MICRO ELECTRO MECHANICAL SYSTEM STRUCTURES

• US 20130187245A1
• Filed: 01/19/2012
• Published: 07/25/2013
• Est. Priority Date: 01/19/2012
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: CHIEN, Ting-Ying, CHIU, Yi Hsun, SU, Ching-Hou, NI, Chyi-Tsong
• Granted Patent: US 9,139,423 B2
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: H01L 2224/83805 involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

A micro electro mechanical system (MEMS) structure includes a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is bonded with the bonding pad structure of the first substrate structure.

Claims

1. A micro electro mechanical system (MEMS) structure comprising:

a first substrate structure including a bonding pad structure, the bonding pad structure having at least one recess therein; and

a second substrate structure bonded with the bonding pad structure of the first substrate structure.

2. The MEMS structure of claim 1, wherein the at least one recess has a first slot continuously extending in the first bonding pad structure, such that the bonding pad structure of the first substrate structure includes a first bond pad ring and a second bond pad ring that are separated from each other by the first slot and disposed around a MEMS device.

3. The MEMS structure of claim 2, wherein the at least one recess further has a second slot continuously extending in the bonding pad structure, such that the bonding pad structure includes a third bond pad ring that is separated from the second bond pad ring by the second slot and disposed around the MEMS device.

4. The MEMS structure of claim 1, wherein the bonding pad structure of the first substrate structure includes a bonding material that continuously extends along walls of the at least one recess.

5. The MEMS structure of claim 1, wherein the second substrate structure includes a bonding pad structure that is eutectically bonded with the bonding pad structure of the first substrate structure.

6. The MEMS structure of claim 5, wherein a surface of the second substrate structure is substantially level with an interface between the bonding pad structure of the first substrate structure and the bonding pad structure of the second substrate structure.

7. The MEMS structure of claim 5, wherein a surface of the second substrate structure is below an interface between the bonding pad structure of the first substrate structure and the bonding pad structure of the second substrate structure.

8. The MEMS structure of claim 5, wherein the bonding pad structure of the second substrate structure has at least one recess therein, and the at least one recess of the second substrate structure continuously extends in the bonding pad structure of the second substrate structure, such that the bonding pad structure of the second substrate structure includes a first bond pad ring and a second bond pad ring that are separated from each other by the at least one recess.

9. The MEMS structure of claim 5, wherein a surface area of the bonding pad structure of the first substrate structure is smaller than a surface area of the bonding pad structure of the second substrate structure that is bonded thereto.

10. A micro electro mechanical system (MEMS) structure comprising:

a device substrate having a MEMS device, the device substrate includes a first bond pad ring and a second bond pad ring disposed around the MEMS device; and

a handle substrate including a bonding pad structure, wherein the bonding pad structure is bonded with the first bond pad ring and the second bond pad ring.

11. The MEMS structure of claim 10, wherein the first bond pad ring is separated from the second bond pad ring.

12. The MEMS structure of claim 10, wherein the device substrate further includes a third bond pad ring that is disposed around the MEMS device and separated from the first bond pad ring and the second bond pad ring.

13. The MEMS structure of claim 10, wherein a surface of the handle substrate is substantially level with an interface between the bonding pad structure and the first bond pad ring.

14. The MEMS structure of claim 10, wherein a surface of the handle substrate is not level with an interface between the bonding pad structure and the first bond pad ring.

15. The MEMS structure of claim 10 further comprising:

a bonding material that continuously extends from the first bond pad ring to the second bond pad ring.

16. The MEMS structure of claim 10, wherein the bonding pad structure has at least one recess therein, and the at least one recess continuously extends in the bonding pad structure, such that the bonding pad structure includes a first bond pad ring and a second bond pad ring that are separated from each other by the at least one recess.

17. The MEMS structure of claim 10, wherein surface areas of the first and second bond pad rings are smaller than a surface area of the bonding pad structure that is bonded thereto.

18. A micro electro mechanical system (MEMS) structure comprising:

a device substrate having a MEMS device, the device substrate includes a first bond pad ring and a second bond pad ring disposed around the MEMS device, wherein the first bond pad ring and the second bond pad ring each include at least one metallic material; and

a handle substrate that is bonded with the first bond pad ring and the second bond pad ring, wherein the handle substrate includes at least one semiconductor-containing material.

19. The MEMS structure of claim 18, wherein the device substrate further includes a third bond pad ring that is disposed around the MEMS device and separated from the first bond pad ring and the second bond pad ring.

20. The MEMS structure of claim 18, wherein a surface of the handle substrate is substantially level with an interface between the handle substrate and the first bond pad ring.