MICROELECTROMECHANICAL SYSTEMS (MEMS) RESONATORS AND RELATED APPARATUS AND METHODS
First Claim
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1. A capped microelectromechanical systems (MEMS) resonator, comprising:
- a piezoelectric microelectromechanical systems (MEMS) resonating structure formed on a first wafer; and
a cap wafer capping the piezoelectric MEMS resonating structure, wherein the cap wafer comprises no integrated circuitry.
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Accused Products
Abstract
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
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Citations
19 Claims
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1. A capped microelectromechanical systems (MEMS) resonator, comprising:
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a piezoelectric microelectromechanical systems (MEMS) resonating structure formed on a first wafer; and a cap wafer capping the piezoelectric MEMS resonating structure, wherein the cap wafer comprises no integrated circuitry. - View Dependent Claims (2, 3, 4, 5)
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6. A capped microelectromechanical systems (MEMS) resonator, comprising:
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a piezoelectric microelectromechanical systems (MEMS) resonating structure formed on a first wafer, the piezoelectric MEMS resonating structure comprising a resonating body including a piezoelectric material active layer and a layer of silicon; and a cap wafer capping the piezoelectric MEMS resonating structure, wherein the cap wafer comprises no integrated circuitry. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification