LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF
First Claim
1. A fabricating method of a light emitting device, comprising:
- disposing at least one light emitting chip on a surface of a substrate;
forming at least one tubular structure on the surface of the substrate and surrounding the at least one light emitting chip; and
disposing at least one fluorescent conversion layer in the at least one tubular structure and covering the at least one light emitting chip.
1 Assignment
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Accused Products
Abstract
A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.
9 Citations
18 Claims
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1. A fabricating method of a light emitting device, comprising:
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disposing at least one light emitting chip on a surface of a substrate; forming at least one tubular structure on the surface of the substrate and surrounding the at least one light emitting chip; and disposing at least one fluorescent conversion layer in the at least one tubular structure and covering the at least one light emitting chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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- 14. A tubular structure adapted to be implemented in a light emitting device comprising a substrate and a light emitting chip, the tubular structure and the light emitting chip being formed on an surface of the substrate, wherein a first space surrounded by the tubular structure allows the light emitting chip to be disposed in, an angle and a second space are formed between an outer tube wall of the tubular structure and the surface.
Specification