INTEGRATED COMPACT MEMS DEVICE WITH DEEP TRENCH CONTACTS
First Claim
1. A compact MEMS motion sensor device, applicable to both flip chip and wire bonding technologies, said device comprising:
- a CMOS substrate layer;
a plurality of anchor posts, embedded inside and penetrating through said CMOS substrate, each said anchor post having an isolation oxide layer surrounding a conductive layer;
a CMOS ASIC device module, fabricated on top side of said CMOS substrate layer, further comprising;
a field oxide (FOX) layer;
a first set of implant doped silicon areas forming CMOS wells;
a second set of implant doped silicon areas forming CMOS sources/drains;
a first polysilicon layer forming CMOS transistor gates, said CMOS wells, said CMOS transistor sources/drains and said CMOS gates forming CMOS transistors;
an oxide layer embedded with a plurality of metal layers interleaved with a plurality of via hole layers, a first via hole layer of said plurality of via hole layers acting as CMOS contact and remaining via hole layers acting as CMOS vias, said metals layers and via hole layers forming a scribe seal;
a Nitride deposition layer;
an under bump metal (UBM) layer; and
a plurality of solder spheres, said UBM layer and said solder spheres forming flip chip bump layer; and
a MEMS device module, attached on backside of said CMOS substrate layer, further comprising;
a backside interconnect isolation oxide layer, for isolating said MEMS device module from said CMOS substrate layer;
a first MEMS bonding layer;
a second MEMS bonding layer;
a first metal compound layer, located at and resulted from an eutectic bonding process between bonding said first MEMS bonding layer and said second MEMS bonding layer;
a MEMS layer, having a plurality of via holes for forming MEMS motion fingers;
a first MEMS eutectic bonding layer,a second MEMS eutectic bonding layer;
a second metal compound layer, located at and resulted from an eutectic bonding process between bonding said first MEMS eutectic bonding layer and said second MEMS eutectic bonding layera second MEMS eutectic bonding layer, anda MEMS cap layer;
wherein a plurality of cavities existing between said backside interconnect isolation oxide layer and said second MEMS bonding layer, and a gap existing between said MEMS layer and said MEMS cap layer, said via holes in said MEMS layer connecting said cavities and said gap;
said anchor post serving as signal interconnects and anchors for said MEMS device module and said CMOS ASIC module.
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Accused Products
Abstract
A compact MEMS motion sensor device is provided, including a CMOS substrate layer, with plural anchor posts having an isolation oxide layer surrounding a conductive layer. On one side of CMOS substrate layer, the device further includes a field oxide (FOX) layer, a first set and a second set of implant doped silicon areas, a first polysilicon layer, an oxide layer embedded with plural metal layers interleaved with via hole layers, a Nitride deposition layer, an under bump metal (UBM) layer and a plurality of solder spheres. On the other side of CMOS substrate layer, the present invention further includes a backside interconnect isolation oxide layer, a first MEMS bonding layer, a first metal compound layer, a second MEMS bonding layer, a MEMS layer, a first MEMS eutectic bonding layer, a second metal compound layer, a second MEMS eutectic bonding layer, and a MEMS cap layer.
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Citations
20 Claims
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1. A compact MEMS motion sensor device, applicable to both flip chip and wire bonding technologies, said device comprising:
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a CMOS substrate layer; a plurality of anchor posts, embedded inside and penetrating through said CMOS substrate, each said anchor post having an isolation oxide layer surrounding a conductive layer; a CMOS ASIC device module, fabricated on top side of said CMOS substrate layer, further comprising; a field oxide (FOX) layer; a first set of implant doped silicon areas forming CMOS wells; a second set of implant doped silicon areas forming CMOS sources/drains; a first polysilicon layer forming CMOS transistor gates, said CMOS wells, said CMOS transistor sources/drains and said CMOS gates forming CMOS transistors; an oxide layer embedded with a plurality of metal layers interleaved with a plurality of via hole layers, a first via hole layer of said plurality of via hole layers acting as CMOS contact and remaining via hole layers acting as CMOS vias, said metals layers and via hole layers forming a scribe seal; a Nitride deposition layer; an under bump metal (UBM) layer; and a plurality of solder spheres, said UBM layer and said solder spheres forming flip chip bump layer; and a MEMS device module, attached on backside of said CMOS substrate layer, further comprising; a backside interconnect isolation oxide layer, for isolating said MEMS device module from said CMOS substrate layer; a first MEMS bonding layer; a second MEMS bonding layer; a first metal compound layer, located at and resulted from an eutectic bonding process between bonding said first MEMS bonding layer and said second MEMS bonding layer; a MEMS layer, having a plurality of via holes for forming MEMS motion fingers; a first MEMS eutectic bonding layer, a second MEMS eutectic bonding layer; a second metal compound layer, located at and resulted from an eutectic bonding process between bonding said first MEMS eutectic bonding layer and said second MEMS eutectic bonding layer a second MEMS eutectic bonding layer, and a MEMS cap layer; wherein a plurality of cavities existing between said backside interconnect isolation oxide layer and said second MEMS bonding layer, and a gap existing between said MEMS layer and said MEMS cap layer, said via holes in said MEMS layer connecting said cavities and said gap;
said anchor post serving as signal interconnects and anchors for said MEMS device module and said CMOS ASIC module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification