PCB HEAT SINK FOR POWER ELECTRONICS

• US 20130170136A1
• Filed: 12/31/2011
• Published: 07/04/2013
• Est. Priority Date: 12/31/2011
• Status: Abandoned Application

• Current Assignee: Joshua L. Roby
• Original Assignee: Joshua L. Roby
• Inventors: Roby, Joshua L.
• Application Number:
  US13/341,994
• Publication Number:
  US 20130170136A1
• Time in Patent Office: Days
• US Class Current: 361/692
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201

Abstract

A PCB with improved cooling. Openings are provided below electronic components on the PCB of an electronics device. Raised mounts or bosses on the device housing or base extend into the openings and make contact with the electronic components to act as heat sinks. A thermal pad member can be positioned between the bosses and the components to aid in the contact and heat conduction. Other embodiments include direct contact of the raised mounts or bosses with the PCB and through openings are not provided.

Claims

1. A power electronics cooling system comprising:

a base member;

a PCB positioned adjacent to said base member;

said PCB having at least one opening;

an electronic component positioned on the PCB over said opening;

a raised boss on said base member positioned to mate with said opening and having a height to make contact with the electronic component.

2. The cooling system as described in claim 1 wherein:

a plurality of openings are provided in the PCB;

at least two electronic components are provided, each of said two electronic components being positioned over one of said plurality of openings;

at least two raised bosses one provided in said base member;

said two raised bosses being positioned to mate with said openings under said two electronic components and having a height to make contact with said electronic components.

3. The cooling system as described in claim 1 further comprising a thermally conductive pad member positioned on said raised boss and between said boss and said electronic components.

4. The cooling system as described in claim 2 further comprising at least two conductive pad members are provided, each of said conductive pad member positioned on one of said bosses and between said boss and one of said electronic components.

5. The cooling system as described in claim 3 wherein said conductive pad members are thermal gap pad members.

6. The cooling system as described in claim 4 wherein said conductive pad members are thermal gap pad members.

7. The cooling system as described in claim 1 wherein said openings in said PCB are through-openings.

8. The cooling system as described in claim 1 wherein said boss member is made of aluminum or another heat conducting material.

9. The cooling system as described in claim 2 wherein each of said openings in said PCB are through-openings.

10. A power electronics cooling system comprising a base member, a PCB positioned on said base member, at least one electronic device positioned on the upper surface of the PCB, a raised boss member on said base member and being in contact with the lower surface of the PCB directly beneath said one electronic device.

11. The power electronics cooling system as described in claim 10 wherein a plurality of electronic devices and corresponding raised bosses are provided.

12. The power electronics cooling system as described in claim 10 further comprising a heat sink tab positioned on said raised boss.

13. The power electronics cooling system as described in claim 11 wherein heat sink tabs are positioned on all of said raised bosses.