Semiconductor Device Assembly Utilizing a DBC Substrate
2 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive shunt. Plural packages may be formed in a DBC card and may be separated individually or in clusters. The individual packages are mounted in various arrays on a support DBC board and heat sink. Integrated circuits may be mounted on the assembly and connected to the die for control of the die conduction.
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Citations
88 Claims
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1-57. -57. (canceled)
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58-68. -68. (canceled)
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69. An assembly comprising:
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first and second semiconductor devices, each of said first and second semiconductor devices comprising; first and second conductive layers insulated from one another, said first conductive layer having a depression therein and a rim at least partially surrounding a bottom surface of said depression; a semiconductor die situated in said depression and having an electrode electrically connected to said bottom surface of said depression; a support substrate including a patterned conductive layer electrically connecting said first semiconductor device and said second semiconductor device, said first and second semiconductor devices each being electrically and mechanically connected to said patterned conductive layer. - View Dependent Claims (70, 71, 72, 73, 74, 75, 76, 77, 78)
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79. An assembly comprising:
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a semiconductor device including first and second conductive layers insulated from one another, said first conductive layer having a depression therein and a rim at least partially surrounding a bottom surface of said depression; a semiconductor die of said semiconductor device situated in said depression and having an electrode electrically connected to said bottom surface of said depression; a support substrate including a patterned conductive layer electrically and mechanically connected to said semiconductor device; an integrated circuit (IC) electrically and mechanically connected to said second conductive layer of said semiconductor device. - View Dependent Claims (80, 81, 82, 83, 84, 85, 86, 87, 88)
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Specification