LIGHT EMITTER DEVICES AND METHODS FOR IMPROVED LIGHT EXTRACTION

• US 20130141905A1
• Filed: 12/06/2011
• Published: 06/06/2013
• Est. Priority Date: 12/06/2011
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Rosado, Raymond, Britt, Jeffrey C., Lydon, Justin
• Granted Patent: US 9,496,466 B2
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor

Abstract

Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.

Claims

1. A light emitter device comprising:

a submount;

at least one light emitting chip disposed over the submount; and

a lens disposed over the at least one light emitting chip, wherein the lens comprises a lens base having substantially the same geometry as a geometry of the submount.

2. The light emitter device according to claim 1, wherein the geometry of the lens base and the submount is non-circular.

3. The light emitter device according to claim 1, wherein the geometry of the lens base and the submount is circular.

4. The light emitter device according to claim 1, wherein the geometry of the lens base and the submount is square.

5. The light emitter device according to claim 1, wherein the lens comprises a first portion disposed above a plane of an upper surface of light emitting chip and a second portion disposed below the plane of the upper surface of light emitting chip.

6. The light emitter device according to claim 5, wherein the first portion and the second portion are disposed along by a continuous straight, curved, or angled edge of the lens.

7. The light emitter device according to claim 1, wherein the lens extends flush with at least one edge of the submount such that at least one corner of the submount is disposed below a curved surface of the lens.

8. The light emitter device according to claim 7, wherein the lens extends flush with each edge of the submount such that each corner of the submount is disposed below a curved surface of the lens.

9. The light emitter device according to claim 1, wherein the at least one light emitting chip is wirebonded to a first and a second electrical element disposed on the submount.

10. The light emitter device according to claim 1, wherein a bottom surface of the at least one light emitting chip is directly attached to each of a first and a second element disposed on the submount.

11. The light emitter device according to claim 1, wherein the at least one light emitting chip comprises at least one beveled surface.

12. The light emitter device according to claim 11, wherein the at least one beveled surface faces a corner of the submount.

13. The light emitter device according to claim 11, wherein the at least one beveled surface is offset at an angle with respect to a side of the submount.

14. The light emitter device according to claim 13, wherein the angle comprises approximately 45°

.

15. The light emitter device according to claim 1, wherein the submount comprises a square geometry where each side is approximately 2.5 mm or less.

16. The light emitter device according to claim 15, wherein the submount comprises a square geometry where each side is approximately 2.0 mm or less.

17. The light emitter device according to claim 15, wherein the submount comprises a square geometry where each side is approximately 1.0 mm or less.

18. The light emitter device according to claim 1, wherein the submount comprises a ceramic material.

19. A light emitter device comprising:

a submount;

at least one light emitting chip disposed over the submount; and

a lens disposed over the at least one light emitting chip, wherein the lens comprises a first portion disposed above a plane of an upper surface, the at least one light emitting chip and a second portion disposed below the plane of the upper surface of the at least one light emitting chip; and

wherein the first portion and the second portion are disposed along a continuous straight, curved, or angled edge of the lens.

20. The light emitter device according to claim 19, wherein the lens comprises a lens base having substantially the same geometry as a geometry of the submount.

21. The light emitter device according to claim 19, wherein the geometry of the lens base and the submount is non-circular.

22. The light emitter device according to claim 19, wherein the geometry of the lens base and the submount is circular.

23. The light emitter device according to claim 19, wherein the geometry of the lens base and the submount is square.

24. The light emitter device according to claim 19, wherein the lens extends flush with at least one edge of the submount such that at least one corner of the submount is disposed below a curved surface of the lens.

25. The light emitter device according to claim 24, wherein the lens extends flush with each edge of the submount such that each corner of the submount is disposed below a curved surface of the lens.

26. The light emitter device according to claim 19, wherein the at least one light emitting chip is wirebonded to a first and a second electrical element disposed on the submount.

27. The light emitter device according to claim 19, wherein a bottom surface of the at least one light emitting chip is directly attached to each of a first and a second element disposed on the submount.

28. The light emitter device according to claim 19, wherein the at least one light emitting chip comprises at least one beveled surface.

29. The light emitter device according to claim 28, wherein the at least one beveled surface faces a corner of the submount.

30. The light emitter device according to claim 28, wherein the at least one beveled surface is offset at an angle with respect to a side of the submount.

31. The light emitter device according to claim 30, wherein the angle comprises approximately 45°

.

32. The light emitter device according to claim 19, wherein the submount comprises a square geometry where each side is approximately 2.5 mm or less.

33. The light emitter device according to claim 32, wherein the submount comprises the square geometry where each side is approximately 2.0 mm or less.

34. The light emitter device according to claim 32, wherein the submount comprises the square geometry where each side is approximately 1.0 mm or less.

35. The light emitter device according to claim 19, wherein the submount comprises a ceramic material.

36. A light emitter device comprising:

a submount;

at least one light emitting chip disposed over the submount; and

a lens disposed over the at least one light emitting chip, wherein the lens extends flush with at least one edge of the submount such that at least one corner of the submount is disposed below a curved surface of the lens.

