ULTRASOUND PROBE AND MANUFACTURING METHOD THEREOF

• US 20130169112A1
• Filed: 12/31/2012
• Published: 07/04/2013
• Est. Priority Date: 01/02/2012
• Status: Active Grant

• Current Assignee: Samsung Medison Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Medison Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: SEO, Min Seon, KIM, Ji Seon, LEE, Sung Jae
• Granted Patent: US 9,203,012 B2
• Time in Patent Office: Days
• US Class Current: 310/327
• CPC Class Codes: A61B 8/4494 characterised by the arrangement of the transducer elements devices for short-range imaging using particular transducer elements arrangements under G01S15/8909; arrangements of transducers in generation of mechanical vibrations of infrasonic, sonic or ultrasonic frequency B06B1/0607
• CPC Class Codes: B06B 1/0629 Square array
• CPC Class Codes: B06B 1/064 with multiple active layers
• CPC Class Codes: G10K 11/002 Devices for damping, suppressing, obstructing or conducting sound in acoustic devices G10K1/06 - G10K1/10 take precedence; for electro-mechanical transducers for communication H04R3/002
• CPC Class Codes: H10N 30/03 Assembling devices that include piezoelectric or electrostrictive parts
• CPC Class Codes: H10N 30/1071 with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
• CPC Class Codes: H10N 30/80 Constructional details
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

An ultrasound probe including a backing layer provided with grooves in which a piezoelectric member is allowed to be installed and a manufacturing method thereof. The ultrasound probe includes the piezoelectric member, and the backing layer disposed on a rear-side surface of the piezoelectric member and provided, on a front-side surface thereof, with grooves in which the piezoelectric member is installed.

Claims

1. An ultrasound probe comprising:

a piezoelectric member; and

a backing layer disposed on a rear-side surface of the piezoelectric member and provided, on a front-side surface of the backing layer, with at least one groove in which the piezoelectric member is installed.

2. The ultrasound probe according to claim 1, wherein:

the piezoelectric member is arranged as one of a one-dimensional array and a two-dimensional array, and

the at least one groove has a shape corresponding to the array of the piezoelectric member.

3. The ultrasound probe according to claim 2, wherein a ground electrode is formed on at least one side of each of elements constituting the array of the piezoelectric member, and a signal electrode is formed on at least one side of each of the elements including a side opposite to the side on which the ground electrode is formed.

4. The ultrasound probe according to claim 2, wherein at least one conductive pattern to apply an electric signal to the array of the piezoelectric member is installed in the at least one groove.

5. The ultrasound probe according to claim 4, wherein the at least one conductive pattern is formed on at least one side of the at least one groove.

6. The ultrasound probe according to claim 4, wherein the at least one conductive pattern is electrically connected with at least one of a ground electrode and a signal electrode formed on an element of the array of the piezoelectric member to apply an electric signal to the element.

7. An ultrasound probe comprising:

a piezoelectric member; and

a matching layer disposed on a front-side surface of the piezoelectric member and provided, on a rear-side surface of the matching layer, with at least one groove in which the piezoelectric member is installed.

8. The ultrasound probe according to claim 7, wherein:

the piezoelectric member is arranged as one of a one-dimensional array and a two-dimensional array; and

the at least one groove has a shape corresponding to the array of the piezoelectric member.

9. The ultrasound probe according to claim 8, wherein a ground electrode is formed on at least one side of each of elements constituting the array of the piezoelectric member, and a signal electrode is formed on at least one side of each of the elements including a side opposite to the side on which the ground electrode is formed.

10. The ultrasound probe according to claim 8, wherein at least one conductive pattern to apply an electric signal to the array of the piezoelectric member is installed in the at least one groove.

11. The ultrasound probe according to claim 10, wherein the at least one conductive pattern is formed on at least one side of the at least one groove.

12. The ultrasound probe according to claim 10, wherein the at least one conductive pattern is electrically connected with at least one of a ground electrode and a signal electrode formed on an element of the array of the piezoelectric member to apply an electric signal to the element.

13. A manufacturing method of an ultrasound probe comprising:

forming at least one groove on one side of a backing layer; and

installing a piezoelectric member in the at least one groove.

14. The manufacturing method according to claim 13, wherein the forming at least one groove comprises:

arranging, on the one side of the backing layer, the at least one groove in one of a one-dimensional array and a two-dimensional array; and

forming, on at least one side of the at least one groove, at least one conductive pattern to apply an electric signal to the array of the piezoelectric member.

15. The manufacturing method according to claim 13, wherein the installing a piezoelectric member comprises:

installing a matching layer on one side of the piezoelectric member;

processing the piezoelectric member on which the matching layer is installed into one of a one-dimensional array and a two-dimensional array;

forming a ground electrode and a signal electrode on each of elements constituting the array of the processed piezoelectric member; and

installing, in the at least one groove, the array of the piezoelectric member provided with the ground and signal electrodes.

16. The manufacturing method according to claim 15, wherein the forming a ground electrode and a signal electrode comprises:

forming the ground electrode on at least one side of each element constituting the array of the processed piezoelectric member; and

forming the signal electrode on at least one side of each element including a side opposite to the side on which the ground electrode is formed.

17. The manufacturing method according to claim 15, wherein at least one conductive pattern is formed in the at least one groove to be electrically connected with at least one of the ground electrode and the signal electrode to apply an electric signal to the element.

18. A manufacturing method of an ultrasound probe comprising:

forming at least one groove on one side of a matching layer; and

installing a piezoelectric member in the at least one groove.

19. The manufacturing method according to claim 18, wherein the forming at least one groove comprises:

arranging, on the one side of the matching layer, the at least one groove in one of a one-dimensional array and a two-dimensional array; and

forming, on at least one side of the at least one groove, at least one conductive pattern to apply an electric signal to the array of the piezoelectric member.

20. The manufacturing method according to claim 18, wherein the installing a piezoelectric member comprises:

processing the piezoelectric member into one of a one-dimensional array and a two-dimensional array;

forming a ground electrode and a signal electrode on each of elements constituting the array of the processed piezoelectric member; and

installing, in the at least one groove, the array of the piezoelectric member provided with the ground and signal electrodes.

21. The manufacturing method according to claim 20, wherein the forming a ground electrode and a signal electrode comprises:

forming the ground electrode on at least one side of each element constituting the array of the processed piezoelectric member; and

forming the signal electrode on at least one side of each element including a side opposite to the side on which the ground electrode is formed.

22. The manufacturing method according to claim 20, wherein at least one conductive pattern is formed in the at least one groove to be electrically connected with at least one of the ground electrode and the signal electrode to apply an electric signal to the element.

23. An ultrasound probe comprising:

a piezoelectric member including a front-side surface and a rear-side surface;

a backing layer disposed on the rear-side surface for absorbing at least a portion of ultrasonic waves generated in the piezoelectric member; and

a matching layer disposed on the front-side surface for reducing a difference in acoustic impedance between the piezoelectric member and a subject,

wherein at least one of the backing layer and matching layer includes a groove in which the piezoelectric member is installed.

24. The ultrasound probe of claim 23, wherein the backing layer includes the groove.

25. The ultrasound probe of claim 23, wherein the matching layer includes the groove.

26. The ultrasound probe of claim 23, wherein a conductive pattern is formed in the groove to apply an electric signal to the piezoelectric member.

27. The ultrasound probe of claim 26, wherein an electrode is formed on a surface of the piezoelectric member and electrically coupled to the conductive pattern.