METHOD FOR FABRICATING TRANSFER PRINTING SUBSTRATE USING CONCAVE-CONVEX STRUCTURE, TRANSFER PRINTING SUBSTRATE FABRICATED THEREBY AND APPLICATION THEREOF

• US 20130171337A1
• Filed: 12/12/2012
• Published: 07/04/2013
• Est. Priority Date: 12/19/2011
• Status: Active Grant

• Current Assignee: Gwangju Institute of Science and Technology
• Original Assignee: Gwangju Institute of Science and Technology
• Inventors: KO, Heung Cho, KIM, Seok Ho, YOON, Jongwon, HWANG, Young Kyu, YUN, Su Ok, JANG, Hun Soo, PARK, Seong-Ju, CHO, Hyun-A, NOH, Byeong-Il, CHUN, Jaeyi
• Granted Patent: US 9,005,709 B2
• Time in Patent Office: Days
• US Class Current: 427/58
• CPC Class Codes: B32B 3/30 characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B41C 1/00 Forme preparation
• CPC Class Codes: B41N 1/12 non-metallic other than stone , e.g. printing plates or foils comprising inorganic materials in an organic matrix B41N1/003, B41N1/006 take precedence
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: Y10T 428/24521 with component conforming to contour of nonplanar surface
• CPC Class Codes: Y10T 428/24529 and conforming component on an opposite nonplanar surface

Abstract

A method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. This process of manufacturing provides a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process.

Claims

1. A method for fabricating a substrate for transfer printing, comprising:

preparing a handling substrate having a concave-convex structure formed thereon;

forming a sacrificial layer along the concave-convex structure on the handling substrate;

coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure;

removing the sacrificial layer from the handling substrate.

2. The method according to claim 1, further comprising:

patterning the polymer substrate to divide the polymer substrate before removing the sacrificial layer.

3. The method according to claim 1, wherein the concave-convex structure is formed by etching the handling substrate through reactive ion etching.

4. The method according to claim 1, wherein the concave portion of the concave-convex structure has a pot-shaped longitudinal cross-section, an inlet of which is smaller than a belly thereof.

5. The method according to claim 1, wherein the sacrificial layer formed on an upper surface of the convex portion of the concave-convex structure is thicker than the sacrificial layer formed on a lower surface of the concave portion of the concave-convex structure.

6. The method according to claim 1, wherein the coating a polymer is performed using a solution process.

7. The method according to claim 1, wherein the removing the sacrificial layer is performed by wet etching.

8. The method according to claim 1, wherein the sacrificial layer is composed of a water soluble polymer, and the removing the sacrificial layer is performed using water.

9. The method according to claim 8, wherein, after removing the sacrificial layer, the water soluble polymer remains at least within the concave portion of the concave-convex structure.

10. The method according to claim 8, wherein the removing the sacrificial layer comprises adjusting interfacial adhesion between the handling substrate and the polymer substrate by adjusting a degree of etching the water soluble polymer using water.

11. A substrate for transfer printing fabricated by the method according to claim 1, comprising:

a handling substrate having a concave-convex structure formed thereon; and

a polymer substrate placed on the concave-convex structure of the handling substrate and comprising bumps inserted into a concave portion of the concave-convex structure.

12. The substrate for transfer printing according to claim 11, wherein the concave portion of the concave-convex structure has a pot-shaped longitudinal cross-section, an inlet of which is smaller than a belly thereof, and the bumps of the polymer substrate have a shape corresponding to the shape of the concave portion of the concave-convex structure.

13. The substrate for transfer printing according to claim 11, wherein a separation space is defined at least in some region between the handling substrate and the polymer substrate.

14. The substrate for transfer printing according to claim 11, wherein a separation space is defined at least in some region between an upper surface of the convex portion of the concave-convex structure and a lower surface of the polymer substrate.

15. The substrate for transfer printing according to claim 11, wherein the polymer substrate is divided into a plurality of substrates according to a predetermined pattern, and each of the divided substrates is bound to the concave portion of the concave-convex structure by the bumps to maintain arrangement of the divided substrates.

16. The substrate for transfer printing according to claim 11, wherein a water soluble polymer is interposed at least within the concave portion of the concave-convex structure between the handling substrate and the polymer substrate and acts as an interfacial adhesive material between the handling substrate and the polymer substrate.

18. A substrate for transfer printing fabricated by the method according to claim 2, comprising:

a handling substrate having a concave-convex structure formed thereon; and

a polymer substrate placed on the concave-convex structure of the handling substrate and comprising bumps inserted into a concave portion of the concave-convex structure.

19. A substrate for transfer printing fabricated by the method according to claim 2, comprising:

a handling substrate having a concave-convex structure formed thereon; and

a polymer substrate placed on the concave-convex structure of the handling substrate and comprising bumps inserted into a concave portion of the concave-convex structure.

20. A substrate for transfer printing fabricated by the method according to claim 3, comprising:

a handling substrate having a concave-convex structure formed thereon; and

a polymer substrate placed on the concave-convex structure of the handling substrate and comprising bumps inserted into a concave portion of the concave-convex structure.

17. A method for fabricating an electronic device for transfer printing, comprising:

preparing a handling substrate having a concave-convex structure formed thereon;

forming a sacrificial layer along the concave-convex structure on the handling substrate;

coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and

removing the sacrificial layer from the handling substrate,

wherein an electronic device is formed on the polymer substrate before or after removing the sacrificial layer.