INTERNAL FRAME OPTIMIZED FOR STIFFNESS AND HEAT TRANSFER

• US 20130141870A1
• Filed: 01/31/2013
• Published: 06/06/2013
• Est. Priority Date: 08/19/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Rothkopf, Fletcher R., Hobson, Phillip M., Mittleman, Adam, Shedletsky, Anna-Katrina
• Granted Patent: US 9,049,801 B2
• Time in Patent Office: Days
• US Class Current: 361/707
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1658 related to the mounting of internal components, e.g. disc drive or any other functional module
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04M 1/0266 for a display module assembly
• CPC Class Codes: H04M 1/0274 for an electrical connector module
• CPC Class Codes: H04M 1/185 Improving the rigidity of the casing or resistance to shocks
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.

Claims

1. A structural component for an electronic device, comprising:

a first layer formed from a first material, the first material configured to add structural stiffness to the electronic device;

a second layer and a third layer disposed on opposing surfaces of the first layer, wherein the second and third layers are formed from materials having a thermal conductivity greater than the first layer;

at least one opening in the first layer; and

a bridge structure disposed within the at least one opening and thermally coupled to the second and third layers, wherein the bridge structure allows heat to transfer between the second layer and the third layer.

2. The structural component as recited in claim 1, wherein the first layer is formed from a first metal and the second and third layers are formed from a second metal.

3. The structural component as recited in claim 2, wherein the first metal is steel and the second metal is copper.

4. The structural component as recited in claim 2, wherein the first, second and third layers are joined via a cladding process.

5. The structural component as recited in claim 4, wherein the bridge structure is formed by extruding portions of the second and third layers into the at least one opening in the first layer during the cladding process.

6. The structural component as recited in claim 1, wherein the bridge structure comprises a layer of thermally conductive solder.

7. The structural component as recited in claim 1, wherein the bridge structure comprises a layer of thermally conductive tape.

8. The structural component as recited in claim 1, wherein the bridge structure is aligned with a heat generating component thermally coupled to the first outer layer.

9. A portable electronic device, comprising:

a housing forming an external surface for the electronic device and including an opening;

a display disposed within the opening in the housing;

an internal frame coupled to one or more interior surfaces of the housing, the internal frame further comprising;

a middle layer formed from a first material, the first material configured to add structural stiffness to the electronic device, and

a first outer layer and a second outer layer, the first and second outer layers disposed on opposing surfaces of the middle layer, wherein the first and second outer layers are formed from materials configured to efficiently conduct heat; and

at least one electronic component disposed within the housing and thermally coupled to the internal frame, wherein the first and second outer layers spread and transfer heat generated by the at least one component to the housing.

10. The portable electronic device as recited in claim 9, wherein the first and second outer layers are formed from materials having a thermal conductivity greater than the first material used to form the middle layer.

11. The portable electronic device as recited in claim 10, wherein the first and second outer layers are formed from a material having a thermal conductivity at least 10 times greater than the thermal conductivity of the first metal.

12. The portable electronic device as recited in claim 10, further comprising:

at least one aperture in the middle layer; and

a thermally conductive filler disposed within the at least one aperture and thermally coupled to the first and second outer layers, wherein the thermally conductive filler allows heat to transfer between the first outer layer and the second outer layer.

13. The portable electronic device as recited in claim 12, wherein the thermally conductive filler is a layer of thermally conductive tape.

14. The portable electronic device as recited in claim 12, wherein the thermally conductive filler is made from thermally conductive solder.

15. The portable electronic device as recited in claim 12, wherein the at least one electronic component is coupled to the internal frame proximate to the thermally conductive filler, the thermally conductive filler allowing heat generated by the at least one electronic component to transfer between the first and second outer layers.

16. The portable electronic device as recited in claim 15, wherein the at least one electronic component is thermally coupled to the internal frame by a thermally conductive adhesive.

17. The portable electronic device as recited in claim 15, further comprising a raised thermal connector coupled to the internal frame and the at least one electronic component, wherein the thermal connector transfers heat from the at least one electronic component to the internal frame.

18. The portable electronic device as recited in claim 15, wherein a combined thickness of the first and second outer layers is approximately equal to a thickness of the middle layer.

19. The portable electronic device as recited in claim 18, wherein the first metal is steel and the first and second outer layers are copper.

20. The portable electronic device as recited in claim 19, wherein the middle layer and first and second outer layers are joined using a cladding process.