VACUUM SEALING PROCESS OF A MEMS PACKAGE

• US 20130167482A1
• Filed: 09/07/2012
• Published: 07/04/2013
• Est. Priority Date: 09/08/2011
• Status: Abandoned Application

• Current Assignee: Advanced Numicro Systems, Inc.
• Original Assignee: Advanced Numicro Systems, Inc.
• Inventors: Fu, Yee-Chung, Tang, Peter Wing-Kau
• Application Number:
  US13/607,618
• Publication Number:
  US 20130167482A1
• Time in Patent Office: Days
• US Class Current: 53/432
• CPC Class Codes: B65B 31/04 Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/035 Soldering

Abstract

A vacuum sealing process of a micro-electrical-mechanical-system (MEMS) package is provided. Solder is applied to the rimmed bottom of a lid for the package. A micro-electro-mechanical system (MEMS) device is attached to a substrate for the package. Solder is applied to a lipped top of the substrate. The lid and the substrate are sealed in an elevated temperature and vacuum environment.

Claims

1. :

A method to vacuum seal a micro-electro-mechanical system (MEMS) package, comprising;

applying a solder to a bottom of a lid for the package;

attaching a MEMS device to a substrate for the package;

applying the solder to a top of the substrate;

aligning the lid and the substrate by fitting the bottom of the lid around the top of the substrate;

applying pressure to the lid against the substrate; and

sealing the lid and the substrate at elevated temperature and under vacuum.

2. :

The method of claim 1, wherein the bottom of the lid comprises a rimmed bottom.

3. :

The method of claim 2, wherein applying a solder to a bottom of a lid for the package comprises applying the solder to lower and side surfaces of the rimmed bottom.

4. :

The method of claim 1, wherein the top of the substrate comprises a metal rectangular ring.

5. :

The method of claim 4, wherein applying the solder to a top of the substrate comprises applying the solder onto the metal rectangular ring.

6. :

The method of claim 1, wherein the bottom of the lid comprises a rimless bottom.

7. :

The method of claim 6, wherein applying a solder to a bottom of a lid for the package comprises applying the solder to lower and side surfaces of the rimless bottom.

8. :

The method of claim 1, wherein the top of the substrate comprises a lipped top.

9. :

The method of claim 8, wherein applying the solder to a top of the substrate comprises applying the solder to top and side surfaces of the lipped top.

10. :

The method of claim 1, further comprising;

applying a flux to the bottom of the lid.

11. :

The method of claim 10, further comprising;

applying the flux to the top of the substrate.

12. :

The method of claim 1, wherein the solder includes a flux.

13. :

The method of claim 1, wherein sealing the lid and the substrate at elevated temperature and under vacuum comprises heating the package at 265°

C. under 1 Torr.

14. :

The method of claim 13, wherein sealing the lid and the substrate at elevated temperature and under vacuum further comprises vibrating the package.

15. :

The method of claim 1, further comprising wire bonding the MEMS device and the substrate.