TAPE WIRING SUBSTRATE AND CHIP-ON-FILM PACKAGE INCLUDING THE SAME
First Claim
Patent Images
1. A tape wiring substrate comprising:
- a base film having a first surface and a second surface opposite the first surface, wherein the first surface comprises at least one recess and the second surface comprises a chip-mounting region on which a semiconductor chip is mounted;
a wiring pattern formed on the second surface of the base film, wherein the wiring pattern is extended to an edge of the chip-mounting region; and
a protection film covering the wiring pattern.
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Abstract
A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern.
106 Citations
20 Claims
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1. A tape wiring substrate comprising:
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a base film having a first surface and a second surface opposite the first surface, wherein the first surface comprises at least one recess and the second surface comprises a chip-mounting region on which a semiconductor chip is mounted; a wiring pattern formed on the second surface of the base film, wherein the wiring pattern is extended to an edge of the chip-mounting region; and a protection film covering the wiring pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A chip-on-film package comprising:
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a tape wiring substrate that comprises; a base film having a first surface and a second surface opposite the first surface, wherein the first surface comprises at least one recess and the second surface comprises a chip-mounting region on which a semiconductor chip is mounted; a wiring pattern formed on the second surface of the base film, wherein the wiring pattern is extended to an edge of the chip-mounting region and comprises an input wiring pattern and an output wiring pattern; and a protection film covering the wiring pattern; and a semiconductor chip connected to the input wiring pattern and the output wiring pattern through one or more electrode bumps formed on an active surface of the semiconductor chip, the semiconductor chip mounted on the chip-mounting region of the base film, wherein the input wiring pattern is connected to a printed circuit board and the output wiring pattern is connected to a display panel. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A display device, comprising:
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a display panel; a flexible tape wiring substrate having one or more recesses formed thereon, the flexible tape wiring substrate connected to a top surface of the display panel; and a semiconductor chip mounted on the flexible tape wiring substrate, wherein the flexible tape wiring substrate is bent such that the semiconductor chip mounted thereon is positioned underneath a bottom surface of the display panel. - View Dependent Claims (17, 18, 19, 20)
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Specification