Curable Organopolysiloxane Composition And Optical Semiconductor Device

• US 20130161686A1
• Filed: 06/28/2011
• Published: 06/27/2013
• Est. Priority Date: 06/29/2010
• Status: Active Grant

• Current Assignee: Dow Toray Co., Ltd. (Dow, Inc.), Milestone AV Technologies LLC (Legrand SA)
• Original Assignee: Dow Corning Toray Company Limited (Dow, Inc.)
• Inventors: Yoshitake, Makoto, Yamakawa, Mieko
• Granted Patent: US 9,012,586 B2
• Time in Patent Office: Days
• US Class Current: 257/100
• CPC Class Codes: C08G 77/12 containing silicon bound to hydrogen C08G77/045 takes precedence
• CPC Class Codes: C08G 77/14 containing silicon bound to oxygen-containing groups C08G77/045 takes precedence
• CPC Class Codes: C08G 77/16 to hydroxyl groups
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08G 77/70 Siloxanes defined by use of the MDTQ nomenclature
• CPC Class Codes: C08K 5/56 Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/296 Organo-silicon compounds
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin

Abstract

A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.

Claims

1. A curable organopolysiloxane composition comprising at least the following components:

(A) an alkenyl-containing organopolysiloxane that comprises 40 to 70 wt. % of constituent (A-1) and 30 to 60 wt. % of constituent (A-2), wherein

constituent (A-1) comprises an organopolysiloxane of the following average compositional formula;

(R¹₃ SiO_1/2)_a (R¹₂ SiO_2/2)_b (R¹ SiO_3/2)_c (SiO_4/2)_d

where R¹ designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;

0.1 to 50 mole % of all R¹ groups are alkenyl groups having 2 to 10 carbon atoms;

methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R¹;

“

a”

, “

b”

, “

c”

, and “

d”

are numbers that satisfy the following conditions;

0≦

a≦

0.05;

0.9≦

b≦

1;

0≦

c≦

0.03;

0≦

d≦

0.03; and

a+b+c+d=1;

constituent (A-2) comprises an organopolysiloxane of the following average compositional formula;

(R²₃ SiO_1/2)_e (R²₂ SiO_2/2)_f (R² SiO_3/2)_g (SiO_4/2)_h (HO_1/2)_i

where R² designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;

5 to 10 mole % of all R² groups are alkenyl groups having 2 to 10 carbon atoms;

methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R²;

“

e”

, “

f”

, “

g”

, “

h” and

“

i”

are numbers that satisfy the following conditions;

0.4≦

e≦

0.6;

0≦

f≦

0.05;

0≦

g≦

0.05;

0.4≦

h≦

0.6;

0.01≦

i≦

0.05; and

e+f+g+h=1;

(B) an organopolysiloxane that contains silicon-bonded hydrogen atom and comprises 10 to 50 wt. % of constituent (B-1), 50 to 90 wt. % of constituent (B-2), and 0 to 30 wt. % of constituent (B-3);

in an amount that the silicon-bonded hydrogen atoms in component (B) are in the range of 0.5 to 2.0 moles per 1 mole of the total content of alkenyl groups in component (A), wherein

constituent (B-1) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average molecular formula;

R³₃ SiO (R³₂ SiO)_j (R³H SiO)_k SiR³₃

where R³ designates phenyl groups or methyl groups;

methyl groups constitute 90 mole % or more of all groups contained in R³;

“

j”

is a number in the range of 0 to 35; and

“

k”

is a number in the range of 5 to 100;

constituent (B-2) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average compositional formula;

(HR⁴₂ SiO_1/2)_l (R⁴₃ SiO_1/2)_m (R⁴₂ SiO_2/2)_n (R⁴ SiO_3/2)_o (SiO_4/2)_p (R⁵⁰_1/2)_q

where R⁴ designates phenyl groups or methyl groups;

methyl groups constitute 90 mole % or more of all groups contained in R⁴;

R⁵ designates hydrogen atoms or alkyl groups having 1 to 10 carbon atoms; and

“

l”

, “

m”

, “

n”

, “

o”

, “

p” and

“

q”

are numbers that satisfy the following conditions;

0.4≦

l≦

0.7;

0≦

m≦

0.2;

0≦

n≦

0.05;

0≦

o≦

0.5;

0.3≦

p≦

0.6;

0≦

q≦

0.05; and

l+m+n+o+p=1;

constituent (B-3) is an organopolysiloxane represented by the following average molecular formula;

HR⁶₂ SiO (R⁶₂ SiO)_r SiR⁶₂H

where R⁶ represents phenyl or methyl groups;

methyl groups constitute at least 90% of all groups contained in R⁶; and

“

r”

is a number in the range of 10 to 100; and

(C) a hydrosilylation-reaction catalyst, in an amount sufficient for curing the composition.

2. The curable organopolysiloxane composition of claim 1, further comprising (D) fumed silica having BET specific area of 20 to 200 m²/g and added in an amount of 1 to 10 parts by weight per 100 parts by weight of the sum of components (A) to (C).

3. A cured body of the curable organopolysiloxane composition of claim 1, wherein cured body has a type A durometer hardness in the range of 70 to 90 according to JIS K 6253.

