EXPOSURE METHOD, EXPOSURE APPARATUS, AND METHOD OF MANUFACTURING DEVICE

• US 20130148123A1
• Filed: 02/05/2013
• Published: 06/13/2013
• Est. Priority Date: 02/29/2008
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: HAYASHI, Nozomu
• Granted Patent: US 8,885,164 B2
• Time in Patent Office: Days
• US Class Current: 356/401
• CPC Class Codes: G01B 11/14 for measuring distance or clearance between spaced objects or spaced apertures G01B11/26 takes precedence; rangefinders G01C3/00
• CPC Class Codes: G03F 9/7003 Alignment type or strategy, e.g. leveling, global alignment
• CPC Class Codes: G03F 9/7046 Strategy, e.g. mark, sensor or wavelength selection

Abstract

An exposure method comprises: a first detection step of detecting a position of a first mark by a first scope; a second detection step of detecting a position of a second mark by a second scope having a magnification higher than the first scope; a first calculation step of calculating a first correction value based on the detection results obtained in the first and second detection steps; a third detection step of detecting a position of a third mark by the second scope after the substrate is aligned based on the first correction value calculated in the first calculation step; a second calculation step or calculating a second correction value based on the detection results obtained in the second and third detection steps; and an exposure step of exposing the substrate after the substrate is aligned based on the second correction value calculated in the second calculation step.

Claims

1. An alignment method by aligning a substrate using a mark formed on the substrate, the method comprising:

a first detection step of detecting a position of a first mark by detecting the first mark using a scope of first magnification;

a shift step of shifting the substrate, based on a shift correction value obtained from a detection result in the first detection step, from a position of the substrate when the first mark was detected by the scope of first magnification to a position of the substrate where a second mark, different from the first mark, enters a field of a scope of second magnification higher than the first magnification;

a second detection step of detecting a position of the second mark which has entered the field of the scope of second magnification, by detecting the second mark using the scope of second magnification;

a first calculation step of calculating a first correction value based on the result of detecting the position of the first mark by the scope of the first magnification obtained in the first detection step and the result of detecting the position of the second mark by the scope of second magnification obtained in the second detection step;

a third detection step of detecting a position of a third mark different from the first mark and the second mark by detecting the third mark using the scope of second magnification after the substrate is aligned based on the first correction value; and

a second calculation step of calculating a second correction value based on the result of detecting the position of the second mark by the scope of second magnification obtained in the second detection step and the result of detecting the position of the third mark by the scope of second magnification obtained in the third detection step;

wherein the second mark is selected from marks arranged at positions from which the marks are allowed to enter the field of the scope of second magnification, correcting the position of the substrate by the shift correction based on the detection result obtained in the first detection step.

2. The method according to claim 1, wherein the second mark is a mark located farthest from the first mark, of the marks arranged at the positions from which the marks are allowed to enter the field of the scope of second magnification, correcting of the substrate by the shift correction based on the detection result obtained in the first detection step.

3. An alignment method by aligning a substrate using a mark formed on the substrate, the method comprising:

a first detection step of detecting a position of a first mark by detecting the first mark using a scope of first magnification;

a shift step of shifting the substrate, based on a shift correction value obtained from a detection result in the first detection step, from a position of the substrate when the first mark was detected by the scope of first magnification to a position of the substrate where a second mark, different from the first mark, enters a field of a scope of second magnification higher than the first magnification;

a second detection step of detecting a position of the second mark which has entered the field of the scope of second magnification, by detecting the second mark using the scope of second magnification;

a first calculation step of calculating a first correction value based on the result of detecting the position of the first mark by the scope of the first magnification obtained in the first detection step and the result of detecting the position of the second mark by the scope of second magnification obtained in the second detection step;

a third detection step of detecting a position of a third mark different from the first mark and the second mark by detecting the third mark using the scope of second magnification after the substrate is aligned based on the first correction value; and

a second calculation step of calculating a second correction value based on the result of detecting the position of the second mark by the scope of second magnification obtained in the second detection step and the result of detecting the position of the third mark by the scope of second magnification obtained in the third detection step;

wherein in the third detection step, a plurality of marks different from the first mark and the second mark are detected.

4. A positioning apparatus which aligns a substrate by using a mark formed on the substrate, the apparatus comprising:

a substrate stage which holds the substrate;

a scope of first magnification which observes the mark formed on the substrate; and

a scope of second magnification higher than the first magnification; and

a controller which controls said scope of first magnification, said scope of second magnification, and said substrate stage,

wherein said controller controls said scope of first magnification, said scope of second magnification, and said substrate stage so that

said scope of first magnification detects a first mark and detects a position of a first mark,

the substrate is shifted, based on a shift correction value obtained from a result of detecting a position of the first mark, from a position of the substrate when the first mark was detected by the scope of first magnification to a position of the substrate where a second mark, different from the first mark, enters a field of a scope of second magnification;

said scope of second magnification detects the second mark and detects a position of the second mark which has entered the field of the scope of second magnification,

said controller calculates a first correction value based on the result of detecting the position of the first mark by the scope of first magnification and the result of detecting the position of the second mark by the scope of second magnification,

said scope of second magnification detects a third mark and detects a position of the third mark different from the first mark and the second mark after the substrate is aligned based on the calculated first correction value,

said controller calculates a second correction value based on the detection result of the second mark and the detection result of the third mark, and

the apparatus aligns the substrate based on the second correction value;

wherein the third mark includes a plurality of marks different from the first mark and the second mark.