METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• US 20130137255A1
• Filed: 11/20/2012
• Published: 05/30/2013
• Est. Priority Date: 11/25/2011
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd., Sony Corporation (Sony Group Corp.)
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: YAMADE, Naoto, KOEZUKA, Junichi, SUZUKI, Miki, SATO, Yuichi
• Granted Patent: US 8,951,899 B2
• Time in Patent Office: Days
• US Class Current: 438/530
• CPC Class Codes: H01L 21/265 producing ion implantation
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 29/66742 Thin film unipolar transistors
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

To provide a semiconductor device including an oxide semiconductor which is capable of having stable electric characteristics and achieving high reliability, by a dehydration or dehydrogenation treatment performed on a base insulating layer provided in contact with an oxide semiconductor layer, the water and hydrogen contents of the base insulating layer can be decreased, and by an oxygen doping treatment subsequently performed, oxygen which can be eliminated together with the water and hydrogen is supplied to the base insulating layer. By formation of the oxide semiconductor layer in contact with the base insulating layer whose water and hydrogen contents are decreased and whose oxygen content is increased, oxygen can be supplied to the oxide semiconductor layer while entry of the water and hydrogen into the oxide semiconductor layer is suppressed.

Claims

1. A method for manufacturing a semiconductor device comprising the steps of:

forming a base insulating layer over an insulating surface;

performing a first heat treatment after forming the base insulating layer;

performing an oxygen doping treatment by at least one of an ion implantation method, an ion doping method, and a plasma immersion ion implantation method after the first heat treatment;

forming an oxide semiconductor layer over the base insulating layer after the oxygen doping treatment;

forming a gate insulating layer over the oxide semiconductor layer; and

forming a gate electrode layer over the gate insulating layer.

2. The method for manufacturing the semiconductor device according to claim 1, wherein the base insulating layer is formed by a plasma-enhanced chemical vapor deposition method.

3. The method for manufacturing the semiconductor device, according to claim 1, wherein the oxygen doping treatment is performed by using a linear ion beam.

4. The method for manufacturing the semiconductor device according to claim 1, wherein water contained in the base insulating layer is removed by performing the first heat treatment.

5. The method for manufacturing the semiconductor device according to claim 1, wherein hydrogen contained in the base insulating layer is removed by performing the first heat treatment.

6. The method for manufacturing the semiconductor device according to claim 1, wherein oxygen is supplied to the base insulating layer by performing the oxygen doping treatment.

7. The method for manufacturing the semiconductor device according to claim 1, further comprising the step of:

performing a second heat treatment after forming the oxide semiconductor layer.

8. The method for manufacturing the semiconductor device according to claim 7, wherein oxygen is supplied to the oxide semiconductor layer from the base insulating layer by the second heat treatment.

9. A method for manufacturing a semiconductor device comprising the steps of:

forming a base insulating layer over an insulating surface;

performing a first oxygen doping treatment by at least one of an ion implantation method, an ion doping method, and a plasma immersion ion implantation method after forming the base insulating layer;

performing a first heat treatment after performing the first oxygen doping treatment;

performing a second oxygen doping treatment after performing the first heat treatment;

forming an oxide semiconductor layer over the base insulating layer;

forming a gate insulating layer over the oxide semiconductor layer; and

forming a gate electrode layer over the gate insulating layer.

10. The method for manufacturing the semiconductor device according to claim 9, wherein the base insulating layer is formed by a plasma-enhanced chemical vapor deposition method.

11. The method for manufacturing the semiconductor device, according to claim 9, wherein the first oxygen doping treatment is performed by using a linear ion beam.

12. The method for manufacturing the semiconductor device according to claim 9, wherein water contained in the base insulating layer is removed by performing the first heat treatment.

13. The method for manufacturing the semiconductor device according to claim 9, wherein hydrogen contained in the base insulating layer is removed by performing the first heat treatment.

14. The method for manufacturing the semiconductor device according to claim 9, wherein oxygen is supplied to the base insulating layer by performing at least one of the first oxygen doping treatment and the second oxygen doping treatment.

15. The method for manufacturing the semiconductor device according to claim 9, further comprising the step of:

performing a second heat treatment after forming the oxide semiconductor layer.

16. The method for manufacturing the semiconductor device according to claim 15, wherein oxygen is supplied to the oxide semiconductor layer from the base insulating layer by the second heat treatment.

17. The method for manufacturing the semiconductor device, according to claim 9, wherein the second oxygen doping treatment is performed by at least one of the ion implantation method, the ion doping method, and the plasma immersion ion implantation method.

18. The method for manufacturing the semiconductor device, according to claim 17, wherein the second oxygen doping treatment is performed by using a linear ion beam.

19. A method for manufacturing a semiconductor device comprising the steps of:

forming a base insulating layer over an insulating surface;

performing a heat treatment after forming the base insulating layer;

performing an oxygen doping treatment to introduce an oxygen ion into the base insulating layer by at least one of an ion implantation method, an ion doping method, and a plasma immersion ion implantation method after the heat treatment;

forming an oxide semiconductor layer over the base insulating layer after the oxygen doping treatment;

forming a gate insulating layer over the oxide semiconductor layer; and

forming a gate electrode layer over the gate insulating layer.

20. The method for manufacturing the semiconductor device, according to claim 19, wherein the oxygen ion comprises at least one of a molecular ion and a cluster ion.