4. The curable organopolysiloxane composition of claim 1, further comprising a sealant or a bonding agent for optical semiconductor elements.

5. The curable organopolysiloxane composition of claim 4, wherein the optical semiconductor elements are light emitting diodes.

6. An optical semiconductor device, comprising at least one optical semiconductor element, wherein the at least one optical semiconductor element is sealed and/or bonded with a cured body of the curable organopolysiloxane composition of claim 1.

7. The optical semiconductor device of claim 6, wherein the at least one optical semiconductor element is a light emitting diode.

8. An optical semiconductor device, comprising a plurality of optical semiconductor elements, wherein each optical semiconductor element is sealed and/or bonded with a cured body of the curable organopolysiloxane composition of claim 1.

9. The curable organopolysiloxane composition of claim 1, wherein constituent (A-1) has a viscosity at 25°

C. in the range of 3 to 1,000,000 mPa·

s.

10. The curable organopolysiloxane composition of claim 1, wherein component (A) has a viscosity at 25°

C. in the range of 100 to 5,000,000 mPa·

s.

11. The curable organopolysiloxane composition of claim 1, wherein constituent (B-1) has a viscosity at 25°

C. in the range of 3 to 10,000 mPa·

s.

12. The curable organopolysiloxane composition of claim 1, wherein component (B) has a viscosity at 25°

C. in the range of 5 to 100,000 mPa·

s.

13. The curable organopolysiloxane composition of claim 1, wherein constituent (B-1) is an interfacial bonding improver.

14. The curable organopolysiloxane composition of claim 1, further comprising a pot life extender in an amount of 0.0001 to 5 parts by weight of the sum of components (A), (B) and (C).

15. The curable organopolysiloxane composition of claim 1, further comprising an adhesion promoter that does not contain active nitrogen atoms.

16. A curable organopolysiloxane composition comprising at least the following components:

(A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) and constituent (A-2), wherein

constituent (A-1) comprises an organopolysiloxane of the following average compositional formula;

(R¹₃ SiO_1/2)_a (R¹₂ SiO_2/2)_b (R¹ SiO_3/2)_c (SiO_4/2)_d

where R¹ designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;

0.1 to 50 mole % of all R¹ groups are alkenyl groups having 2 to 10 carbon atoms;

methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R¹;

“

a”

, “

b”

, “

c”

, and “

d”

are numbers that satisfy the following conditions;

0≦

a≦

0.05;

0.9≦

b≦

1;

0≦

c≦

0.03;

0≦

d≦

0.03; and

a+b+c+d=1;

constituent (A-2) comprises an organopolysiloxane of the following average compositional formula;

(R²₃ SiO_1/2)_e (R²₂ SiO_2/2)_f (R² SiO_3/2)_g (SiO_4/2)_h (HO_1/2)_i

where R² designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms;

5 to 10 mole % of all R² groups are alkenyl groups having 2 to 10 carbon atoms;

methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R²;

“

e”

, “

f”

, “

g”

, “

h” and

“

i”

are numbers that satisfy the following conditions;

0.4≦

e≦

0.6;

0≦

f≦

0.05;

0≦

g≦

0.05;

0.4≦

h≦

0.6;

0.01≦

i≦

0.05; and

e+f+g+h=1;

(B) an organopolysiloxane that contains silicon-bonded hydrogen atom and comprises constituent (B-1) and constituent (B-2;

in an amount that the silicon-bonded hydrogen atoms in component (B) are in the range of 0.5 to 2.0 moles per 1 mole of the total content of alkenyl groups in component (A), wherein

constituent (B-1) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average molecular formula;

R³₃ SiO (R³₂ SiO)_j (R³H SiO)_k SiR³₃

where R³ designates phenyl groups or methyl groups;

methyl groups constitute 90 mole % or more of all groups contained in R³;

“

j”

is a number in the range of 0 to 35; and

“

k”

is a number in the range of 5 to 100;

constituent (B-2) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average compositional formula;

(HR⁴₂ SiO_1/2)_l (R⁴₃ SiO_1/2)_m (R⁴₂ SiO_2/2)_n (R⁴ SiO_3/2)_o (SiO_4/2)_p (R⁵O_1/2)_q

where R⁴ designates phenyl groups or methyl groups;

methyl groups constitute 90 mole % or more of all groups contained in R⁴;

R⁵ designates hydrogen atoms or alkyl groups having 1 to 10 carbon atoms; and

“

l”

, “

m”

, “

n”

, “

o”

, “

p” and

“

q”

are numbers that satisfy the following conditions;

0.4≦

l≦

0.7;

0≦

m≦

0.2;

0≦

n≦

0.05;

0≦

o≦

0.5;

0.3≦

p≦

0.6;

0≦

q≦

0.05; and

l+m+n+o+p=1; and

(C) a hydrosilylation-reaction catalyst, in an amount sufficient for curing the composition.

17. A curable organopolysiloxane composition of claim 16, wherein component (A) comprises 45 to 65 wt. % of constituent (A-1) and 35 to 55 wt. % of constituent (A-2).

18. A curable organopolysiloxane composition of claim 16, wherein component (B) comprises 15 to 35 wt. % of constituent (B-1) and 65 to 85 wt. % of constituent (B-2).