ULTRASONIC TRANSDUCER STRUCTURE, ULTRASONIC TRANSDUCER, AND METHOD OF MANUFACTURING ULTRASONIC TRANSDUCER
First Claim
Patent Images
1. An ultrasonic transducer structure comprising:
- a driving wafer that comprises a driving circuit; and
an ultrasonic transducer wafer that is disposed on the driving wafer, the ultrasonic transducer wafer comprising a first wafer having a via-hole therein, a first insulating layer disposed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity provided between the first insulating layer and the second wafer.
1 Assignment
0 Petitions
Accused Products
Abstract
An ultrasonic transducer structure, an ultrasonic transducer, and a method of manufacturing the ultrasonic transducer are provided. The ultrasonic transducer structure includes a driving wafer that includes a driving circuit; and an ultrasonic transducer wafer that is disposed on the driving wafer and includes a first wafer in which a via-hole is formed, a first insulating layer formed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity formed between the first insulating layer and the second wafer.
-
Citations
27 Claims
-
1. An ultrasonic transducer structure comprising:
-
a driving wafer that comprises a driving circuit; and an ultrasonic transducer wafer that is disposed on the driving wafer, the ultrasonic transducer wafer comprising a first wafer having a via-hole therein, a first insulating layer disposed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity provided between the first insulating layer and the second wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. An ultrasonic transducer comprising:
-
a first substrate that comprises a driving circuit; a first insulating layer that is disposed on the first substrate; a second substrate that is disposed on the first insulating layer and has a via-hole therein; a support portion that is disposed above and spaced apart from the second substrate; a thin film that is supported by the support portion and is spaced apart from the second substrate; and a cavity between the second substrate and the thin film, wherein the first substrate and the second substrate are directly bonded to each other with the first insulating layer therebetween. - View Dependent Claims (10, 11, 12, 13, 14)
-
-
15. A method of manufacturing an ultrasonic transducer, the method comprising:
-
depositing a first insulating layer on a first wafer; patterning the first insulating layer to form a gap in the first insulating layer; depositing a second insulating layer on a second wafer; bonding the first wafer to the second wafer such that the first insulating layer and the second insulating layer face each other; forming a via-hole in the second wafer; depositing a third insulating layer on an exposed surface of the second wafer; forming a metal layer on the third insulating layer; forming a first connecting portion and a second connecting portion by patterning the metal layer; preparing a third wafer that comprises a driving circuit, and a third connecting portion and a fourth connecting portion respectively corresponding to the first connecting portion and the second connecting portion; and bonding the third wafer to the second wafer. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24)
-
-
25. A method of manufacturing an ultrasonic transducer, the method comprising:
-
bonding an ultrasonic transducer wafer including a plurality of chips to a wafer including a driving circuit in a wafer-to-wafer manner to form an ultrasonic transducer structure; and slicing the wafer structure in units of the chips to produce individual ultrasonic transducers. - View Dependent Claims (26, 27)
-
Specification