LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE

• US 20130187286A1
• Filed: 07/24/2012
• Published: 07/25/2013
• Est. Priority Date: 07/25/2011
• Status: Abandoned Application

• Current Assignee: Interplex Microtech
• Original Assignee: Interplex Microtech
• Inventors: Schneider, Richard, Eymard, Eric
• Application Number:
  US13/556,760
• Publication Number:
  US 20130187286A1
• Time in Patent Office: Days
• US Class Current: 257/774
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85447 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/047 the other leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/1531 : the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16172 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2924/16251 : Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/1659 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/167 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2924/1679 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

Abstract

A open cavity semiconductor chip package that is leadless and does not have a metal lead frame as in conventional packages. The absence of a lead frame minimizes leakage paths and allows the novel package to be more readily fabricated as a hermetic package. A dual sided insulative or dielectric film is employed as the base interconnect between a semiconductor chip and outside contacts. Electrical connection from the top side of the film to the bottom side of the film is made through conductive micro-vias. The semiconductor chip is mounted on a paddle in a central opening in the film and wire bonded to pads on the film. After mounting of the chip, a cover or lid is attached to the film to encapsulate the assembly and maintain hermeticity of the package.

Claims

1. A circuit package comprising:

an insulative film defining a central open area having a conductive surface on which an electronic chip or device is mountable;

the film having;

a first surface on which a plurality of connection pads are disposed;

a second surface opposite to the first surface on which a plurality of external contacts are disposed;

a plurality of conductive vias extending through the film in positions to be in electrical contact with respective connection pads on the first surface of the film and corresponding external contacts on the second surface of the film; and

the external contacts each covering the respective vias to which it is electrically contacted to isolate the via from the external environment and minimize leakage paths through the via.

2. The circuit package of claim 1 wherein the sidewalls of the central open area of the film have a conductive coating thereon electrically connected to the conductive surface of the central open area;

at least one connection pad on the first surface of the film being electrically connected to the conductive coating of the sidewalls.

3. The circuit package of claim 1 wherein the first surface of the film has a mounting area about the periphery of the film on which a lid can be bonded.

4. The circuit package of claim 3 including a lid having a peripheral surface bondable to the mounting area of the first surface of the film.

5. The circuit package of claim 1 wherein a plurality of circuit package units are disposed on a sheet and separable into individual packages.

6. The circuit package of claim 5 wherein a plurality of lid units are disposed on a sheet and bondable to the sheet containing the plurality of circuit package units;

each package and lid unit being separable from the respective sheets to provide an individual package and lid.

7. The circuit package of claim 4 wherein the lid includes a recessed area inward of the mounting area and disposed over the vias when the lid is mounted on the film;

the recessed area configured to accommodate a sealant therein disposed over the vias.

8. The circuit package of claim 3 wherein the vias are disposed outside the mounting area of the film on which a lid is bondable.

9. The circuit package of claim 8 wherein the film is cut along a center line of the vias to provide partial vias around the periphery of the package.