Methods of Forming Replacement Gate Structures for Semiconductor Devices

• US 20130187236A1
• Filed: 01/20/2012
• Published: 07/25/2013
• Est. Priority Date: 01/20/2012
• Status: Abandoned Application

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Xie, Ruilong, Cai, Xiuyu, Miller, Robert, Knorr, Andreas
• Application Number:
  US13/354,844
• Publication Number:
  US 20130187236A1
• Time in Patent Office: Days
• US Class Current: 257/369
• CPC Class Codes: H01L 21/82345 gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
• CPC Class Codes: H01L 21/823456 gate conductors with different shapes, lengths or dimensions
• CPC Class Codes: H01L 21/823842 gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
• CPC Class Codes: H01L 21/82385 gate conductors with different shapes, lengths or dimensions
• CPC Class Codes: H01L 29/4966 the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2 H01L29/4908, H01L29/4983 take precedence
• CPC Class Codes: H01L 29/517 the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate H01L29/518 takes precedence
• CPC Class Codes: H01L 29/66545 using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
• CPC Class Codes: H01L 29/66553 using inside spacers, permanent or not

Abstract

Disclosed herein are methods of forming replacement gate structures. In one example, the method includes forming a sacrificial gate structure above a semiconducting substrate, removing the sacrificial gate structure to thereby define a gate cavity, forming a layer of insulating material in the gate cavity and forming a layer of metal within the gate cavity above the layer of insulating material. The method further includes forming a sacrificial material in the gate cavity so as to cover a portion of the layer of metal and thereby define an exposed portion of the layer of metal, performing an etching process on the exposed portion of the layer of metal to thereby remove the exposed portion of the layer of metal from within the gate cavity, and, after performing the etching process, removing the sacrificial material and forming a conductive material above the remaining portion of the layer of metal.

Claims

1. A method of forming a transistor, comprising:

forming a sacrificial gate structure above a semiconducting substrate;

removing said sacrificial gate structure to thereby define a gate cavity;

forming a layer of insulating material in said gate cavity;

forming a layer of metal within said gate cavity above said layer of insulating material;

forming a sacrificial material in said gate cavity so as to cover a portion of said layer of metal and thereby define an exposed portion of said layer of metal;

performing an etching process on said exposed portion of said layer of metal to thereby remove said exposed portion of said layer of metal from within said gate cavity;

after performing said etching process, removing said sacrificial material; and

forming a conductive material above the previously covered portion of said layer of metal.

2. The method of claim 1, wherein said transistor is one of a FinFET device or a FET device.

3. The method of claim 1, wherein forming said sacrificial material comprises performing a bottom-up gap fill process to directly deposit said sacrificial material in said gate cavity to its final thickness.

4. The method of claim 1, wherein forming said sacrificial material comprises:

performing a deposition process to form a deposited layer of said sacrificial material that overfills said gate cavity;

performing a chemical mechanical polishing process on said deposited layer of sacrificial material; and

after performing said chemical mechanical polishing process, performing an etching process on said layer of sacrificial material to reduce its thickness.

5. The method of claim 1, wherein said layer of metal is a work function adjusting layer of metal for an N-type FET.

6. The method of claim 1, wherein said layer of metal is a work function adjusting layer of metal for a P-type FET.

7. The method of claim 1, wherein forming said sacrificial material comprises:

performing a deposition process to form a deposited layer of said sacrificial material that overfills said gate cavity;

performing a chemical mechanical polishing process on said deposited layer of sacrificial material;

after performing said chemical mechanical polishing process, performing an oxidation process on said layer of sacrificial material to oxidize an upper portions of said layer of sacrificial material while leaving a lower portion of said layer of sacrificial material in a non-oxidized state; and

performing an etching process to remove said oxidized upper portion of said layer of sacrificial material while leaving said lower portion of said layer of sacrificial material in place.

8. The method of claim 1, further comprising:

performing at least one etching process to partially recess said conductive material; and

forming an insulating material above said recessed conductive material within said gate cavity.

9. A method of forming a transistor, comprising:

forming a sacrificial gate structure above a semiconducting substrate;

removing said sacrificial gate structure to thereby define a gate cavity;

forming a layer of insulating material in said gate cavity;

forming a first layer of metal within said gate cavity above said layer of insulating material;

forming a second layer of metal within said gate cavity above said first layer of metal;

forming a sacrificial material in said gate cavity so as to cover a portion of said second layer of metal and thereby define an exposed portion of said first layer of metal and said second layer of metal;

performing at least one etching process on said exposed portions of said second layer of metal and said first layer of metal to thereby remove said exposed portions of said second layer of metal and said first layer of metal from within said gate cavity;

after performing said at least one etching process, removing said sacrificial material; and

forming a conductive gate electrode material above said previously covered portions of said first and second layers of metal.

10. The method of claim 9, wherein forming said sacrificial material comprises performing a bottom-up gap fill process to directly deposit said sacrificial material in said gate cavity to its final thickness.

11. The method of claim 9, wherein forming said sacrificial material comprises:

performing a deposition process to form a deposited layer of said sacrificial material that overfills said gate cavity;

performing a chemical mechanical polishing process on said deposited layer of sacrificial material; and

after performing said chemical mechanical polishing process, performing an etching process on said layer of sacrificial material to reduce its thickness.

12. The method of claim 9, wherein said first layer of metal is a work function adjusting layer of metal for an N-type FET and said second layer of metal is a work function adjusting layer of metal for a P-type FET.

13. The method of claim 9, wherein said first layer of metal is a work function adjusting layer of metal for a P-type FET and said second layer of metal is a work function adjusting layer of metal for an N-type FET.

