Radio Frequency Identification Sensor Assembly

• US 20130161400A1
• Filed: 12/19/2012
• Published: 06/27/2013
• Est. Priority Date: 12/21/2011
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: FORSTER, Ian J.
• Granted Patent: US 9,626,612 B2
• Time in Patent Office: Days
• US Class Current: 235/488
• CPC Class Codes: G06K 19/0716 at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
• CPC Class Codes: G06K 19/0717 the sensor being capable of sensing environmental conditions such as temperature history or pressure
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations

Abstract

In accordance with one embodiment, an RFID sensor assembly comprises an RFID chip, an antenna, a sensor, a substrate, and a laminated layer. The RFID chip is in electrical communication with the antenna and the sensor. The RFID chip, antenna, and sensor are secured to the substrate. The laminated layer is arranged as to create a generally airtight pouch between the substrate and the laminate layer. The laminated layer is further arranged to facilitate a post manufacturing method for exposing the contents of the pouch to the environment surrounding the RFID sensor assembly.

Claims

1. A RFID sensor assembly comprising:

a chip;

an antenna;

a sensor;

at least one electrical lead;

a laminated layer;

a substrate;

wherein the chip is in electrical contact with the antenna and communication with the sensor and can measure a property of a sensor material to determine properties or conditions of an environment surrounding the sensor;

wherein the chip, antenna, sensor, and at least one electrical lead is secured to the substrate;

wherein the laminated layer is arranged as to create a generally sealed pouch between the substrate and the laminated layer; and

wherein the laminated layer is arranged to facilitate a post-manufacturing method for exposing the contents of the pouch to the environments surround the RFID sensor assembly.

2. The RFID sensor assembly of claim 1, wherein the laminated layer is over the substrate, chip, antenna, sensor and at least one electrical lead.

3. The RFID sensor assembly of claim 2, wherein the laminated layer includes a permeable membrane located above the sensor.

4. The RFID sensor assembly of claim 1, wherein the laminated layer is only applied to the sensor.

5. The RFID sensor assembly of claim 1, wherein the laminated layer is not above the sensor.

6. The RFID sensor assembly of claim 5, wherein a permeable layer is above the sensor.

7. The RFID sensor assembly of claim 1, wherein the electrical property of the sensor material is selected from the group consisting of conductivity, dielectric constant, magnetic permeability or a combination of any of these properties.

8. The RFID sensor assembly of claim 1, wherein there are two electrical leads.

9. The RFID sensor assembly of claim 1, wherein the sensor is arranged to measure humidity, temperature, atmospheric pressure of any combination of.

10. The RFID sensor assembly of claim 1, wherein the sensor is arranged to determine the presence of a specific or general class of airborne chemicals or chemicals that directly contact the sensor.

11. The RFID sensor assembly of claim 1, wherein the sensor is arranged to determine physical changes experienced in the object due to forces such as stress or strain.

12. The RFID sensor assembly of claim 1, wherein the laminated layer is secured to the substrate along a seal edge.

13. The RFID sensor assembly of claim 1, wherein the sealed pouch is substantially airtight.

14. The RFID sensor assembly of claim 1, wherein the RFID sensor assembly is inactive when the pouch is intact.

15. The RFID sensor assembly of claim 14, wherein the RFID sensor assembly is active when the sensor is exposed due to a post manufacturing process.

16. The RFID sensor assembly of claim 1, wherein the sensor comprises an absorbent material that is treated with a detecting reagent.

17. The RFID sensor assembly of claim 1, wherein the sensor is activated by an activating reagent.

18. The RFID sensor assembly of claim 1, further comprising at least one capsule positioned proximately to the sensor, embedded, or suspended in the sensor.

19. The RFID sensor assembly of claim 18, wherein the capsules include an activating reagent.

20. The RFID sensor assembly of claim 1, wherein the sensor is comprised of electrically activatable material.

21. A method of manufacturing an RFID sensor assembly including

securing an RFID chip, antenna sensor, and at least one electrical lead to a substrate;

applying a laminated layer so as to secure the substrate along a seal edge; and

wherein the seal edge can be formed such that the seal between the laminated layer and substrate is a hermetic seal so that a pouch is formed that is substantially airtight.

22. The method of manufacturing an RFID sensor assembly of claim 21, wherein the RFID chip, sensor and at least one electrical lead are secured by adhesives.

23. The method of manufacturing an RFID sensor assembly of claim 21, wherein the RFID chip, sensor and at least one electrical lead are secured by printing.

24. The method of manufacturing an RFID sensor assembly of claim 21, wherein the laminated layer is only over the sensor.

25. The method of manufacturing an RFID sensor assembly of claim 21, wherein the laminated layer is formed over the substrate, RFID chip, antenna, sensor, and at least one electrical lead.

26. The method of manufacturing an RFID sensor assembly of claim 21, wherein the laminated layer is not formed over the sensor.

27. The method of manufacturing an RFID sensor assembly of claim 26, further comprising applying a permeable layer directly to the sensor.