APPARATUS FOR FLEXIBLE ELECTRONIC INTERFACES AND ASSOCIATED METHODS
First Claim
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1. A semiconductor die comprising:
- a first flexible interface block, comprising;
at least one interconnect;
at least one buffer coupled to the at least one interconnect;
a routing interface coupled to circuitry integrated in the semiconductor die; and
a controller coupled to provide communication between the routing interface and the at least one buffer.
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Abstract
A semiconductor die includes at least one flexible interface block. The flexible interface block includes at least one interconnect, and at least one buffer coupled to the at least one interconnect. The flexible interface block further includes a routing interface coupled to circuitry integrated in the semiconductor die, and a controller coupled to provide communication between the routing interface and the at least one buffer.
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Citations
37 Claims
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1. A semiconductor die comprising:
a first flexible interface block, comprising; at least one interconnect; at least one buffer coupled to the at least one interconnect; a routing interface coupled to circuitry integrated in the semiconductor die; and a controller coupled to provide communication between the routing interface and the at least one buffer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12-26. -26. (canceled)
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27. A method of fabricating a semiconductor die, the method comprising:
fabricating a first flexible interface block, comprising; fabricating at least one interconnect; fabricating at least one buffer coupled to the at least one interconnect; fabricating a routing interface coupled to circuitry integrated in the semiconductor die; and fabricating a controller coupled to provide communication between the routing interface and the at least one buffer. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
Specification