ROTATIONAL MULTI-LAYER OVERLAY MARKS, APPARATUS, AND METHODS

• US 20130163852A1
• Filed: 12/27/2011
• Published: 06/27/2013
• Est. Priority Date: 12/22/2011
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Inventors: Ghinovker, Mark
• Granted Patent: US 8,781,211 B2
• Time in Patent Office: Days
• US Class Current: 382/149
• CPC Class Codes: G03F 7/70633 Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0004 Industrial image inspection
• CPC Class Codes: G06T 7/32 using correlation-based methods

Abstract

In one embodiment, a semiconductor target for determining overlay error, if any, between two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate is disclosed. The target comprises at least a plurality of first structures that are invariant for a plurality of first rotation angles with respect to a first center of symmetry (COS) of the first structures and a plurality of second structures that are invariant for a plurality of second rotation angles with respect to a second COS of the second structures. The first rotation angles differ from the second rotation angles, and first structures and second structures are formed on different layers of the substrate or separately generated patterns on a same layer of the substrate.

Claims

1. A semiconductor target for determining overlay error, if any, between two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate, the target comprising:

a plurality of first structures that are invariant for a plurality of first rotation angles with respect to a first center of symmetry (COS) of the first structures; and

a plurality of second structures that are invariant for a plurality of second rotation angles with respect to a second COS of the second structures,

wherein the first rotation angles differ from the second rotation angles,

wherein the first structures and the second structures are formed on different layers of the substrate or separately generated patterns on a same layer of the substrate.

2. The target of claim 1, further comprising a plurality of third structures that are invariant for a plurality of third rotation angles with respect to a third COS of the third structures, wherein the third structures, first structures, and the second structures are formed on different layers of the substrate or separately generated patterns on a same layer of the substrate

3. The target of claim 2, wherein the third rotation angles are the same as the first rotation angles.

4. A wafer comprising the target of claim 1 and further comprising a plurality of dummy structures that fill areas around the target'"'"'s first and second structures so as to substantially eliminate empty areas near the target.

5. The wafer of claim 4, wherein the dummy structures have a density that causes the dummy structures to be measured as an unpatterned area so as to reduce cross-talk in determining overlay error in the target.

6. The target of claim 1, wherein the first layer structures each have a shape that differs from a shape of each of the second layer structures.

7. The target of claim 1, wherein the first and second COS are designed to be the same when there is no significant overlay error between the first and second layer structures.

8. The target of claim 1, wherein the first and second COS are designed to have a predefined offset when there is no significant overlay error between the first and second layer structures.

9. The target of claim 1, wherein the target is formed within an active die region of a wafer.

10. A method for determining overlay error, if any, between two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate, the method comprising:

acquiring an image of a plurality of first structures that are designed to be invariant for a plurality of first rotation angles with respect to a first center of symmetry (COS) of the first structures and of a plurality of second structures that are designed to be invariant for a plurality of second rotation angles with respect to a second COS of the second structures, wherein the first rotation angles differ from the second rotation angles and wherein the first structures and the second structures are formed on different layers of the substrate or separately generated patterns on a same layer of the substrate;

determining the first COS of the first structures based on rotating the image by the first rotation angles and determining the second COS of the second structures based on rotating the image by the second rotation angles; and

comparing the determined first and second COS to determine whether there is an overlay error between the first and second structures that is out of specification.

11. The method of claim 10, wherein the image is defined as an unrotated image and determining the first COS comprises:

automatically placing a rotated first image of the unrotated image that has been rotated a selected one of the first rotation angles with respect to an initial first COS; and

moving the rotated first image and the unrotated image with respect to each other and different COS'"'"'s until a best correlation and final COS is found between the first structures in the unrotated image and the rotated first image, wherein the final COS is determined to be the first COS,

wherein determining the second COS comprises;

automatically placing a rotated second image of the unrotated image that has been rotated a selected one of the second rotation angles with respect to an initial second COS; and

moving the rotated second image and the unrotated image with respect to each other and different COS'"'"'s until a best correlation and final COS is found between the second structures in the unrotated image and the rotated second image, wherein the final COS is determined to be the second COS.

12. The method of claim 10, further comprising:

for each one of the first rotation angles and for the first structures, repeating the operations for automatically placing and moving and averaging the final COS'"'"'s together; and

for each one of the second rotation angles and for the second structures, repeating the operations for automatically placing and moving and averaging the final COS'"'"'s together.

13. The method of claim 10, wherein the first and second structures are sized and positioned with respect to each other so as to substantially eliminate cross-talk and overlap of the unrotated image and the rotated first and second images when determining the COS for another one of the first or second structures.

14. The method of claim 10, wherein an overlay error is determined when the first COS differs from the second COS by more than a predetermined amount.

15. The method of claim 10, further comprising:

if an overlay error is found, repairing a wafer upon which the first and second structures were formed.

16. The method of claim 10, further comprising:

filtering a plurality of device structures from the first and second image prior to determining the first and second COS'"'"'s.

17. A method of manufacturing a semiconductor target for determining overlay error, if any, between two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate, comprising:

forming a plurality of first structures of a target that are invariant for a plurality of first rotation angles with respect to a first center of symmetry (COS) of the first structures; and

forming a plurality of second structures the target that are invariant for a plurality of second rotation angles with respect to a second COS of the second structures,

wherein the first rotation angles differ from the second rotation angles,

wherein the first structures and the second structures are formed on different layers of the substrate or separately generated patterns on a same layer of the substrate.

18. The method of claim 17, wherein the first and second structures of the target are formed in a scribe line between active die regions of a wafer.

19. An apparatus for determining overlay error, if any, between two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate, the apparatus comprising:

an optical assembly for acquiring an image of a plurality of first structures that are designed to be invariant for a plurality of first rotation angles with respect to a first center of symmetry (COS) of the first structures and of a plurality of second structures that are designed to be invariant for a plurality of second rotation angles with respect to a second COS of the second structures, wherein the first rotation angles differ from the second rotation angles and wherein the first structures and the second structures are formed on different layers of the substrate or separately generated patterns on a same layer of the substrate;

at least one memory; and

at least one processor, wherein the at least one memory and processor are configured for performing the following operations;

determining the first COS of the first structures based on rotating the image by the first rotation angles and determining the second COS of the second structures based on rotating the image by the second rotation angles; and

comparing the determined first and second COS to determine whether there is an overlay error between the first and second structures that is out of specification.

20. The apparatus of claim 19, wherein the image is defined as an unrotated image and determining the first COS comprises:

automatically placing a rotated first image of the unrotated image that has been rotated a selected one of the first rotation angles with respect to an initial first COS; and

moving the rotated first image and the unrotated image with respect to each other and different COS'"'"'s until a best correlation and final COS is found between the first structures in the unrotated image and the rotated first image, wherein the final COS is determined to be the first COS,

wherein determining the second COS comprises;

automatically placing a rotated second image of the unrotated image that has been rotated a selected one of the second rotation angles with respect to an initial second COS; and

moving the rotated second image and the unrotated image with respect to each other and different COS'"'"'s until a best correlation and final COS is found between the second structures in the unrotated image and the rotated second image, wherein the final COS is determined to be the second COS.

21. The apparatus of claim 20, wherein the at least one memory and processor are further configured for performing the following operations:

for each one of the first rotation angles and for the first structures, repeating the operations for automatically placing and moving and averaging the final COS'"'"'s together; and

for each one of the second rotation angles and for the second structures, repeating the operations for automatically placing and moving and averaging the final COS'"'"'s together.