PoP Structures Including Through-Assembly Via Modules
First Claim
1. A device comprising:
- a first package component;
a first plurality of metal posts at a bottom surface of the first package component and electrically coupled to the first package component;
a Through-Assembly Via (TAV) Module comprising;
a substrate;
a plurality of through-vias penetrating through the substrate; and
a second plurality of metal posts at a bottom surface of the TAV module and electrically coupled to the plurality of through-vias;
a polymer comprising;
a first portion between and contacting sidewalls of the first package component and the TAV module;
a second portion disposed between the first plurality of metal posts; and
a third portion disposed between the second plurality of metal posts;
a first plurality of Redistribution Lines (RDLs) underlying a bottom surface of the second and the third portions of the polymer; and
a second plurality of RDLs over the first package component and the TAV module, wherein the first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias in the TAV module.
1 Assignment
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Accused Products
Abstract
A device includes a Through-Assembly Via (TAV) Module, which includes a substrate, a plurality of through-vias penetrating through the substrate, and a second plurality of metal posts at a bottom surface of the TAV module and electrically coupled to the plurality of through-vias. A polymer includes a first portion between and contacting sidewalls of the first package component and the TAV module, a second portion disposed between the first plurality of metal posts, and a third portion disposed between the second plurality of metal posts. A first plurality of Redistribution Lines (RDLs) is underlying a bottom surface of the second and the third portions of the polymer. A second plurality of RDLs is over the first package component and the TAV module. The first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias in the TAV module.
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Citations
20 Claims
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1. A device comprising:
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a first package component; a first plurality of metal posts at a bottom surface of the first package component and electrically coupled to the first package component; a Through-Assembly Via (TAV) Module comprising; a substrate; a plurality of through-vias penetrating through the substrate; and a second plurality of metal posts at a bottom surface of the TAV module and electrically coupled to the plurality of through-vias; a polymer comprising; a first portion between and contacting sidewalls of the first package component and the TAV module; a second portion disposed between the first plurality of metal posts; and a third portion disposed between the second plurality of metal posts; a first plurality of Redistribution Lines (RDLs) underlying a bottom surface of the second and the third portions of the polymer; and a second plurality of RDLs over the first package component and the TAV module, wherein the first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias in the TAV module. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A device comprising:
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a bottom package comprising; a package substrate; a plurality of connectors over the package substrate; a package comprising; a device die; a Through-Assembly Via (TAV) Module substantially level with the device die, wherein the TAV module is free from active devices therein, and wherein the TAV module comprises a substrate and a plurality of through-vias penetrating through the substrate; and a molding compound contacting a bottom surface of the device die, a bottom surface of the TAV module, and sidewalls of the device die and the TAV module; and a first plurality of Redistribution Lines (RDLs) under the molding compound and electrically coupled to the device die and the plurality of through-vias in the TAV module, wherein the first plurality of RDLs is bonded to the package substrate through the plurality of connectors; and a top package component bonded to the bottom package. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method comprising:
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placing a device die over a release layer, wherein the release layer is over a first carrier; placing a Through-Assembly Via (TAV) module over the release layer, wherein the TAV module is free from active devices therein, and wherein the TAV module comprises a substrate and a plurality of through-vias penetrating through the substrate; molding the device die and the TAV module in a polymer; grinding the polymer to expose metal posts of the device die and metal posts of the TAV module; forming a first plurality of Redistribution Lines (RDLs) over the polymer and connected to the metal posts of the device die and the metal posts of the TAV module, wherein the device die, the TAV module, and the first plurality of RDLs form a package; mounting the package on a second carrier, wherein the first and the second carriers are on opposite sides of the package; demounting the first carrier from the package and removing the release layer; forming a second plurality of RDLs coupled to the plurality of through-vias, wherein the first and the second plurality of RDLs are on opposite sides of the package; and demounting the second carrier from the package. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification