SENSOR FOR ACQUIRING MUSCLE PARAMETERS

• US 20130165813A1
• Filed: 04/16/2012
• Published: 06/27/2013
• Est. Priority Date: 12/23/2011
• Status: Abandoned Application

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chang, Cheng-Hung, Chiou, Yii-Tay, Huang, Yung-Ching, Fang, Kuan-Jen, Huang, Chun-Hsiang, Liu, Chueh-Shan
• Application Number:
  US13/448,297
• Publication Number:
  US 20130165813A1
• Time in Patent Office: Days
• US Class Current: 600/546
• CPC Class Codes: A61B 2562/0219 Inertial sensors, e.g. accelerometers, gyroscopes, tilt switches
• CPC Class Codes: A61B 5/1107 Measuring contraction of parts of the body, e.g. organ, muscle apparatus for measuring work or force in general G01L
• CPC Class Codes: A61B 5/296 for electromyography [EMG]
• CPC Class Codes: A61B 5/4519 Muscles A61B5/389, A61B5/224 take precedence

Abstract

A sensor for acquiring EMG and MMG signals is provided, including a substrate, an inertial sensing element received in a hole of the substrate, a circuit element disposed on the substrate, a plurality of electrical connecting members connecting the inertial sensing element with the substrate, and a sensing ring disposed on the substrate and surrounding the hole. The electrical connecting members are flexible, and the circuit element and the sensing ring are disposed on opposite sides of the substrate.

Claims

1. A sensor for acquiring EMG and MMG signals, comprising:

a substrate, having an opening;

an inertial sensing element, disposed in the opening;

a circuit element, disposed on the substrate;

a plurality of electrical connecting members, connecting the inertial sensing element with the substrate, wherein the electrical members are flexible, and the circuit element and the circuit element are electrically connected to each other through the electrical connecting members; and

a sensing ring, disposed on the substrate and surrounding the opening, wherein the circuit element and the sensing ring are disposed on opposite sides of the substrate.

2. The sensor for acquiring EMG and MMG signals as claimed in claim 1, wherein the substrate is a flexible printed circuit, and the electrical members and the substrate are integrally formed in one piece.

3. The sensor for acquiring EMG and MMG signals as claimed in claim 1, wherein the inertial sensing element comprises an inertial element or a vibrating element for acquiring the MMG signal.

4. The sensor for acquiring EMG and MMG signals as claimed in claim 1, wherein the sensing ring comprises a capacitive sensing electrode for acquiring the EMG signal.

5. The sensor for acquiring EMG and MMG signals as claimed in claim 1, wherein the inertial sensing element has a rectangular structure, and the electrical connecting members are respectively extended from four sides of the inertial sensing element to the substrate.

6. The sensor for acquiring EMG and MMG signals as claimed in claim 1, wherein the electrical connecting members comprises polyimide.

7. The sensor for acquiring EMG and MMG signals as claimed in claim 1, wherein the electrical connecting members have an S-shaped structure.

8. The sensor for acquiring EMG and MMG signals as claimed in claim 1, wherein the sensor further comprises two sensing rings with a recess formed therebetween.

9. The sensor for acquiring EMG and MMG signals as claimed in claim 1, wherein the sensor further comprises a flexible protection layer covering the sensing ring and the inertial sensing element.

10. The sensor for acquiring EMG and MMG signals as claimed in claim 9, wherein the protection layer comprises silicon gel or polyimide.