Programmable Interposer with Conductive Particles
First Claim
1. A programmable interposer comprising:
- top and bottom interface electrodes;
conductive particles interspersed within said programmable interposer;
said conductive particles being capable of forming an aligned configuration between said top and bottom interface electrodes in response to application of an energy field to said programmable interposer so as to electrically connect said top and bottom interface electrodes.
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Accused Products
Abstract
An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable interposer. The conductive particles are capable of forming an aligned configuration between the top and bottom interface electrodes in response to application of an energy field to the programmable interposer so as to electrically connect the top and bottom interface electrodes. The conductive particles can have a conductive outer surface. Also, the conductive particles can be spherical. The conductive particles can be within a bulk material in an interface layer in the programmable interposer, and the bulk material can be cured to secure programmed paths between the top and bottom interface electrodes.
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Citations
20 Claims
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1. A programmable interposer comprising:
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top and bottom interface electrodes; conductive particles interspersed within said programmable interposer; said conductive particles being capable of forming an aligned configuration between said top and bottom interface electrodes in response to application of an energy field to said programmable interposer so as to electrically connect said top and bottom interface electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor package comprising:
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a programmed interposer having a top interface electrode and a bottom interface electrode; said programmed interposer including a programmed path formed from conductive particles, said programmed path electrically connecting said top and bottom interface electrodes; a semiconductor die electrically connected to said top interface electrode and said bottom interface electrode of said programmed interposer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for fabricating a programmed interposer comprising:
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applying an energy field to a programmable interposer to move conductive particles situated within said programmable interposer for forming an aligned configuration between top and bottom interface electrodes of said programmable interposer; securing said conductive particles into a programmed path between said top and said bottom interface electrodes of said programmable interposer. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification