TOUCH PANEL

• US 20130181925A1
• Filed: 01/18/2013
• Published: 07/18/2013
• Est. Priority Date: 01/18/2012
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: KIM, Byung Soo, HONG, Hyuk Jin, LEE, Keun Sik, JO, Ji Won
• Granted Patent: US 9,229,591 B2
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

Disclosed is a touch panel. The touch panel includes a sensing electrode pattern layer on a transparent substrate; a wire connected to the sensing electrode pattern layer; a bonding pad formed at an end of the wire and connected to a flexible printed circuit board (FPCB); and an adhesive insulating layer on one surface of the sensing electrode pattern layer and on a region except for the bonding pad, wherein the adhesive insulating layer comprises a first adhesive insulating layer and a second adhesive insulating layer, and an area of the first adhesive insulating layer is different from an area of the second adhesive insulating layer.

Claims

1. A touch panel comprising:

a sensing electrode pattern layer on a transparent substrate;

a wire connected to the sensing electrode pattern layer;

a bonding pad formed at an end of the wire and connected to a flexible printed circuit board (FPCB); and

an adhesive insulating layer on one surface of the sensing electrode pattern layer and on a region except for the bonding pad,

wherein the adhesive insulating layer comprises a first adhesive insulating layer and a second adhesive insulating layer, and an area of the first adhesive insulating layer is different from an area of the second adhesive insulating layer.

2. The touch panel of claim 1, wherein the sensing electrode pattern layer comprises:

a first sensing electrode pattern layer; and

a second sensing electrode pattern layer on the first sensing electrode pattern layer,

wherein the wire comprises;

a first wire aligned on a same plane with the first sensing electrode pattern layer and connected to the first sensing electrode pattern layer; and

a second wire aligned on a same plane with the second sensing electrode pattern layer and connected to the second sensing electrode pattern layer, and

wherein the bonding pad comprises;

a first bonding pad disposed on a same plane with the first sensing electrode pattern layer and formed at an end of the first wire; and

a second bonding pad disposed on a same plane with the second sensing electrode pattern layer and formed at an end of the second wire.

3. The touch panel of claim 2, wherein the first adhesive insulating layer is formed on a region except for the first bonding pad, and the second adhesive insulating layer is formed on a region except for the second bonding pad.

4. The touch panel of claim 3, wherein the first adhesive insulating layer is formed on the first sensing electrode pattern layer and the first wire, and the second adhesive insulating layer is formed on the second sensing electrode pattern layer and the second wire.

5. The touch panel of claim 4, wherein the first adhesive insulating layer is formed at a region corresponding to the second sensing electrode pattern layer, the second wire, and the second bonding pad, and the second adhesive insulating layer is formed at a region corresponding to the first sensing electrode pattern layer.

6. The touch panel of claim 3, wherein the first adhesive insulating layer is formed on the first sensing electrode pattern layer, and the second adhesive insulating layer is formed on the second sensing electrode pattern layer and the second wire.

7. The touch panel of claim 6, wherein the first adhesive insulating layer is formed at a region corresponding to the second sensing electrode pattern layer, the second wire, and the second bonding pad, and the second adhesive insulating layer is formed at a region corresponding to the first sensing electrode pattern layer and the first wire.

8. The touch panel of claim 3, wherein the first adhesive insulating layer and the second adhesive insulating layer are formed on a region except for the first bonding pad or the second bonding pad.

9. The touch panel of claim 8, wherein the first adhesive insulating layer is formed on the first sensing electrode pattern layer, the first wire, and the first bonding pad, and the second adhesive insulating layer is formed on the second sensing electrode pattern layer and the second wire.

10. The touch panel of claim 9, wherein the first adhesive insulating layer is formed at a region corresponding to the second sensing electrode pattern layer and the second wire, and the second adhesive insulating layer is formed corresponding to the first sensing electrode pattern layer and the first wire.

11. The touch panel of claim 2, wherein the first adhesive insulating layer and the second insulating layer are formed on a region except for at least one of the first bonding pad and the second bonding pad.

12. The touch panel of claim 11, wherein the first adhesive insulating layer and the second adhesive insulating layer are formed at or on a region corresponding to one of the first sensing electrode pattern layer and the second sensing electrode pattern layer, and are formed at or on a region corresponding to one of the first wire and the second wire.