14. The method of claim 9, further comprising:

performing at least one etching process to partially recess said conductive gate electrode material; and

forming an insulating material above said recessed conductive gate electrode material within said gate cavity.

15. The method of claim 9, wherein forming said sacrificial material comprises:

performing a deposition process to form a deposited layer of said sacrificial material that overfills said gate cavity;

performing a chemical mechanical polishing process on said deposited layer of sacrificial material;

after performing said chemical mechanical polishing process, performing an oxidation process on said layer of sacrificial material to oxidize an upper portion of said layer of sacrificial material while leaving a lower portion of said layer of sacrificial material in a non-oxidized state; and

performing an etching process to remove said oxidized upper portion of said layer of sacrificial material while leaving said lower portion of said layer of sacrificial material in place.

16. A method of forming first and second transistors, comprising:

forming a sacrificial gate structure above a semiconducting substrate for each of said first and second transistor;

removing said sacrificial gate structures to thereby define a first gate cavity and a second gate cavity for each of said first and second transistors, respectively;

forming a layer of insulating material in each of said first and second gate cavities;

forming a first layer of metal within in each of said first and second gate cavities above said layer of insulating material;

forming a second layer of metal within each of said first and second gate cavities above said first layer of metal;

forming a sacrificial material within each of said first and second gate cavities so as to cover a portion of said second layer of metal and thereby define an exposed portion of said first layer of metal and said second layer of metal;

performing at least one etching process on said exposed portions of said second layer of metal and said first layer of metal to thereby remove said exposed portions of said second layer of metal and said first layer of metal from within each of said first and second gate cavities; and

after performing said at least one etching process, removing said sacrificial material.

17. The method of claim 16, further comprising forming a conductive gate electrode material above said remaining portions of said first and second layers of metal in one of said first and second cavities.

18. The method of claim 17, further comprising:

performing at least one etching process to partially recess said conductive gate electrode material; and

forming an insulating material above said recessed conductive gate electrode material within at least one of said first and second gate cavities.

19. The method of claim 16, wherein said first and second transistors are FinFET devices.

20. The method of claim 16, wherein said first and second transistors are FET devices.

21. The method of claim 16, wherein forming said sacrificial material comprises performing a bottom-up gap fill process to directly deposit said sacrificial material in said gate cavity to its final thickness.

22. The method of claim 16, wherein forming said sacrificial material comprises:

performing a deposition process to form a deposited layer of said sacrificial material that overfills said first and second gate cavities;

performing a chemical mechanical polishing process on said deposited layer of sacrificial material; and

after performing said chemical mechanical polishing process, performing an etching process on said layer of sacrificial material to reduce its thickness.

23. The method of claim 16, wherein said first layer of metal is a work function adjusting layer of metal for an N-type FET and said second layer of metal is a work function adjusting layer of metal for a P-type FET.

24. The method of claim 16, wherein said first layer of metal is a work function adjusting layer of metal for a P-type FET and said second layer of metal is a work function adjusting layer of metal for an N-type FET.

25. The method of claim 16, further comprising:

forming a masking layer that masks at least said first cavity and exposes said second cavity for further processing; and

performing an etching process to remove said remaining portion of said second layer of metal from within said first cavity while leaving said remaining portion of said first layer of metal within said first cavity.

26. The method of claim 16, wherein forming said sacrificial material comprises:

performing a deposition process to form a deposited layer of said sacrificial material that overfills said gate cavity;

performing a chemical mechanical polishing process on said deposited layer of sacrificial material;

after performing said chemical mechanical polishing process, performing an oxidation process on said layer of sacrificial material to oxidize an upper portion of said layer of sacrificial material while leaving a lower portion of said layer of sacrificial material in a non-oxidized state; and

performing an etching process to remove said oxidized upper portion of said layer of sacrificial material while leaving said lower portion of said layer of sacrificial material in place.

27. A device, comprising:

a first transistor and a second transistor formed in and above a semiconducting substrate, each of said first and second transistors comprising a gate insulation layer, a first work function adjusting metal layer positioned above the gate insulation layer and a gate electrode positioned above the first work function adjusting metal layer, wherein said gate electrode for each of said first and second transistors has an upper portion with a width at its top that is greater than a width of a lower portion of said gate electrode at its bottom; and

a second work function adjusting layer positioned only in said second transistor, said second work function adjusting layer being positioned between said first work function adjusting layer and said gate electrode in said second transistor only, wherein said upper portion of said gate electrode of said first transistor is positioned above and contacts an upper surface of said first work function adjusting layer and also contacts said gate insulation layer, while said upper portion of said gate electrode of said second transistor is positioned above and contacts an upper surface of each of said first and second work function adjusting layers and also contacts said gate insulation layer.

28. The device of claim 27, wherein said first transistor has a smaller gate length than said second transistor.

29. The device of claim 27, wherein said first transistor has a larger gate length than said second transistor.

30. The device of claim 27, wherein said first transistor is an NFET device and said second transistor is a PFET device.

31. The device of claim 27, wherein said first transistor is an PFET device and said second transistor is a NFET device.

32. The device of claim 27, wherein said top width of said gate electrode for said first transistor is less than said top width of said gate electrode for said second transistor.

33. The device of claim 27, wherein said top width of said gate electrode for said second transistor is less than said top width of said gate electrode for said first transistor.

34. The device of claim 27, wherein said contact between said gate insulation layer and said upper portions of said gate electrodes of said first and second transistors is along a substantially vertically oriented edge of said upper portion of said gate electrodes of each of said first and second transistors.