COOLING SYSTEM FOR POWER CONVERSION DEVICE

• US 20130146254A1
• Filed: 08/03/2012
• Published: 06/13/2013
• Est. Priority Date: 12/09/2011
• Status: Active Grant

• Current Assignee: Hyundai Motor Company (Hyundai Motor Group)
• Original Assignee: Hyundai Motor Company (Hyundai Motor Group)
• Inventors: Jeon, Wooyong, Kim, Joon Hwan, Kim, Minji
• Granted Patent: US 9,844,168 B2
• Time in Patent Office: Days
• US Class Current: 165/104.11
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

Disclosed is a cooling system for a conversion device that includes a heat sinking plane, a main cooling jacket, and a sub-cooling jacket. The main cooling jacket is connected with the heat sinking plane and provided with a first component disposed thereto. The sub cooling jacket is connected with the heat sinking plane on the opposite side of the main cooling jacket, and provided with a second component which generates a relatively lower amount of heat than the first component. A main inlet is disposed in the main cooling jacket for supplying coolant to the main cooling jacket, and an outlet is disposed in the sub cooling jacket for exhausting the coolant which has passed through the sub cooling jacket. A sub inlet is formed in the heat sinking plane for the coolant passing through the main cooling jacket to be supplied to the sub cooling jacket.

Claims

1. A cooling system for a conversion device comprising:

a heat sinking plane;

a main cooling jacket connected adjacently to a first side of the heat sinking plane and provided with a first component disposed thereto;

a sub cooling jacket connected adjacently to a second side of the heat sinking plane, and is provided with a second component which generates a relatively lower amount of heat than that of the first component wherein the second side of the heat sinking plane is the opposite side of the main cooling jacket;

a main inlet disposed in the main cooling jacket supplying coolant to the main cooling jacket; and

an outlet disposed in the sub cooling jacket exhausting the coolant which has passed through the sub cooling jacket,

wherein a sub inlet is formed in the heat sinking plane to allow the coolant passing through the main cooling jacket to be supplied to the sub cooling jacket.

2. The cooling system of claim 1, wherein:

the main cooling jacket and the heat sinking plane define a main cooling path therebetween; and

the first component directly contacts the coolant flowing through the main cooling path.

3. The cooling system of claim 2, wherein an open aperture is formed to the main cooling jacket for the first component to directly contact the coolant.

4. The cooling system of claim 3, wherein the cooling system further comprises a first cooling pin formed to protrude from the first component,

wherein the first cooling pin directly contacts the coolant through the open aperture.

5. The cooling system of claim 2, wherein the sub cooling jacket and the heat sinking plane define a sub cooling path therebetween.

6. The cooling system of claim 5, wherein the sub cooling path communicates the sub inlet with the outlet and is formed in a “

U”

shape.

7. The cooling system of claim 6, wherein the sub cooling path comprises:

a first space communicated with the sub inlet; and

a second space communicated with the outlet.

8. The cooling system of claim 7, wherein the sub cooling path further comprises a plurality of channels connecting the first space and the second space.

9. The cooling system of claim 8, wherein the cooling system further comprises a turbulator formed in at least part of the plurality of channels.

10. The cooling system of claim 5, wherein heat interface material is interposed between the sub cooling jacket and the second component.

11. The cooling system of claim 10, wherein the heat interface material is a thermal pad or thermal grease.

12. The cooling system of claim 4, wherein the cooling system further comprises a second cooling pin formed to protrude from the second component.

13. The cooling system of claim 1, wherein the conversion device includes an inverter or a converter for a vehicle.

14. The cooling system of claim 1, wherein:

the first component comprises switching elements; and

the second component comprises core elements.

15. A cooling system for a conversion device comprising:

a heat sinking plane;

a main cooling jacket connected with the heat sinking plane and provided with a first component disposed thereto;

a sub cooling jacket connected with the heat sinking plane on the opposite side of the main cooling jacket, and provided with a second component which produces a relatively lower amount of heat than the first component;

a main inlet disposed in the main cooling jacket supplying coolant to the main cooling jacket; and

an outlet disposed in the sub cooling jacket exhausting the coolant which has passed through the sub cooling jacket,

wherein a sub inlet is formed in the heat sinking plane for the coolant passing through the main cooling jacket to be supplied to the sub cooling jacket,

the main cooling jacket and the heat sinking plane define a main cooling path therebetween,

the first component directly contacts the coolant flowing through the main cooling path, and

the sub cooling jacket and the heat sinking plane define a sub cooling path therebetween.

16. The cooling system of claim 15, wherein:

an open aperture is formed to the main cooling jacket for the first component to directly contact the coolant,

a first cooling pin is formed to the first component, and

the first cooling pin directly contacts the coolant through the open aperture.

17. The cooling system of claim 15, wherein the sub cooling path communicates the sub inlet with the outlet and is formed in a “

U”

shape,

wherein the sub cooling path comprises;

a first space communicated with the sub inlet; and

a second space communicated with the outlet.

18. The cooling system of claim 17, wherein the sub cooling path further comprises a plurality of channels connecting the first space and the second space,

wherein a turbulator is formed in at least part of the plurality of channels.