Stacked Physically Uncloneable Function Sense and Respond Module
First Claim
1. A microelectronic module for the generation and secure storage of a private encryption key comprising:
- a first physically uncloneable function IC layer having a first active surface comprising at least one random semiconductor fabrication process-induced variation between a plurality of neutral-skewed cells to define a first fingerprint value,a second physically uncloneable function IC layer having a second active surface comprising at least one random semiconductor fabrication process-induced variation between a plurality of neutral-skewed cells to define a second fingerprint value,the first and second layers bonded to form a three-dimensional microelectronic module wherein at least one I/O of the first IC layer is electrically coupled to at least on I/O of the second IC layer, and,circuit means for generating and storing a private encryption key using the first and second fingerprint values and using at least one neutral-skewed memory cell value derived from at least one of the first or second layers.
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Accused Products
Abstract
A physically uncloneable function (PUF) sense and response module fabricated from a stack of integrated circuit chip layers. At least one of the PUF chips in the stack has a unique identifier resulting from random effects of fabrication processes. The PUF chip generates the fingerprint at power-on resulting that in turn is used to generate a private key. The private key generates a public key used to communicate with the outside world. The encrypted data from the outside world is decrypted with the private key. The public key is stored for comparison with pubic keys generated at subsequent power-up operations. If the key changes, tampering is indicated and a predetermined tamper response event is generated such as the erasing of the contents of a memory.
121 Citations
18 Claims
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1. A microelectronic module for the generation and secure storage of a private encryption key comprising:
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a first physically uncloneable function IC layer having a first active surface comprising at least one random semiconductor fabrication process-induced variation between a plurality of neutral-skewed cells to define a first fingerprint value, a second physically uncloneable function IC layer having a second active surface comprising at least one random semiconductor fabrication process-induced variation between a plurality of neutral-skewed cells to define a second fingerprint value, the first and second layers bonded to form a three-dimensional microelectronic module wherein at least one I/O of the first IC layer is electrically coupled to at least on I/O of the second IC layer, and, circuit means for generating and storing a private encryption key using the first and second fingerprint values and using at least one neutral-skewed memory cell value derived from at least one of the first or second layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification