WICKLESS HEAT PIPE AND THERMAL GROUND PLANE

• US 20130186601A1
• Filed: 01/18/2013
• Published: 07/25/2013
• Est. Priority Date: 01/19/2012
• Status: Active Grant

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Monson, Robert J., Van Lear, Brian
• Granted Patent: US 9,921,003 B2
• Time in Patent Office: Days
• US Class Current: 165/104.26
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps
• CPC Class Codes: H05K 7/20672 within sub-racks for removing heat from electronic boards

Abstract

A wickless heat pipe including a first tube and a second tube. The first tube may form a first shape extending longitudinally in a first direction. The second tube may form a second shape extending longitudinally in a second direction different from the first direction. The first tube and the second tube intersect at at least one location. The two tubes may intersect at a right angle or an oblique angle. The first and second tube may intersect at a plurality of locations. The tubes may be formed from a metal plate used as a thermal ground plane.

Claims

1. A wickless heat pipe comprising:

a first tube forming a first shape extending longitudinally in a first direction;

a second tube forming a second shape extending longitudinally in a second direction different from the first direction, wherein the first tube and the second tube intersect at at least one location.

2. The wickless heat pipe of claim 1, wherein the first tube intersects the second tube at a right angle.

3. The wickless heat pipe of claim 1, wherein the first tube intersects the second tube at a plurality of locations.

4. The wickless heat pipe of claim 1, wherein an internal volume of the wickless heat pipe is partially filled with a liquid.

5. The wickless heat pipe of claim 4, wherein the internal volume of the wickless heat pipe is filled more than 50% with the liquid.

6. The wickless heat pipe of claim 5, wherein the internal volume of the wickless heat pipe is filled approximately 70% with the liquid.

7. The wickless heat pipe of claim 4, wherein the liquid comprises water and/or alcohol.

8. The wickless heat pipe of claim 1, wherein:

the first tube is one of a plurality of tubes extending longitudinally in the first direction; and

the second tube is one of a plurality of tubes extending longitudinally in the second direction.

9. The wickless heat pipe of claim 8, wherein:

each of the plurality of tubes extending longitudinally in the first direction intersect at at least one location with each of the plurality of tubes extending longitudinally in the second direction.

10. The wickless heat pipe of claim 1, wherein the first tube and the second tube are formed within a thermally conductive plate.

11. The wickless heat pipe of claim 10, wherein the thermally conductive plate is part of a module cover, wherein the module cover is configured to be in thermal contact with an integrated circuit and/or processor.

12. The wickless heat pipe of claim 11, wherein the module cover is configured to be in thermal contact with a card chassis.

13. The wickless heat pipe of claim 11, wherein the integrated circuit and/or processor is part of an avionics module.

14. The wickless heat pipe of claim 1, wherein the first tube and the second tube are formed from a metallic material.

15. The wickless heat pipe of claim 14, wherein the metallic material is aluminum or copper.

16. The wickless heat pipe of claim 1, wherein the first tube and the second tube are have a circular cross-section.

17. The wickless heat pipe of claim 1, wherein the first shape and the second shape are rectangular.

18. The wickless heat pipe of claim 18, wherein the first rectangular shape is a different size than the second rectangular shape.

19. A wickless heat pipe comprising:

a plurality of tubes forming an internal volume;

a plurality of intersections, each of the plurality of intersection being formed where two of the plurality of tubes intersect; and

a liquid within the internal volume,

wherein the plurality of tubes and plurality of intersections form a plurality of paths that, when at least a portion of the liquid is heated to produce a vapor, maintain a flow of the vapor within the heat pipe.

20. The wickless heat pipe of claim 19, wherein at least a portion of the plurality of intersections are where two of the plurality of tubes intersect at right angles.