Curable Organopolysiloxane Composition And Optical Semiconductor Device
First Claim
1. A curable organopolysiloxane composition comprising at least the following components:
- (A) an alkenyl-containing organopolysiloxane that comprises 15 to 35 wt. % of constituent (A-1) and 65 to 85 wt. % of constituent (A-2), whereinconstituent (A-1) comprises an organopolysiloxane of the following average compositional formula;
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d where R1 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;
0.4 to 50 mole % of all R1 groups are alkenyl groups having 2 to 10 carbon atoms;
methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R1;
“
a”
, “
b”
, “
c”
, and “
d”
are numbers that satisfy the following conditions;
0≦
a≦
0.05;
0.9≦
b≦
1;
0≦
c≦
0.03;
0≦
d≦
0.03; and
a+b+c+d=1;
constituent (A-2) comprises an organopolysiloxane of the following average compositional formula;
(R23SiO1/2)e(R22SiO2/2)f(R2SiO3/2)g(SiO4/2)h(HO1/2)i where R2 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;
5 to 10 mole % of all R2 groups are alkenyl groups having 2 to 10 carbon atoms;
methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R2;
“
e”
, “
f”
, “
g”
, “
h” and
“
i”
are numbers that satisfy the following conditions;
0.4≦
e≦
0.6;
0≦
f≦
0.05;
0≦
g≦
0.05;
0.4≦
h≦
0.6;
0.01≦
i≦
0.05; and
e+f+g+h=1;
(B) an organopolysiloxane that contains silicon-bonded hydrogen atom and comprises 10 to 50 wt. % of constituent (B-1), 50 to 90 wt. % of constituent (B-2), and 0 to 30 wt. % of constituent (B-3);
in an amount that the silicon-bonded hydrogen atoms in component (B) are in the range of 0.5 to 2.0 moles per 1 mole of the total content of alkenyl groups in component (A), whereinconstituent (B-1) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average molecular formula;
R33SiO(R32SiO)j(R3HSiO)kSiR33 where R3 designates phenyl groups or methyl groups;
methyl groups constitute 90 mole % or more of all groups contained in R3;
“
j”
is a number in the range of 0 to 35; and
“
k”
is a number in the range of 5 to 100;
constituent (B-2) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average compositional formula;
(HR42SiO1/2)l(R43SiO1/2)m(R42SiO2/2)n(R4SiO3/2)o(SiO4/2)p(R5O1/2)q where R4 designates phenyl groups or methyl groups;
methyl groups constitute 90 mole % or more of all groups contained in R4;
R5 designates hydrogen atoms or alkyl groups having 1 to 10 carbon atoms; and
“
1”
, “
m”
, “
n”
, “
o”
, “
p” and
“
q”
are numbers that satisfy the following conditions;
0.4≦
l≦
0.7;
0≦
m≦
0.2;
0≦
n≦
0.05;
0≦
o≦
0.5;
0.3≦
p≦
0.6;
0≦
q≦
0.05; and
l+m+n+o+p=1;
constituent (B-3) is an organopolysiloxane represented by the following average molecular formula;
HR62SiO(R62SiO)rSiR62Hwhere R6 represents phenyl or methyl groups;
methyl groups constitute at least 90% of all groups contained in R6; and
“
r”
is a number in the range of 10 to 100; and
(C) a hydrosilylation-reaction catalyst, in an amount sufficient for curing the composition.
1 Assignment
0 Petitions
Accused Products
Abstract
A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.
