HEAT RADIATING STRUCTURE IN ALL-IN-ONE COMPUTERS
First Claim
1. A heat radiating structure in all-in-one computers, comprising a pedestal, a mainframe module and a back cover, wherein:
- a containing trough is fabricated in the front of the pedestal for a display module to be placed in, and a containing stand is placed in the rear of the pedestal;
there is a containing cell with one of its openings connecting outwards inside the containing stand, and multiple heat dispersing holes pass through the rear of the containing stand;
the mainframe module consists of a base and a motherboard, and a containing space is formed in the front of the base to contain the motherboard;
a heat radiating aluminium plate filled with multiple heat radiating holes is installed to the rear of the containing space, and a back plate is installed at the bottom of the containing space and includes multiple through holes and multiple through grooves arranged in the rear of the multiple through holes;
there are a CPU and a H-shaped radiator, whose front and rear surfaces are respectively nestled against the CPU and heat radiating aluminium plate, installed at the center of the motherboard'"'"' surface close to the heat radiating aluminium plate;
the motherboard is equipped with a display chip and a memory respectively on left and right sides of the CPU;
multiple connection ports are installed at the bottom of the motherboard to match the multiple through holes on the back plate, and a fixing bracket is arranged to the rear of the multiple connection ports and fastened into the multiple through grooves of the back plate to place a hard disk drive, in which the hard disk drive is close to the heat radiating aluminium plate;
the H-shaped radiator, multiple connection ports and the hard disk drive are arranged to face the multiple heat radiating holes on the heat radiating aluminium plate;
the back cover covers the back of the pedestal and contains multiple hollowed grooves connecting from inside to the outside for air convection.
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Accused Products
Abstract
The present invention relates to a heat radiating structure in all-in-one computers, comprising a pedestal, mainframe module and back cover. The mainframe module is contained in a containing stand behind the pedestal, and a motherboard is included in the containing space in front of a mainframe module base. The motherboard'"'"'s CPU sticks through a radiator to a heat radiating aluminum plate in the rear of the containing space, while the hard disk drive is close to the heat radiating aluminum plate, and the pedestal is covered by the back cover on the back. With the heat radiating aluminum plate to quickly conduct heat and its multiple heat radiating holes, heat dispersing holes behind the containing stand and hollowed grooves on the back cover to convect hot air.
21 Citations
7 Claims
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1. A heat radiating structure in all-in-one computers, comprising a pedestal, a mainframe module and a back cover, wherein:
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a containing trough is fabricated in the front of the pedestal for a display module to be placed in, and a containing stand is placed in the rear of the pedestal;
there is a containing cell with one of its openings connecting outwards inside the containing stand, and multiple heat dispersing holes pass through the rear of the containing stand;the mainframe module consists of a base and a motherboard, and a containing space is formed in the front of the base to contain the motherboard;
a heat radiating aluminium plate filled with multiple heat radiating holes is installed to the rear of the containing space, and a back plate is installed at the bottom of the containing space and includes multiple through holes and multiple through grooves arranged in the rear of the multiple through holes;
there are a CPU and a H-shaped radiator, whose front and rear surfaces are respectively nestled against the CPU and heat radiating aluminium plate, installed at the center of the motherboard'"'"' surface close to the heat radiating aluminium plate;
the motherboard is equipped with a display chip and a memory respectively on left and right sides of the CPU;
multiple connection ports are installed at the bottom of the motherboard to match the multiple through holes on the back plate, and a fixing bracket is arranged to the rear of the multiple connection ports and fastened into the multiple through grooves of the back plate to place a hard disk drive, in which the hard disk drive is close to the heat radiating aluminium plate;
the H-shaped radiator, multiple connection ports and the hard disk drive are arranged to face the multiple heat radiating holes on the heat radiating aluminium plate;the back cover covers the back of the pedestal and contains multiple hollowed grooves connecting from inside to the outside for air convection. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification