×

ELECTRONIC PACKAGE STRUCTURE

  • US 20130141886A1
  • Filed: 01/31/2013
  • Published: 06/06/2013
  • Est. Priority Date: 02/18/2008
  • Status: Active Grant
First Claim
Patent Images

1. An electronic package, comprising:

  • a substrate;

    a coil having a first end and a second end;

    a magnetic body encapsulating the coil and positioned over the substrate;

    a first lead, comprising a first top end electrically connected to the first end of the coil and a first bottom end electrically connected to the substrate; and

    a second lead, comprising a second top end electrically connected to the second end of the coil and a second bottom end electrically connected to the substrate;

    wherein each of the first top end and the second top end is at least partially embedded inside the magnetic body; and

    the joined point of the first top end and the first end of the coil and the joined point of the second top end and the second end of the coil are inside the magnetic body.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×