-
Citations
18 Claims
-
1. A curable organopolysiloxane composition comprising at least the following components:
-
(A) an alkenyl-containing organopolysiloxane that comprises 15 to 35 wt. % of constituent (A-1) and 65 to 85 wt. % of constituent (A-2), wherein constituent (A-1) comprises an organopolysiloxane of the following average compositional formula;
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)dwhere R1 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;
0.4 to 50 mole % of all R1 groups are alkenyl groups having 2 to 10 carbon atoms;
methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R1;
“
a”
, “
b”
, “
c”
, and “
d”
are numbers that satisfy the following conditions;
0≦
a≦
0.05;
0.9≦
b≦
1;
0≦
c≦
0.03;
0≦
d≦
0.03; and
a+b+c+d=1;constituent (A-2) comprises an organopolysiloxane of the following average compositional formula;
(R23SiO1/2)e(R22SiO2/2)f(R2SiO3/2)g(SiO4/2)h(HO1/2)iwhere R2 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;
5 to 10 mole % of all R2 groups are alkenyl groups having 2 to 10 carbon atoms;
methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R2;
“
e”
, “
f”
, “
g”
, “
h” and
“
i”
are numbers that satisfy the following conditions;
0.4≦
e≦
0.6;
0≦
f≦
0.05;
0≦
g≦
0.05;
0.4≦
h≦
0.6;
0.01≦
i≦
0.05; and
e+f+g+h=1;(B) an organopolysiloxane that contains silicon-bonded hydrogen atom and comprises 10 to 50 wt. % of constituent (B-1), 50 to 90 wt. % of constituent (B-2), and 0 to 30 wt. % of constituent (B-3);
in an amount that the silicon-bonded hydrogen atoms in component (B) are in the range of 0.5 to 2.0 moles per 1 mole of the total content of alkenyl groups in component (A), whereinconstituent (B-1) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average molecular formula;
R33SiO(R32SiO)j(R3HSiO)kSiR33where R3 designates phenyl groups or methyl groups;
methyl groups constitute 90 mole % or more of all groups contained in R3;
“
j”
is a number in the range of 0 to 35; and
“
k”
is a number in the range of 5 to 100;constituent (B-2) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average compositional formula;
(HR42SiO1/2)l(R43SiO1/2)m(R42SiO2/2)n(R4SiO3/2)o(SiO4/2)p(R5O1/2)qwhere R4 designates phenyl groups or methyl groups;
methyl groups constitute 90 mole % or more of all groups contained in R4;
R5 designates hydrogen atoms or alkyl groups having 1 to 10 carbon atoms; and
“
1”
, “
m”
, “
n”
, “
o”
, “
p” and
“
q”
are numbers that satisfy the following conditions;
0.4≦
l≦
0.7;
0≦
m≦
0.2;
0≦
n≦
0.05;
0≦
o≦
0.5;
0.3≦
p≦
0.6;
0≦
q≦
0.05; and
l+m+n+o+p=1;constituent (B-3) is an organopolysiloxane represented by the following average molecular formula;
HR62SiO(R62SiO)rSiR62Hwhere R6 represents phenyl or methyl groups;
methyl groups constitute at least 90% of all groups contained in R6; and
“
r”
is a number in the range of 10 to 100; and(C) a hydrosilylation-reaction catalyst, in an amount sufficient for curing the composition. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A curable organopolysiloxane composition comprising at least the following components:
-
(A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) and constituent (A-2), wherein constituent (A-1) comprises an organopolysiloxane of the following average compositional formula;
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)dwhere R1 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;
0.4 to 50 mole % of all R1 groups are alkenyl groups having 2 to 10 carbon atoms;
methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R1;
“
a”
, “
b”
, “
c”
, and “
d”
are numbers that satisfy the following conditions;
0≦
a≦
0.05;
0.9≦
b≦
1;
0≦
c≦
0.03;
0≦
d≦
0.03; and
a+b+c+d=1;constituent (A-2) comprises an organopolysiloxane of the following average compositional formula;
(R23SiO1/2)e(R22SiO2/2)f(R2SiO3/2)g(SiO4/2)h(HO1/2)iwhere R2 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;
5 to 10 mole % of all R2 groups are alkenyl groups having 2 to 10 carbon atoms;
methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R2;
“
e”
, “
f”
, “
g”
, “
h” and
“
i”
are numbers that satisfy the following conditions;
0.4≦
e≦
0.6;
0≦
f≦
0.05;
0≦
g≦
0.05;
0.4≦
h≦
0.6;
0.01≦
i≦
0.05; and
e+f+g+h=1;(B) an organopolysiloxane that contains silicon-bonded hydrogen atom and comprises constituent (B-1) and constituent (B-2);
in an amount that the silicon-bonded hydrogen atoms in component (B) are in the range of 0.5 to 2.0 moles per 1 mole of the total content of alkenyl groups in component (A), whereinconstituent (B-1) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average molecular formula;
R33SiO(R32SiO)j(R3HSiO)kSiR33where R3 designates phenyl groups or methyl groups;
methyl groups constitute 90 mole % or more of all groups contained in R3;
“
j”
is a number in the range of 0 to 35; and
“
k”
is a number in the range of 5 to 100;constituent (B-2) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average compositional formula;
(HR42SiO1/2)l(R43SiO1/2)m(R42SiO2/2)n(R4SiO3/2)o(SiO4/2)p(R5O1/2)qwhere R4 designates phenyl groups or methyl groups;
methyl groups constitute 90 mole % or more of all groups contained in R4;
R5 designates hydrogen atoms or alkyl groups having 1 to 10 carbon atoms; and
“
1”
, “
m”
, “
n”
, “
o”
, “
p” and
“
q”
are numbers that satisfy the following conditions;
0.4≦
l≦
0.7;
0≦
m≦
0.2;
0≦
n≦
0.05;
0≦
o≦
0.5;
0.3≦
p≦
0.6;
0≦
q≦
0.05; and
l+m+n+o+p=1; and(C) a hydrosilylation-reaction catalyst, in an amount sufficient for curing the composition. - View Dependent Claims (17, 18)
-
Specification