ELECTRONIC PACKAGE STRUCTURE

• US 20130141886A1
• Filed: 01/31/2013
• Published: 06/06/2013
• Est. Priority Date: 02/18/2008
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: CHEN, DA-JUNG, WEN, CHAU-CHUN, LIU, CHUN-TIAO
• Granted Patent: US 8,837,168 B2
• Time in Patent Office: Days
• US Class Current: 361/782
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 2201/10515 : Stacked components
• CPC Class Codes: H05K 2201/10537 : Attached components
• CPC Class Codes: H05K 2201/10924 : Leads formed from a punched metal foil
• CPC Class Codes: H05K 3/30 : Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 9/00 : Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49071 : by winding or coiling
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Claims

1. An electronic package, comprising:

a substrate;

a coil having a first end and a second end;

a magnetic body encapsulating the coil and positioned over the substrate;

a first lead, comprising a first top end electrically connected to the first end of the coil and a first bottom end electrically connected to the substrate; and

a second lead, comprising a second top end electrically connected to the second end of the coil and a second bottom end electrically connected to the substrate;

wherein each of the first top end and the second top end is at least partially embedded inside the magnetic body; and

the joined point of the first top end and the first end of the coil and the joined point of the second top end and the second end of the coil are inside the magnetic body.

2. The electronic package as claimed in claim 1, further comprising an electronic element disposed between the substrate and the magnetic body.

3. The electronic package as claimed in claim 2, wherein the electronic element is disposed between the first lead and the second lead outside the magnetic body.

4. The electronic package as claimed in claim 1, wherein the first lead further comprises a first middle section connecting the first top end to the first bottom end, wherein the first middle section of the first lead is exposed out of the magnetic body;

and the second lead further comprises a second middle section connecting the second top end to the second bottom end, wherein the second middle section of the second lead is exposed out of the magnetic body.

5. The electronic package as claimed in claim 1, further comprising a first conductive layer disposed on the top surface of the substrate and a second conductive layer disposed on the bottom surface of the substrate, wherein the substrate has at least one conductive via therein to electrically connect the first conductive layer to the second conductive layer.

6. The electronic package as claimed in claim 2, further comprising a first conductive layer disposed on the top surface of the substrate and a second conductive layer disposed on the bottom surface of the substrate, wherein the substrate has at least one conductive via therein to electrically connect the first conductive layer to the second conductive layer, wherein the at least one conductive via dissipates heat generated by the electronic element.

7. The electronic package as claimed in claim 2, further comprising an insulating encapsulant encapsulating the electronic element and disposed under the magnetic body.

8. The electronic package as claimed in claim 7, wherein the width of the insulating encapsulant is smaller than that of the magnetic body.

9. The electronic package as claimed in claim 7, wherein the insulating encapsulant is disposed between the first lead and the second lead.

10. The electronic package as claimed in claim 4, wherein the first top end and the first bottom end are disposed in parallel and the first middle section of the first lead is substantially perpendicular to the first top end and the first bottom end;

and the second top end and the second bottom end are disposed in parallel and the second middle section of the second lead is substantially perpendicular to the second top end and the second bottom end.

11. The electronic package as claimed in claim 2, wherein the electronic element comprises at least one of a capacitor, a resistor, an inductor, a metal-oxide-semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT) and a diode.

12. The electronic package as claimed in claim 2, further comprising an electromagnetic-interference (EMI) shielding element disposed between the coil and the electronic element.

13. The electronic package as claimed in claim 1, wherein the magnetic body includes a magnetic wrap that wraps the coil.

14. A method for manufacturing an electronic package, the method comprising the steps of:

a. providing a substrate, a coil having a first end and a second end, a first lead and a second lead, wherein the first lead comprises a first top end and a first bottom end, and the second lead comprises a second top end and a second bottom end;

b. electrically connecting the first top end to the first end of the coil and electrically connecting the second top end to the second end of the coil;

c. forming a magnetic body to encapsulate the coil, wherein each of the first top end and the second top end is at least partially embedded inside the magnetic body; and

the joined point of the first top end and the first end of the coil and the joined point of the second top end and the second end of the coil are inside the magnetic body; and

d. disposing the magnetic body over the substrate and electrically connecting the first bottom end and the second bottom end to the substrate.

15. The method as claimed in claim 14, wherein step d further comprises disposing an electronic element between the substrate and the magnetic body.

16. The method as claimed in claim 15, wherein the electronic element is disposed between the first lead and the second lead outside the magnetic body.

17. The method as claimed in claim 14, wherein the first lead further comprises a first middle section connecting the first top end to the first bottom end, wherein the first middle section of the first lead is exposed out of the magnetic body;

and the second lead further comprises a second middle section connecting the second top end to the second bottom end, wherein the second middle section of the second lead is exposed out of the magnetic body.

18. The method as claimed in claim 15, wherein disposing the electronic element between the substrate and the magnetic body comprises forming an insulating encapsulant under the magnetic body to encapsulate the electronic element.

19. The method as claimed in claim 15, wherein disposing the electronic element between the substrate and the magnetic body comprises disposing an electromagnetic-interference (EMI) shielding element between the coil and the electronic element.