LIGHT EMITTING DIODE FOR AUTOMOTIVE LAMP

• US 20130135882A1
• Filed: 11/26/2012
• Published: 05/30/2013
• Est. Priority Date: 11/25/2011
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: CHOI, Ki Won
• Application Number:
  US13/685,309
• Publication Number:
  US 20130135882A1
• Time in Patent Office: Days
• US Class Current: 362/487
• CPC Class Codes: B60Q 1/2696 Mounting of devices using LEDs
• CPC Class Codes: F21S 41/151 arranged in one or more lines
• CPC Class Codes: F21S 41/19 Attachment of light sources or lamp holders achieving variable light distribution by movable light sources F21S41/657
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 43/19 Attachment of light sources or lamp holders
• CPC Class Codes: F21S 45/47 Passive cooling, e.g. using fins, thermal conductive elements or openings

Abstract

A light emitting diode (LED) module for an automotive lamp includes a plurality of supporting rods, a plurality of heat sinks, a circuit board and a plurality of LEDs. The supporting rods are connected to a bottom surface of a lamp housing having a predesigned shape. The heat sinks are respectively connected to an upper end of the supporting rods. The heat sinks are standardized to have at least one size. The circuit board is disposed on an upper surface of the plurality of heat sinks, to be bent according to an arrangement of the heat sinks. The LEDs are disposed on an area where the heat sinks are disposed, on the circuit board.

Claims

1. A light emitting diode (LED) module for an automotive lamp, the LED module comprising:

a plurality of supporting rods connected to a bottom surface of a lamp housing having a predesigned shape;

a plurality of heat sinks respectively connected to an upper end of the plurality of supporting rods, the plurality of heat sinks being standardized to have at least one size;

a circuit board, disposed on an upper surface of the plurality of heat sinks, to be bent according to an arrangement of the plurality of heat sinks; and

a plurality of LEDs disposed in an area where the plurality of heat sinks is disposed, on the circuit board.

2. The LED module of claim 1, wherein:

the plurality of supporting rods has different heights, and

the plurality of supporting rods is connected to each other within the lamp housing, in order of height, to have a stepped arrangement.

3. The LED module of claim 1, wherein the plurality of supporting rods is standardized to have a single size.

4. The LED module of claim 1, wherein the plurality of supporting rods is connected onto a supporting plate disposed on the bottom surface of the lamp housing.

5. The LED module of claim 1, wherein each of the plurality of heat sinks comprises a receiving recess, formed in a direction from a lower surface to an upper surface, to receive a corresponding one of the plurality of supporting rods.

6. The LED module of claim 1, wherein each of the plurality of heat sinks comprises:

a first receiving recess formed in a direction from a lower surface to an upper surface; and

a second receiving recess formed on a side wall of the first recess.

7. The LED module of claim 6, wherein each of the plurality of supporting rods comprises a projection to be received in the second receiving recess of a corresponding one of the plurality of heat sinks when each supporting rod is received in the first receiving recess of the corresponding heat sink.

8. The LED module of claim 1, wherein each of the plurality of supporting rods comprises:

a first receiving recess to receive a corresponding one of the plurality of heat sinks; and

a projection formed on a side wall of the first receiving recess.

9. The LED module of claim 8, each of the plurality of heat sinks comprises:

a second receiving recess, formed on an external side surface of each of the plurality of heat sinks, to receive the projection of a corresponding one of the plurality of supporting rods when each of the plurality of heat sinks is received in the first receiving recess of the corresponding supporting rod.

10. The LED module of claim 1, wherein each of the plurality of heat sinks has a shape selected from one of a cylindrical shape, a polyprismatic shape, and an elliptic cylindrical shape.

11. The LED module of claim 1, further comprising:

a drive module disposed on an external side surface of a supporting structure connected to an upper end of one of the plurality of supporting rods.

12. A light emitting diode (LED) module for an automotive lamp, the LED module comprising:

a plurality of supporting rods disposed on a bottom surface of a lamp housing having a predesigned shape, each of the plurality of supporting rods having a height selected from a plurality of standardized heights;

a plurality of heat sinks respectively disposed on an upper end of the plurality of supporting rods, each of the plurality of heat sinks having a size selected from a plurality of standardized sizes;

a circuit board disposed on an upper surface of the plurality of heat sinks; and

a plurality of LEDs disposed in an area where the plurality of heat sinks is disposed, on the circuit board.

13. The LED module of claim 12, wherein the circuit board is bent according to an arrangement of the plurality of heat sinks.

14. The LED module of claim 12, wherein:

the plurality of supporting rods has different heights, and

the plurality of supporting rods is connected to each other within the lamp housing, in order of height, to have a stepped arrangement.

15. The LED module of claim 12, wherein the plurality of supporting rods has a single size.

16. The LED module of claim 12, wherein the plurality of supporting rods is is connected onto a supporting plate disposed on the bottom surface of the lamp housing.