SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A semiconductor device comprising:
- an oxide semiconductor film over an insulating surface;
a gate insulating film over the oxide semiconductor film;
a gate electrode provided over the gate insulating film and overlapping with the oxide semiconductor film;
a first insulating film over the gate insulating film and the gate electrode;
a source electrode in contact with one end of the oxide semiconductor film and one end of the first insulating film;
a drain electrode in contact with the other end of the oxide semiconductor film and the other end of the first insulating film; and
a second insulating film over the source electrode and the drain electrode,wherein heights of top surfaces of the source electrode and the drain electrode are substantially the same as heights of top surfaces of the first insulating film and the second insulating film, andwherein a channel length of the oxide semiconductor film is greater than or equal to 1 nm and less than or equal to 30 nm.
1 Assignment
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Accused Products
Abstract
A first conductive film overlapping with an oxide semiconductor film is formed over a gate insulating film, a gate electrode is formed by selectively etching the first conductive film using a resist subjected to electron beam exposure, a first insulating film is formed over the gate insulating film and the gate electrode, removing a part of the first insulating film while the gate electrode is not exposed, an anti-reflective film is formed over the first insulating film, the anti-reflective film, the first insulating film and the gate insulating film are selectively etched using a resist subjected to electron beam exposure, and a source electrode in contact with one end of the oxide semiconductor film and one end of the first insulating film and a drain electrode in contact with the other end of the oxide semiconductor film and the other end of the first insulating film are formed.
19 Citations
27 Claims
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1. A semiconductor device comprising:
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an oxide semiconductor film over an insulating surface; a gate insulating film over the oxide semiconductor film; a gate electrode provided over the gate insulating film and overlapping with the oxide semiconductor film; a first insulating film over the gate insulating film and the gate electrode; a source electrode in contact with one end of the oxide semiconductor film and one end of the first insulating film; a drain electrode in contact with the other end of the oxide semiconductor film and the other end of the first insulating film; and a second insulating film over the source electrode and the drain electrode, wherein heights of top surfaces of the source electrode and the drain electrode are substantially the same as heights of top surfaces of the first insulating film and the second insulating film, and wherein a channel length of the oxide semiconductor film is greater than or equal to 1 nm and less than or equal to 30 nm. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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an oxide semiconductor film provided over an insulating surface and including a channel formation region, and a first low-resistance region and a second low-resistance region with the channel formation region sandwiched therebetween; a gate insulating film over the oxide semiconductor film; a gate electrode provided over the gate insulating film and overlapping with the channel formation region; a first insulating film over the gate insulating film and the gate electrode; a source electrode in contact with a part of the first low-resistance region; a drain electrode in contact with a part of the second low-resistance region; and a second insulating film over the source electrode and the drain electrode, wherein heights of top surfaces of the source electrode and the drain electrode are substantially the same as heights of top surfaces of the first insulating film and the second insulating film, and wherein a channel length of the oxide semiconductor film is greater than or equal to 1 nm and less than or equal to 30 nm. - View Dependent Claims (6, 7, 8)
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9. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an oxide semiconductor film over an insulating surface; forming a gate insulating film covering the oxide semiconductor film; forming a first conductive film provided over the gate insulating film and overlapping with the oxide semiconductor film; forming a film over the first conductive film; forming a first resist by performing electron beam exposure over the film; selectively etching the film using the first resist as a mask to form a hard mask film; forming a gate electrode by selectively etching the first conductive film using the hard mask film as a mask; forming a first insulating film over the gate insulating film and the gate electrode; performing first removing treatment on a part of the first insulating film while the gate electrode is not exposed; forming an anti-reflective film over the first insulating film subjected to the first removing treatment; forming a second resist by performing electron beam exposure over the anti-reflective film and overlapping with the oxide semiconductor film; exposing parts of the insulating surface and the oxide semiconductor film to form an exposed insulating surface and oxide semiconductor film by selectively etching the anti-reflective film, the first insulating film, and the gate insulating film; forming a second conductive film over the exposed insulating surface and oxide semiconductor film, and the anti-reflective film; forming a second insulating film over the second conductive film; performing second removing treatment on parts of the second insulating film and the second conductive film, and the anti-reflective film so that the first insulating film is exposed; and forming a source electrode and a drain electrode by processing the second conductive film subjected to the second removing treatment. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an oxide semiconductor film over an insulating surface; forming a gate insulating film covering the oxide semiconductor film; forming a first conductive film provided over the gate insulating film and overlapping with the oxide semiconductor film; forming a film over the first conductive film; forming a first resist by performing electron beam exposure over the film; selectively etching the film using the first resist as a mask to form a hard mask film; forming a gate electrode by selectively etching the first conductive film using the hard mask film as a mask; forming, in a self-aligned manner, a channel formation region in a region overlapping with the gate electrode in the oxide semiconductor film and a first low-resistance region and a second low-resistance region between which the channel formation region is sandwiched in the oxide semiconductor film by adding impurities; forming a first insulating film over the gate insulating film and the gate electrode; performing first removing treatment on a part of the first insulating film while the gate electrode is not exposed; forming an anti-reflective film over the first insulating film on which the first removing treatment is performed; forming a second resist by performing electron beam exposure over the anti-reflective film and overlapping with the channel formation region, the first low-resistance region, and the second low-resistance region; exposing a part of the insulating surface, the first low-resistance region, and the second low-resistance region by selectively etching the anti-reflective film, the first insulating film, and the gate insulating film to form an exposed insulating surface, first low-resistance region, and second low-resistance region; forming a second conductive film over the exposed insulating surface, first low-resistance region, and second low-resistance region, and the anti-reflective film; forming a second insulating film over the second conductive film; performing second removing treatment on parts of the second insulating film and the second conductive film, and the anti-reflective film so that the first insulating film is exposed; and forming a source electrode and a drain electrode by processing the second conductive film on which the second removing treatment is performed. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an oxide semiconductor film over an insulating surface; forming a gate insulating film covering the oxide semiconductor film; forming a first conductive film provided over the gate insulating film and overlapping with the oxide semiconductor film; forming a film over the first conductive film; forming a first resist by performing electron beam exposure over the film; selectively etching the film using the first resist as a mask to form a hard mask film; forming a gate electrode by selectively etching the first conductive film using the hard mask film as a mask; forming a first insulating film over the gate insulating film and the gate electrode; performing first removing treatment on a part of the first insulating film while the gate electrode is not exposed; forming an anti-reflective film over the first insulating film subjected to the first removing treatment; forming a second resist by performing electron beam exposure over the anti-reflective film and overlapping with the oxide semiconductor film; exposing parts of the insulating surface and the oxide semiconductor film to form an exposed insulating surface and oxide semiconductor film by selectively etching the anti-reflective film, the first insulating film, and the gate insulating film; forming a second conductive film over the exposed insulating surface and oxide semiconductor film, and the anti-reflective film; forming a second insulating film over the second conductive film; and performing second removing treatment on parts of the second insulating film and the second conductive film, and the anti-reflective film so that the first insulating film is exposed. - View Dependent Claims (22, 23, 24, 25, 26, 27)
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Specification