MICRO-CHANNEL-COOLED HIGH HEAT LOAD LIGHT EMITTING DEVICE
First Claim
1. A lamp head module comprising:
- an optical macro-reflector including a window having an outer surface;
an array of light emitting diodes (LEDs) positioned within the optical reflector, the array having a high fill factor and a high aspect ratio operable to provide a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from the outer surface of the window of the optical reflector; and
a micro-channel cooler assembly operable to maintain a substantially isothermal state among p-n junctions of LEDs in the array at a temperature of less than or equal to 80°
Celsius, the micro-channel cooler assembly also providing a common anode substrate for the array, wherein a thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.
2 Assignments
0 Petitions
Accused Products
Abstract
Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.
23 Citations
39 Claims
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1. A lamp head module comprising:
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an optical macro-reflector including a window having an outer surface; an array of light emitting diodes (LEDs) positioned within the optical reflector, the array having a high fill factor and a high aspect ratio operable to provide a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from the outer surface of the window of the optical reflector; and a micro-channel cooler assembly operable to maintain a substantially isothermal state among p-n junctions of LEDs in the array at a temperature of less than or equal to 80°
Celsius, the micro-channel cooler assembly also providing a common anode substrate for the array, wherein a thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A lamp head module comprising:
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a high aspect ratio monolithically bonded foil micro-channel cooler substrate layer having a greater length than width; a high aspect ratio light emitting device array layer having a greater length than width mounted to the micro-channel cooler substrate layer, wherein the micro-channel cooler substrate layer serves a common anode function for the light emitting device array layer, the light emitting device array layer having a high fill-factor and comprising a p-n junction layer; a flex-circuit layer, including a patterned cathode circuit material layer and a thin dielectric layer, mounted to the micro-channel cooler substrate layer, the cathode circuit material layer separated from the micro-channel cooler substrate layer by the thin dielectric layer, wherein the cathode circuit material layer and the thin dielectric layer combine in thickness to be less than 3×
a thickness of the light emitting device array layer; andan optical reflector layer to direct photons emitted by said light emitting device array layer, the optical reflector layer being at least 25×
a thickness of the light emitting device array layer, wherein the thicknesses are measured in a direction substantially perpendicular to the p-n junction layer. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A lamp head module comprising:
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a package including; a high aspect ratio array of electrically paralleled light emitting diodes (LEDs), the high aspect ratio array having a greater length than width; a flex circuit having a segmented cathode layer to which wire bond pads of the high aspect ratio array are electrically coupled; and a high aspect ratio monolithically bonded foil micro-channel cooler having a greater length than width providing a common anode substrate surface to which the high aspect ratio array is directly mounted; a lamp body having formed therein an input coolant fluid channel and an output coolant fluid channel, wherein coolant fluid flows from the input coolant fluid channel through the micro-channel cooler and to the output coolant fluid channel to remove waste heat from the high aspect ratio array; at least two anode bodies affixed to opposing sides of the lamp body, running substantially parallel to one another and orthogonal to the common anode substrate surface; and a plurality of cathode bodies each having a first surface substantially parallel to the common anode substrate surface and a second surface substantially parallel to the at least two anode bodies, wherein the package is clamped to the lamp body and the at least two anode bodies by the plurality of cathode bodies.
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29. An ultraviolet (UV) light emitting diode (LED) curing system comprising:
a plurality of end-to-end serially connected UV LED lamp head modules each including; an optical macro-reflector including a window having an outer surface; an LED array positioned within the optical reflector, the array having a high fill factor and a high aspect ratio operable to provide a substantially uniform high irradiance output beam pattern having an irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from the outer surface of the window of the optical reflector; and a micro-channel cooler assembly operable to maintain a substantially isothermal state among p-n junctions of LEDs in the LED array at a temperature of less than or equal to 80°
Celsius, the micro-channel cooler assembly also providing a common anode substrate for the LED array, wherein a thermally efficient electrical connection is formed between the LED array and the common anode substrate by directly mounting the LED array to the micro-channel cooler assembly.
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30. A lamp head module comprising:
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an array of light emitting diodes (LEDs) having a high fill factor and a high aspect ratio operable to provide a substantially uniform high irradiance output beam along a long-axis of the array, wherein the LEDs include one or more ultraviolet emitting LEDs a micro-channel cooler assembly, including a micro-channel cooler portion and outer capping layer portions, operable to maintain a substantially isothermal state among p-n junctions of LEDs in the array, the micro-channel cooler assembly also providing a common anode substrate for the array, wherein a thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly; wherein a heat spreader layer of the micro-channel cooler portion is less than approximately 200 microns; wherein a width of the micro-channel cooler portion is approximately 1.1 to 1.7 times a width of the array in a shortest dimension of the array. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37)
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38. A lamp head module comprising:
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a package including; a high aspect ratio array of light emitting devices having a greater length than width; a flex circuit having a segmented cathode layer to which wire bond pads of the high aspect ratio array are electrically coupled; and a high aspect ratio monolithically bonded foil micro-channel cooler having a greater length than width providing a common anode substrate surface to which the high aspect ratio array is mounted; a lamp body having formed therein an input coolant fluid channel and an output coolant fluid channel, wherein coolant fluid flows from the input coolant fluid channel through the micro-channel cooler and to the output coolant fluid channel to remove waste heat from the high aspect ratio array; an anode body affixed to the lamp body, the anode body being substantially parallel to the input coolant fluid channel and the output coolant fluid channel and orthogonal to the common anode substrate surface; a cathode body having a surface substantially parallel to the common anode substrate surface; and wherein the package is clamped to the lamp body and the anode body. - View Dependent Claims (39)
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Specification