, and two opposing first lateral surfaces connected between the bottom surface and the mounting surface,

wherein one of the two first lateral surfaces is defined as a substrate contact surface for establishing contact with the carrier board, the bottom surface has a conducting portion formed thereon, the conducting portion comprises at least one expansion region adjacent to the substrate contact surface and has a first cutting segment formed at a contact boarder defined between the substrate contact surface and the bottom surface, and the length of the first cutting segment is shorter than any segment taken on the expansion region parallel thereto;

at least one light emitting component disposed on the mounting surface; and

a packaging member covering the light emitting component.

2. The lighting module as claimed in claim 1, wherein the bottom surface has two opposite first sides and two opposite second sides, the two first lateral surfaces are respectively connected to the two first sides, and the substrate further has two opposite second lateral surfaces respectively connected to the two second sides.

3. The lighting module as claimed in claim 2, wherein the substrate further has two electrodes, each of the electrodes are formed on the bottom surface, the second lateral surface and the mounting surface, the light emitting component is electrically connected to the electrodes, and the packaging member has an package contact surface to contact the mounting surface.

4. The lighting module as claimed in claim 3, further comprising an interface layer partially covering the electrode and the mounting surface of the substrate, wherein each of the electrodes has a connection portion and a functional portion formed on the mounting surface, the interface layer is disposed between the connection portion and the functional portion, and a flange of the package contact surface of the packaging member is located on the interface layer.

5. The lighting module as claimed in claim 3, wherein each of the two electrodes has a side conducting portion formed on the bottom surface, the side conducting portion has a second cutting segment located on the contact border defined between one of the two first lateral surfaces and the bottom surface, the side conducting portion has a main portion connected with the second cutting segment, and a length of one parallel segment with the second cutting segment on the main portion is longer than the length of the second cutting segment.

6. An LED unit, comprising:

a substrate disposed on the carrier board, having a bottom surface, a mounting surface opposite to the bottom surface, and two opposing first lateral surfaces connected between the bottom surface and the mounting surface,

wherein one of the two first lateral surfaces is defined as a substrate contact surface for establishing contact with the carrier board, the bottom surface has a conducting portion formed thereon, the conducting portion comprises at least one expansion region adjacent to the substrate contact surface and has a first cutting segment formed at a contact boarder defined between the substrate contact surface and the bottom surface, and the length of the first cutting segment is shorter than any segment taken on the expansion region parallel thereto;

at least one light emitting component disposed on the mounting surface; and

a packaging member encapsulating the light emitting component.

7. The LED unit as claimed in claim 6, wherein the bottom surface has two opposite first sides and two opposite second sides, the two first lateral surfaces are respectively connected to the two first sides, and the substrate further has two opposite second lateral surfaces respectively connected to the two second sides.

8. The LED unit as claimed in claim 7, further comprising two electrodes, each of the electrodes are formed on the bottom surface of the substrate, the second lateral surface and the mounting surface, the light emitting component is electrically connected to the electrodes, and the packaging member has an package contact surface to contact the mounting surface.

9. The LED unit as claimed in claim 8, further comprising an interface layer partially covering the electrode and the mounting surface, wherein each of the electrodes has a connection portion and a functional portion formed on the mounting surface, the interface layer is disposed between the connection portion and the functional portion, and a flange of the package contact surface of the packaging member is located on the interface layer.

10. The LED unit as claimed in claim 9, wherein the functional portion is extended from the connection portion, the functional portion has at least one bent portion, the light emitting component disposed on the bent portion.

11. The LED unit as claimed in claim 8, wherein each of the two electrodes has a side conducting portion on the bottom surface, the side conducting portion has a second cutting segment located on the contact border defined between one of the two first lateral surfaces and the bottom surface, the side conducting portion has a main portion connected to the second cutting segment, and a length of one parallel segment with the second cutting segment on the main portion is longer than the length of the second cutting segment.

12. An LED substrate structure comprising

a substrate disposed on the carrier board, having a bottom surface, a mounting surface opposite to the bottom surface, and two opposing first lateral surfaces connected between the bottom surface and the mounting surface,

wherein one of the two first lateral surfaces is defined as a substrate contact surface for establishing contact with the carrier board, the bottom surface has a conducting portion formed thereon, the conducting portion comprises at least one expansion region adjacent to the substrate contact surface and has a first cutting segment formed at a contact boarder defined between the substrate contact surface and the bottom surface, and the length of the first cutting segment is shorter than any segment taken on the expansion region parallel thereto.

13. The LED substrate structure as claimed in claim 12, wherein the bottom surface has two opposite first sides and two opposite second sides, the two first lateral surfaces are respectively connected to the two first sides.

14. The LED substrate structure as claimed in claim 13, further comprising two opposite second lateral surfaces respectively connected to two second sides and a mounting surface opposite to the bottom surface.

15. The LED substrate structure as claimed in claim 14, further comprising two electrodes, each of the electrodes are formed on the bottom surface, the second lateral surface and the mounting surface.

16. The LED substrate as claimed in claim 15, further comprising an interface layer partially covering the electrode and the mounting surface, wherein each of the electrodes has a connection portion and a functional portion formed on the mounting surface, and the interface layer is disposed between the connection portion and the functional portion.

17. The LED substrate structure as claimed in claim 15, wherein each of the electrodes has a connection portion and a functional portion formed on the mounting surface, the functional portion is extended from the connection portion, and the functional portion has at least one bent portion.

18. The LED substrate structure as claimed in claim 15, wherein each of the electrodes has a side conducting portion on the bottom surface, the side conducting portion has a second cutting segment located on the contact border defined between one of the two first lateral surfaces and the bottom surface, the side conducting portion has a main portion connected with the second cutting segment, and a length of one parallel segment with the second cutting segment on the main portion is longer than the length of the second cutting segment.

19. The LED substrate structure as claimed in claim 13, wherein the length of one parallel segment with the first cutting segment on the expansion region is ranged from one third to one fifth of the length of the first side, and the length of the first cutting segment ranges from one half to one third of the length of one parallel segment with the first cutting segment on the expansion region.

20. The LED substrate structure as claimed in claim 13, wherein the conducting portion has a main region in connection with the expansion region, and the length of a longest parallel segment with the first cutting segment on the expansion region is greater than or equal to a length of one parallel segment with the first cutting segment on the main region.