LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS
4 Assignments
0 Petitions
Accused Products
Abstract
In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
73 Citations
149 Claims
-
1-122. -122. (canceled)
-
123. An electronic device comprising:
-
a solid shaped volume of a polymeric binder; suspended within the binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces; and disposed on the first face of the semiconductor die, at least two spaced-apart contacts each having a free terminal end (i) not covered by the binder and (ii) available for electrical connection. - View Dependent Claims (124, 125, 126, 127, 128, 129, 130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141, 142, 143, 144, 145, 146, 147, 148)
-
-
149-218. -218. (canceled)
Specification