REMOTE OPERATION DEVICE

• US 20130141267A1
• Filed: 01/03/2012
• Published: 06/06/2013
• Est. Priority Date: 01/12/2011
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Shozo Horisawa
• Inventors: HORISAWA, Shozo
• Application Number:
  US13/342,662
• Publication Number:
  US 20130141267A1
• Time in Patent Office: Days
• US Class Current: 341/176
• CPC Class Codes: G08C 17/02 using a radio link
• CPC Class Codes: H01Q 1/22 by structural association with other equipment or articles
• CPC Class Codes: H04N 21/422 Input-only peripherals , i.e. input devices connected to specially adapted client devices, e.g. global positioning system [GPS] input devices also receiving signals from specially adapted client devices H04N21/4104
• CPC Class Codes: H04N 21/42221 Transmission circuitry, e.g. infrared [IR] or radio frequency [RF]

Abstract

A remote operation device includes a main board housed in a casing of the remote operation device, a wireless communication module disposed on a first surface of the main board and including an antenna, a control circuit disposed on the first surface of the main board and performing a remote operation process through wireless communication, at least one ground pattern disposed on a second surface of the main board, and a matrix circuit of remote operation keys disposed on the second surface of the main board.

Claims

1. A remote operation device comprising:

a main board housed in a casing of the remote operation device;

a wireless communication module disposed on a first surface of the main board, the wireless communication module including an antenna;

a control circuit disposed on the first surface of the main board, the control circuit performing a remote operation process through wireless communication;

at least one ground pattern disposed on a second surface of the main board; and

a matrix circuit of remote operation keys disposed on the second surface of the main board.

2. The remote operation device according to claim 1, further comprising a contactless communication module disposed on the first surface of the main board, the contactless communication module including an antenna.

3. The remote operation device according to claim 1,

wherein the antenna of the wireless communication module includes a balanced or unbalanced antenna made of at least one pattern formed on the first surface of the main board.

4. The remote operation device according to claim 1,

wherein the antenna of the wireless communication module is a diversity antenna including two dipole antenna elements made of patterns formed on the first surface of the main board.

5. The remote operation device according to claim 1,

wherein the control circuit performs both the remote operation process and a process of an upper protocol layer during the wireless communication conducted by the wireless communication module including the antenna.

6. The remote operation device according to claim 1,

wherein the ground pattern disposed on the second surface of the main board is limited to a ground pattern for a high frequency circuit portion of the wireless communication module.

7. The remote operation device according to claim 1,

wherein the main board includes, on the second surface, a solder resist layer and carbon electrode patterns for switches of the remote operation keys, and

wherein the solder resist layer is formed on the second surface of the main body on which the ground pattern and the matrix circuit of the remote operation keys are formed, and the carbon electrode patterns are formed on the solder resist layer.