Electrical Device, System and Method for Operating with Reduced Acoustic Noise Generation

• US 20130167338A1
• Filed: 10/05/2012
• Published: 07/04/2013
• Est. Priority Date: 12/17/2008
• Status: Active Grant

• Current Assignee: Rockwell Automation Technologies Incorporated (Rockwell Automation, Inc.)
• Original Assignee: Rockwell Automation Technologies Incorporated (Rockwell Automation, Inc.)
• Inventors: Janes, Peter, Shaikh, Riazuddin R.
• Granted Patent: US 9,337,011 B2
• Time in Patent Office: Days
• US Class Current: 29/25.01
• CPC Class Codes: H01L 21/02 Manufacture or treatment of semiconductor devices or of parts thereof
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/1301 Thyristor
• CPC Class Codes: H01L 2924/13034 Silicon Controlled Rectifier [SCR]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/2045 Protection against vibrations
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor

Abstract

Disclosed herein is a device for reducing noise generated by an electrical component, the device including a stiffening component secured to an electrical component, wherein the stiffening component provides rigidity to the electrical component, thereby reducing the mechanical resonance of the electrical component during operation. The electrical component has at least one end face and a flange portion that includes a flange face that extends about a perimeter of the end face. The flange face is substantially parallel to the end face, wherein the stiffening component is secured to the flange face of the electrical component such that it does not extend into a plane of the end face. Further, the stiffening component can include a stiffening portion and a securing portion, wherein the stiffening portion is secured to the flange face of the electrical component by the securing portion. Further, the electrical component can be a power semiconductor device.

Claims

1. A method of operating an electrical component, the method comprising:

providing a stiffening component having a stiffening portion and a securing portion;

securing the stiffening component to the electrical component by way of the securing portion, wherein the stiffening portion provides rigidity to the electrical component; and

operating the electrical component electrically,

whereby, due to the presence of the stiffening component, a level of acoustic noise resulting from the operating of the electrical component is reduced relative to what the level would otherwise be if the stiffening component were absent.

2. The method of claim 1, wherein the securing of the stiffening component includes securing the stiffening component to a flange portion of the electrical component, wherein the flange portion is situated about a perimeter of the electrical component, and the stiffening component is secured to the flange portion by way of the securing portion.

3. The method of claim 1, wherein the electrical component is a semiconductor device.

4. The method of claim 3, wherein the semiconductor device is at least one of an insulated gate bipolar transistor (IGBT), a symmetrical gate commutated thyristor (SGCT), integrated gate commutated thyristor (IGCT), a silicon-controlled rectifier (SCR), or another press-pack power semiconductor device.

5. The method of claim 1, further comprising communicating heat away from the electrical component by way of a portion of the electrical component that extends through the stiffening component so as to be capable of contact with an additional component.

6. The method of claim 1, wherein the stiffening component includes a stiffening portion made from a substantially rigid material.

7. The method of claim 6, wherein the stiffening component additionally includes a securing portion secured to the stiffening portion.

8. The method of claim 6, wherein the substantially rigid material is aluminum.

9. The method of claim 1, wherein the stiffening component includes either a mineral fiber or an acoustic coating.

10. The method of claim 1, wherein the stiffening component is an annular structure defining an interior cavity, and is configured to be secured to the electrical component in a manner by which a portion of the electrical component extends through the interior cavity.

11. A method comprising:

providing a stiffening component having a stiffening portion and a securing portion, wherein the stiffening component is an annular structure defining an interior cavity;

wherein the stiffening component is configured for being positioned around a portion of an electrical component and for being secured to the electrical component by way of the securing portion so that the stiffening portion provides rigidity to the electrical component;

whereby, due to the presence of the stiffening component, a level of acoustic noise that can be generated by the electrical component is reduced relative to what the level would otherwise be if the stiffening component was absent.

12. The method of claim 11, further comprising:

positioning the stiffening component around the portion of the electrical component;

securing the stiffening component to the electrical component by way of the securing portion; and

operating the electrical component electrically.

13. The method of claim 12, further comprising:

further positioning a heat dissipation device so as to be in contact with the portion of the electrical component, whereby a dissipation of heat from the electrical components is facilitated.

14. The method of claim 12, wherein the electrical component is a semiconductor device.

15. The method of claim 14, wherein the electrical component includes a circular end face and an annular flange face, and wherein as a result of the positioning the stiffening component is in contact with the annular flange face.

16. The method of claim 15, wherein an additional stiffening component is also provided and secured to the electrical component.

17. The method of claim 15 wherein, upon the stiffening component being secured to the electrical component, the stiffening component does not extend into a plane of the circular end face.

18. A method comprising:

providing first and second stiffening components each having a respective stiffening portion and a respective securing portion;

positioning each of the stiffening components so that each of the stiffening components is in contact with an electrical component; and

securing the stiffening components to the electrical component by way of the securing portions, wherein rigidity is provided to the electrical component;

whereby a level of acoustic noise that can be generated by the electrical component is reduced relative to what the level would otherwise be.

19. The method of claim 18, wherein each of the stiffening components is annular and wherein the first and second stiffening components are respectively positioned around respective portions of the electrical component.

20. The method of claim 19, further comprising:

further positioning heat dissipation devices so as to be in contact with the portions of the electrical component, whereby a dissipation of heat from the electrical component is facilitated.