Component Having a Via and Method for Manufacturing It
1 Assignment
0 Petitions
Accused Products
Abstract
An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.
11 Citations
28 Claims
-
1-14. -14. (canceled)
-
15. A component, whose functionality is realized in a layer construction on a conductive substrate, comprising:
-
a component arrangement having at least one via (Vertical Interconnect Access), led to a back side of the component arrangement, for electrically contacting functional elements realized in the layer construction, wherein the at least one via includes a connection area in the substrate that extends over the entire thickness of the substrate, and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness, and wherein the trench-like insulating frame is filled up with an electrically insulating polymer. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
-
-
16. A component, comprising:
-
functional elements, which are realized in a layer construction on a substrate; a conductive cap substrate on the layer construction; and at least one via (Vertical Interconnect Access), led through the cap substrate, for electrically contacting the functional elements, the via including a connection area that extends over the entire thickness of the cap substrate up to a connecting conductor track in the layer construction on the substrate, and being electrically insulated from its surroundings by a trench-like insulating frame, and the trench-like insulating frame being filled up with an electrically insulating polymer.
-
-
24. A method for manufacturing a component, having a via, starting from a semiconductor substrate, the method comprising:
-
realizing at least one conductor track in a layer construction on the semiconductor substrate, the conductor track being in direct contact with at least one connection area in the substrate, and producing an electrical connection to at least one functional element to be realized in the layer construction; producing, after completion of the layer construction, an insulating frame surrounding the connection area and extending over the entire substrate thickness in the substrate using a back-side trenching process; filling up the trench-like insulating frame with an electrically insulating polymer; and applying, on the back side of the component, a patterned metallization that is connected to the connection area; and forming at least one terminal pad; wherein the via is led through the cap substrate and is for electrically contacting the functional elements, the via including a connection area that extends over the entire thickness of the cap substrate up to a connecting conductor track in the layer construction on the substrate, and being electrically insulated from its surroundings by a trench-like insulating frame, and the trench-like insulating frame being filled up with an electrically insulating polymer. - View Dependent Claims (25, 26, 27, 28)
-
Specification