LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE
First Claim
1. A circuit package comprising:
- an insulative film defining a central open area having a conductive surface on which an electronic chip or device is mountable;
the film having;
a first surface on which a plurality of connection pads are disposed;
a second surface opposite to the first surface on which a plurality of external contacts are disposed;
a plurality of conductive vias extending through the film in positions to be in electrical contact with respective connection pads on the first surface of the film and corresponding external contacts on the second surface of the film; and
the external contacts each covering the respective vias to which it is electrically contacted to isolate the via from the external environment and minimize leakage paths through the via.
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Accused Products
Abstract
A open cavity semiconductor chip package that is leadless and does not have a metal lead frame as in conventional packages. The absence of a lead frame minimizes leakage paths and allows the novel package to be more readily fabricated as a hermetic package. A dual sided insulative or dielectric film is employed as the base interconnect between a semiconductor chip and outside contacts. Electrical connection from the top side of the film to the bottom side of the film is made through conductive micro-vias. The semiconductor chip is mounted on a paddle in a central opening in the film and wire bonded to pads on the film. After mounting of the chip, a cover or lid is attached to the film to encapsulate the assembly and maintain hermeticity of the package.
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Citations
9 Claims
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1. A circuit package comprising:
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an insulative film defining a central open area having a conductive surface on which an electronic chip or device is mountable; the film having; a first surface on which a plurality of connection pads are disposed; a second surface opposite to the first surface on which a plurality of external contacts are disposed; a plurality of conductive vias extending through the film in positions to be in electrical contact with respective connection pads on the first surface of the film and corresponding external contacts on the second surface of the film; and the external contacts each covering the respective vias to which it is electrically contacted to isolate the via from the external environment and minimize leakage paths through the via. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification