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Fishtail Packaging and Cooling

  • US 20130187453A1
  • Filed: 10/31/2012
  • Published: 07/25/2013
  • Est. Priority Date: 11/22/2011
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a plurality of power transistors, arranged as a planar array;

    a cold plate, configured to couple heat from each of the transistors in the array;

    a generally flat conductive power coupling fitting, also termed herein a bus bar, having a plurality of individually electrically conductive layers, each two of the layers being separated by an insulating layer, each conductive layer providing a plurality of contacts, the contacts in a layer configured to provide electrical contact, in the alternative, for power transistor collectors or power transistor emitters, of said bus bar being necked along a specified section thereof distal to the power transistors, the necked section terminating in two electrical contacts configured to provide electrical contact via discrete conductors to respective positive and negative battery terminals;

    at least one capacitor, whereof a top surface, conductive at least in part, makes electrical and thermal contact with a conductor of said bus bar distal to the transistor array, and a bottom surface, conductive at least in part, makes at least electrical contact with an adapter bracket that makes electrical contact with a conductor of said bus bar proximal to the transistor array; and

    ,said bus bar is in physical and thermal contact with said cold plate.

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