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ULTRASONIC TRANSDUCER STRUCTURE, ULTRASONIC TRANSDUCER, AND METHOD OF MANUFACTURING ULTRASONIC TRANSDUCER

  • US 20130169110A1
  • Filed: 09/14/2012
  • Published: 07/04/2013
  • Est. Priority Date: 12/28/2011
  • Status: Active Grant
First Claim
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1. An ultrasonic transducer structure comprising:

  • a driving wafer that comprises a driving circuit; and

    an ultrasonic transducer wafer that is disposed on the driving wafer, the ultrasonic transducer wafer comprising a first wafer having a via-hole therein, a first insulating layer disposed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity provided between the first insulating layer and the second wafer.

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