MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING SAME

• US 20130168148A1
• Filed: 11/24/2011
• Published: 07/04/2013
• Est. Priority Date: 12/06/2010
• Status: Abandoned Application

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Kanai, Toshinobu, Saito, Ryuichi, Higashitani, Hideki
• Application Number:
  US13/822,446
• Publication Number:
  US 20130168148A1
• Time in Patent Office: Days
• US Class Current: 174/262
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/0191 wherein the thickness of the dielectric plays an important role
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2203/068 Features of the lamination press or of the lamination process, e.g. using special separator sheets
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/462 characterized by laminating only or mainly similar double-sided circuit boards
• CPC Class Codes: H05K 3/4638 Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A multilayer wiring board includes a double-sided wiring board, an insulating substrate stacked on the double-sided wiring board, vias provided in through-holes in the insulating substrate, an outermost wiring on an upper surface of the insulating substrate, a first fiducial mark provided on the double-sided wiring board, and a second fiducial mark provided on the insulating substrate. The first fiducial mark contains a wiring of the double-sided wiring board. The second fiducial mark contains at least one via out of the vias. The first and second fiducial marks are provided for positioning the double-sided wiring board and the insulating substrate to each other. This multilayer wiring board includes layers positioned precisely.

Claims

1. A multilayer wiring board comprising:

a first double-sided wiring board including

a first insulating board,

a plurality of first wirings provided on an upper surface of the first insulating board and made of conductive foil, and

a plurality of second wirings provided on a lower surface of the first insulating board and made of conductive foil;

a first insulating substrate stacked on the first double-sided wiring board, the first insulating substrate having a lower surface situated on the upper surface of the first insulating board such that the first wirings are embedded in the first insulating substrate, the first insulating substrate having a plurality of first through-holes provided therein;

a plurality of first vias each of which is provided in respective one of the first through-holes of the first insulating substrate;

an outermost wiring formed on an upper surface of the first insulating substrate;

a first fiducial mark provided on the first double-sided wiring board to position the first double-sided wiring board;

a second fiducial mark provided on the first insulating substrate to position the first insulating substrate;

a second insulating substrate stacked on the first double-sided wiring board, the second insulating substrate having an upper surface situated on a lower surface of the first double-sided wiring board such that the second wirings are embedded into the second insulating substrate, the second insulating substrate having a plurality of second through-holes provided therein;

a plurality of second vias each of which is provided in respective one of the second through-holes of the second insulating substrate; and

a third fiducial mark provide on the second insulating substrate in order to position the second insulating substrate,

wherein one of the plurality of first vias is connected with the outermost wiring and one first wiring out of the plurality of first wirings,

wherein the first fiducial mark contains at least one wiring out of the plurality of first wirings and the plurality of second wirings,

wherein the second fiducial mark contains at least one first via out of the first vias,

wherein the at least one first via of the second fiducial mark is located on a first circle,

wherein the third fiducial mark contains at least one second via out of the plurality of second vias,

wherein the first double-sided wiring board, the first insulating substrate, and the second insulating substrate are stacked in a lamination direction; and

wherein, viewing in the lamination direction, the at least one second via of the third fiducial mark is located on a second circle which is concentric with the first circle and which has a diameter different from a diameter of the first circle.

4. The multilayer wiring board according to claim 1, further comprising:

a second double-sided wiring board including

a second insulating board having an upper surface situated on a lower surface of the second insulating substrate,

a plurality of third wirings provided on the upper surface of the second insulating board, the third wirings being made of conductive foil such that the plurality of third wirings are embedded into the second insulating substrate, and

a plurality of fourth wirings provided on a lower surface of the second insulating board, the fourth wirings being made of conductive foil; and

a fourth fiducial mark provided on the second double-sided wiring board to position the second double-sided wiring board,

wherein the fourth fiducial mark contains at least one wiring out of the plurality of third wirings and the plurality of fourth wirings, and

wherein the at least one wiring of the first fiducial mark has a different shape or size from the at least one wiring of the fourth fiducial mark.

5. The multilayer wiring board according to claim 4,

wherein the first double-sided wiring board, the second double-sided wiring board, the first insulating substrate, and the second insulating substrate are stacked in the lamination direction,

wherein the first fiducial mark has a circular shape,

wherein the fourth fiducial mark has a circular shape, and

wherein, viewing in the lamination direction, one fiducial mark of the first fiducial mark and the fourth fiducial mark has a diameter enclosing another fiducial mark of the first fiducial mark and the fourth fiducial mark.