37. The light emitter according to claim 36, wherein the lens disposed over the at least one light emitting chip, wherein the lens comprises a first portion disposed above a plane of an upper surface of the at least one light emitting chip and a second portion disposed below the plane of the upper surface of at least one light emitting chip.

38. The light emitter according to claim 37, wherein the first portion and the second portion are disposed along a continuous straight, curved, or angled edge of the lens.

39. The light emitter device according to claim 36, wherein the lens comprises a lens base having substantially the same geometry as a geometry of the submount.

40. The light emitter device according to claim 36, wherein the geometry of the lens base and the submount is non-circular.

41. The light emitter device according to claim 36, wherein the geometry of the lens base and the submount is circular.

42. The light emitter device according to claim 36, wherein the geometry of the lens base and the submount is square.

43. The light emitter device according to claim 36, wherein the lens extends flush with each edge of the submount such that each corner of the submount is disposed below a curved surface of the lens.

44. The light emitter device according to claim 36, wherein the at least one light emitting chip is wirebonded to a first and a second electrical element disposed on the submount.

45. The light emitter device according to claim 36, wherein a bottom surface of the at least one light emitting chip is directly attached to each of a first and a second element disposed on the submount.

46. The light emitter device according to claim 36, wherein the at least one light emitting chip comprises at least one beveled surface.

47. The light emitter device according to claim 46, wherein the at least one beveled surface faces a corner of the submount.

48. The light emitter device according to claim 46, wherein the at least one beveled surface is offset at an angle with respect to a side of the submount.

49. The light emitter device according to claim 48, wherein the angle comprises approximately 45°

.

50. The light emitter device according to claim 36, wherein the submount comprises a square geometry where each side is approximately 2.5 mm or less.

51. The light emitter device according to claim 50, wherein the submount comprises a square geometry where each side is approximately 2.0 mm or less.

52. The light emitter device according to claim 50, wherein the submount comprises the square geometry where each side is approximately 1.0 mm or less.

53. The light emitter device according to claim 36, wherein the submount comprises a ceramic material.

54. A method of providing a light emitter device, the method comprising:

providing a submount;

electrically connecting at least one light emitting chip to a portion of the submount; and

forming a lens over the at least one light emitting chip such that a lens base comprises substantially the same geometry as a geometry of the submount.

55. The method according to claim 54, wherein forming the lens comprises molding the lens such that the geometry of the lens base is non-circular.

56. The method according to claim 54, wherein forming the lens comprises molding the lens such that the geometry of the lens base is circular.

57. The method according to claim 54, wherein forming the lens comprises molding the lens such that the geometry of the lens base is square.

58. The method according to claim 54, wherein forming the lens comprises forming a first portion and forming a second portion, where the first portion is formed above a plane of an upper surface of the light emitting chip and a second portion is formed below the plane of the upper surface of the light emitting chip.

59. The method according to 54, wherein the first portion and the second portion are disposed along a continuous straight, curved, or angled edge of the lens.

60. The method according to claim 54, wherein forming the lens comprises molding the lens base flush with at least one edge of the submount such that at least one corner of the submount is disposed below a curved surface of the lens.

61. The method according to claim 60, wherein forming the lens comprises molding the lens base flush with each edge of the submount such that each corner of the submount is disposed below a curved surface of the lens.

62. The method according to claim 54, wherein electrically connecting the at least one light emitting chip comprises wirebonding the light emitting chip to a first and a second electrical element disposed on the submount.

63. The method according to claim 54, wherein electrically connecting the at least one light emitting chip comprises attaching a portion of the bottom surface of the light emitting chip to each of a first and a second element disposed on the submount.

64. The method according to claim 54, wherein electrically connecting the at least one light emitting chip comprises electrically connecting a light emitting chip comprising at least one beveled surface.

65. The method according to claim 64, further comprising angling the at least one beveled surface to face a corner of the submount.

66. The method according to claim 64, further comprising angling the at least one beveled surface approximately 45°

with respect to a side of the submount.

67. The method according to claim 54, wherein providing the submount comprises providing a square geometry where each side is approximately 2.5 mm or less.

68. The method according to claim 67, wherein providing the submount comprises providing a square geometry where each side is approximately 2.0 mm or less.

69. The method according to claim 67, wherein providing the submount comprises providing a square geometry where each side is approximately 1.0 mm or less.

70. The method according to claim 54, wherein providing the submount comprises providing a ceramic submount.

71. A light emitter device comprising:

a submount;

at least one light emitting chip disposed over the submount; and

a lens disposed over the at least one light emitting chip, wherein a lens base and the submount have a non-circular configuration.

72. The light emitter device according to claim 71, wherein the configuration of the lens base and the submount is square.

73. The light emitter device according to claim 71, wherein the lens base extends flush with at least one edge of the submount such that at least one corner of the submount is disposed below a curved surface of the lens.

74. The light emitter device according to claim 73, wherein the lens base extends flush with each edge of the submount such that each corner of the submount is disposed below a curved surface of the lens.

75. The light emitter device according to claim 71, wherein the at least one light emitting chip comprises at least one beveled surface.

76. The light emitter device according to claim 75, wherein the at least one beveled surface faces a corner of the submount.

77. The light emitter device according to claim 71, wherein the submount comprises a square configuration where each side is approximately 2.5 mm or less.