ANGLED FACETS FOR DISPLAY DEVICES

• US 20130162656A1
• Filed: 09/21/2012
• Published: 06/27/2013
• Est. Priority Date: 12/22/2011
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Inventors: Lavery, Kristopher A., Tung, Ming-Hau, Holman, Robert L.
• Granted Patent: US 9,678,329 B2
• Time in Patent Office: Days
• US Class Current: 345/501
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 5/08 Mirrors vehicle mirrors involving special optical features B60R1/08
• CPC Class Codes: G06F 15/00 Digital computers in general details G06F1/00 – G06F13/00; Data processing equipment in general

Abstract

This disclosure provides systems, methods and apparatus for provided masked structures on an embossed substrate. In one aspect, these masked structures may be reflected facets for use as part of a frontlight film. In another aspect, these masked structures may be masked wiring for use as part of a capacitive touchscreen array. In one aspect, the structures may have a discrete mask formed thereon, while in other aspects, these structures may have self-masking attributes, and may include an interferometric black mask.

Claims

1. An apparatus, comprising:

a flexible substrate having a plurality of indentations formed in a first surface of the substrate; and

reflective facets located at least partially within the indentations, wherein the reflective facets include;

a reflective surface located on the side of the facet facing the indentations; and

a facet masking structure on the side of the reflective facet opposite the substrate, wherein the facet masking structure is less reflective than the reflective surface.

2. The apparatus of claim 1, wherein the facet masking structure includes a layer of photoresist.

3. The apparatus of claim 1, wherein the facet masking structure includes an interferometric black mask.

4. The apparatus of claim 1, additionally comprising:

a plurality of masked wires located on the flexible substrate, wherein each of the plurality of masked wires includes;

a strip of conductive material; and

a wire masking structure having at least one wire masking layer, wherein the wire masking layer is less reflective than the strip of conductive material.

5. The apparatus of claim 4, wherein the strip of conductive material is located between the wire masking structure and the substrate.

6. The apparatus of claim 4, wherein the plurality of masked wires extend generally parallel to one another.

7. The apparatus of claim 4, wherein the first surface of the substrate includes flat regions located between the indentations in the substrate, and wherein the plurality of masked wires extend over the flat regions of the first surface of the substrate.

8. The apparatus of claim 4, wherein the wire masking structure includes a layer of photoresist.

9. The apparatus of claim 4, wherein the wire masking structure includes an interferometric dark mask.

10. The apparatus of claim 4, wherein the plurality of masked wires are less than about 5 μ

m in width.

11. The apparatus of claim 1, wherein the first surface of the substrate includes flat regions located between the indentations in the substrate, and wherein the reflective facet includes an angled sidewall oriented at an angle to the flat regions of the substrate.

12. The apparatus of claim 11, wherein the reflective facet has a frustroconical shape at least about 0.5 μ

m in height.

13. The apparatus of claim 11, wherein the angle at which the angled sidewall is oriented relative to the flat regions of the substrate is between about 40°

and about 50°

.

14. The apparatus of claim 1, wherein the reflective surface includes aluminum.

15. The apparatus of claim 1, wherein the reflective surface includes a metallic ink.

16. The apparatus of claim 1, additionally comprising:

a display substrate, wherein the flexible substrate is located between the display substrate and the reflective facets, and wherein the reflective surfaces of the reflective facets face the display substrate; and

a reflective display located on the opposite side of the display substrate from the flexible substrate.

17. The apparatus of claim 16, wherein the flexible substrate additionally includes a plurality of masked wires formed on the substrate.

18. The apparatus of claim 17, additionally comprising a second flexible substrate located on the opposite side of the first flexible substrate as the display substrate, wherein the second flexible substrate includes a second plurality of masked wires formed on the second flexible substrate, and wherein the first plurality of masked wires extend substantially orthogonally to second plurality of masked wires.

19. The apparatus of claim 16, further comprising:

a processor that is configured to communicate with the display, the processor being configured to process image data; and

a memory device that is configured to communicate with the processor.

20. The apparatus of claim 19, further comprising a driver circuit configured to send at least one signal to the display.

21. The apparatus of claim 20, further comprising a controller configured to send at least a portion of the image data to the driver circuit.

22. The apparatus of claim 19, further comprising an image source module configured to send the image data to the processor.

23. The apparatus of claim 22, wherein the image source module includes at least one of a receiver, transceiver, and transmitter.

24. The apparatus of claim 19, further comprising an input device configured to receive input data and to communicate the input data to the processor.

25. A method of fabricating an apparatus, comprising:

providing a substrate having a plurality of indentations formed in a first surface of the substrate;

forming a reflective layer over the first surface of the substrate;

forming a patterned masking layer over the reflective layer; and

patterning the reflective layer using the patterned masking layer as a mask to form masked reflective facets within the indentations in the first surface of the substrate.

26. The method of claim 25, wherein the substrate is a flexible substrate.

27. The method of claim 25, wherein the substrate is substantially rigid.

28. The method of claim 25, wherein the forming a patterned masking layer includes:

forming a hydrophobic layer over portions of the first surface of the substrate, wherein the hydrophobic layer does not cover the indentations within the first surface of the substrate; and

forming a masking layer over the hydrophobic layer, wherein the portions of the masking layer not in contact with the hydrophobic layer form a patterned masking layer.

29. The method of claim 25, wherein the forming a patterned masking layer includes:

forming a hydrophilic layer within the indentations within the first surface of the substrate; and

forming a masking layer over the hydrophilic layer, wherein the portions of the masking layer in contact with the hydrophilic layer form a patterned masking layer.

30. The method of claim 25, wherein patterning the reflective layer further includes patterning the reflective layer using the masking layer as a mask to form masked wiring extending over flat portions of the first surface of the substrate located between the indentations in the first surface of the substrate.