6. The multilayer wiring board according to claim 1, further comprising a test coupon including:

a first no-wiring portion provided in one of the first wirings;

a second no-wiring portion provided in one of the second wirings and located directly under the first no-wiring portion; and

a third no-wiring portion provided in the outermost wiring and located directly above the first no-wiring portion.

7. The multilayer wiring board according to claim 6, wherein the test coupon further includes:

a fourth no-wiring portion provided in the one of the first wirings and having a different area from the first no-wiring portion;

a fifth no-wiring portion provided in the one of the second wirings and located directly under the fourth no-wiring portion, the fifth no-wiring portion having a different area from the second no-wiring portion; and

a sixth no-wiring portion provided in the outermost wiring and located directly above the fourth no-wiring portion, the sixth no-wiring portion having a different area from the third no-wiring portion.

8. The multilayer wiring board according to claim 6, wherein the first no-wiring portion of in the test coupon has an area identical to an area of a non-wiring portion on the upper surface of the double-sided wiring board.

2. (canceled)

3. (canceled)

9. A method of manufacturing a multilayer wiring board, the method comprising:

providing a double-sided wiring board which includes

an insulating board,

a plurality of first wirings provided on an upper surface of the insulating board and made of conductive foil,

a plurality of second wirings provided on a lower surface of the insulating board and made of conductive foil, and

a first fiducial mark containing at least one wiring out of the plurality of first wirings and the plurality of second wirings;

providing an insulating substrate having a plurality of through-holes provided therein;

forming a plurality of first vias in the through-holes of the insulating substrate, respectively such that the insulating substrate has a second fiducial mark containing at least one first via out of the plurality of first vias;

providing a laminated body which includes the insulating substrate, the double-sided wiring board, and an outermost wiring material provided on an upper surface of the insulating substrate, the outermost wiring material contacting one of the first vias, such that the upper surface of the insulating board faces a lower surface of the insulating substrate in a lamination direction;

heating and pressing to the laminated body; and

forming an outermost wiring connected to the one of the first vias by patterning the outermost wiring material,

wherein said providing the laminated body comprises positioning the double-sided wiring board and the insulating substrate such that the upper surface of the insulating board of the double-sided wiring board faces the lower surface of the insulating substrate in the lamination direction, and that one of the first fiducial mark and the second fiducial mark encloses another of the first fiducial mark and the second fiducial mark viewing in the lamination direction, and

wherein said heating and pressing to the laminated body comprises heating and pressing the laminated body such that the plurality of first wirings of the double-sided wiring board are embedded in the insulating substrate.

10. The method according to claim 9, wherein said providing the double-sided wiring board comprises:

laminating protective films on the upper surface and the lower surface of the insulating board;

forming through-holes in the insulating board having the protective films laminated thereon;

filling the through-holes with conductive paste;

removing the protective films after said filling the through-holes with the conductive paste;

stacking a first wiring material and a second wiring material on the upper surface and the lower surface of the insulating substrate, respectively, after said removing the protective films; and

forming the plurality of first wirings and the plurality of second wirings by patterning the first wiring material and the second wiring material.

11. The method according to claim 9,

wherein the laminated body has a welding area, and

wherein said providing the laminated body comprises temporally fixing a portion of the insulating substrate to the insulating board of the double-sided wiring by welding the portion of the insulating substrate to the insulating board of the double-sided wiring board by heating and pressing the welding area with a heating tool.

12. The method according to claim 11,

wherein the double-sided wiring board further includes a second via passing through the insulating board and being connected to one of the plurality of first wirings and to one of the plurality of second wirings, and

wherein in the welding area, one first via of the plurality of first vias is connected with the second via through one of the plurality of first wirings.

13. The method according to claim 11, wherein in the welding area, the insulating substrate is exposed from the outermost wiring.

14. The method according to claim 9,

wherein the double-sided wiring board further includes:

a first no-wiring portion provided in one of the plurality of first wirings; and

a second no-wiring portion provided in one of the plurality of second wirings and located directly under the first no-wiring portion,

wherein said method further comprises;

forming a third no-wiring portion in the outermost wiring, the third no-wiring portion being located directly above the first no-wiring portion; and

detecting a light transmittance of the laminated body by irradiating laminated body with light.

15. The method according to claim 14,

wherein the first no-wiring portion, the second no-wiring portion, and the third no-wiring portion constitute a test coupon, and

wherein said detecting the light transmittance of the laminated body comprises detecting the light transmittance of the laminated body by irradiating the test coupon of the laminated body with the light.