MICROELECTROMECHANICAL SYSTEM DEVICE WITH ELECTRICAL INTERCONNECTIONS AND METHOD FOR FABRICATING THE SAME
First Claim
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1. A microelectromechanical system device with electrical interconnections comprising:
- a mass including;
a insulation layer of mass dividing the mass into a base conductive layer and a target conductive layer ;
a trench of mass disposed in the target conductive layer, the trench of mass passing through the target conductive layer to the insulation layer of mass and dividing the target conductive layer into a first conductive portion and a second conductive portion which are insulated electrically from each other ;
a conductive through hole of mass passing through the insulation layer of mass and connecting the base conductive layer and the first conductive portion; and
a substrate including ;
at least one electrode disposed on an upper surface of the substrate;
wherein, in a working status, an electrical current flows through the base conductive layer, the conductive through hole of mass and the first conductive portion and an electrical potential difference exists between the second conductive portion and the electrode.
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Abstract
A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.
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Citations
21 Claims
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1. A microelectromechanical system device with electrical interconnections comprising:
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a mass including; a insulation layer of mass dividing the mass into a base conductive layer and a target conductive layer ; a trench of mass disposed in the target conductive layer, the trench of mass passing through the target conductive layer to the insulation layer of mass and dividing the target conductive layer into a first conductive portion and a second conductive portion which are insulated electrically from each other ; a conductive through hole of mass passing through the insulation layer of mass and connecting the base conductive layer and the first conductive portion; and a substrate including ; at least one electrode disposed on an upper surface of the substrate; wherein, in a working status, an electrical current flows through the base conductive layer, the conductive through hole of mass and the first conductive portion and an electrical potential difference exists between the second conductive portion and the electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A microelectromechanical system device with electrical interconnections, being adapted to sense magnetic force, comprising:
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a first anchor including; an first insulation layer dividing the first anchor into an upper conductive layer of the first anchor and a lower conductive layer of the first anchor; an first trench disposed in the lower conductive layer of the first anchor, the first trench passing through the lower conductive layer of the first anchor to the first insulation layer and dividing the lower conductive layer of the first anchor into an inner conductive portion of the first anchor and an outer conductive portion of the first anchor which are insulated electrically from each other; a first conductive through hole disposed in the first anchor, the first conductive through hole passing through the first insulation layer and connecting the upper conductive layer of the first anchor and the outer conductive portion of the first anchor; a second anchor including; an second insulation layer dividing the second anchor into an upper conductive layer of the second anchor and a lower conductive layer of the second anchor; an second trench disposed in the lower conductive layer of the second anchor, the second trench passing through the lower conductive layer of the second anchor to the second insulation layer and dividing the lower conductive layer of the second anchor into an inner conductive portion of the second anchor and an outer conductive portion of the second anchor which are insulated electrically from each other; a mass including; a insulation layer of mass dividing the mass into a base conductive layer and a target conductive layer; a trench of mass, being an open-loop-shaped electrical insulation trench, disposed in the target conductive layer, the trench of mass passing through the target conductive layer to the insulation layer of mass and dividing the target conductive layer into a first conductive portion and a second conductive portion which are insulated electrically from each other; and a conductive through hole of mass passing through the insulation layer of mass and connecting the base conductive layer and the first conductive portion; two torsion springs, each of the torsion springs including; a third insulation layer dividing each of the torsion springs into an upper conductive layer of the torsion spring and a lower conductive layer of the torsion spring; wherein, the base conductive layer is a spiral-shaped conductor with at least one turn; the upper conductive layer of one of the torsion springs connects the upper conductive layer of the first anchor and the base conductive layer, and the lower conductive layer of the one of the torsion springs connects the inner conductive portion of the first anchor and the second conductive portion of the mass; the lower conductive layer of the other torsion spring connects the inner conductive portion of the second anchor and the first conductive portion of the mass. - View Dependent Claims (14, 15, 16)
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17. A method for fabricating a microelectromechanical system device with electrical interconnections, comprising:
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providing a silicon on insulator wafer (SOI wafer), wherein the silicon on insulator wafer includes a device layer, an electrical insulation layer and a handle layer stacked sequentially; etching the device layer to form a recess portion and a plurality of protruding portions; bonding the plurality of protruding portions with a substrate; removing the handle layer; forming a plurality of upper conductive layers on the electrical insulation layer; patterning the device layer such that the plurality of protruding portions is formed to be a plurality of lower conductive layers of a plurality of anchors and the recess portion is formed to be a lower conductive layer of a mass and a lower conductive layer of at least one torsion spring; and patterning the electrical insulation layer to form electrical insulation layers of the anchors, an electrical insulation layer of the mass and an electrical insulation layer of the torsion spring. - View Dependent Claims (18, 19, 20)
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21. A method for fabricating a microelectromechanical system device with electrical interconnections, comprising:
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providing a silicon on insulator wafer(SOI wafer), wherein the silicon on insulator wafer includes a device layer, an electrical insulation layer and a handle layer stacked sequentially; etching the device layer to form a recess portion and a plurality of protruding portions, wherein the recess portion is used to form a lower conductive layer of a mass and a lower conductive layer of at least one torsion spring, and the plurality of protruding portions is used to form lower conductive layers of a plurality of anchors; etching a first trench at the at least one of the protruding portions and etching a trench of mass at the recess portion, wherein the first trench and the trench of mass extend to the electrical insulation layer, the first trench divides the lower conductive layer of the anchor into an inner conductive portion and an outer conductive portion which are insulated electrically from each other, and the trench of mass divides the lower conductive layer of the mass into a first conductive portion and a second conductive portion which are insulated electrically from each other; bonding the plurality of protruding portions with a substrate; removing the handle layer; forming at least one first through hole through the electrical insulation layer on one of the plurality of protruding portions and at lest one second through hole through the electrical insulation layer on the recess portion, wherein a portion of the one of the plurality of protruding portions is exposed in the first through hole and a portion of the recess portion is exposed in the second through hole; forming a plurality of upper conductive layers on the electrical insulation layer and filling the upper conductive layers in the first through hole and the second through hole to form a first conductive through hole and a conductive through hole of mass; and patterning the device layer such that the plurality of protruding portions is formed to be the lower conductive layers of the anchors including a first anchor and a second anchor, and the recess portion is formed to be the lower conductive layer of the mass and the lower conductive layer of the at least one torsion spring; and patterning the electrical insulation layer to form electrical insulation layers of the anchors including the first anchor and the second anchor, an electrical insulation layer of the mass and an electrical insulation layer of the torsion spring, wherein the first conductive through hole and the conductive through hole of mass pass through the electrical insulation layers, the first conductive through hole connects the upper conductive layer of the first anchor and the outer conductive portion of the first anchor, the conductive through hole of mass connects the upper conductive layer of the mass and the first conductive portion, the first conductive portion electrically couples the inner conductive portion of the second anchor and the second conductive portion electrically couples the inner conductive portion of the first anchor.
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Specification