DC-DC CONVERTER MODULE AND MULTI-LAYER SUBSTRATE
First Claim
1. A DC-DC converter module comprising:
- a multi-layer substrate including component mounting electrodes provided on a first surface thereof in a stacking direction and an input terminal, an output terminal, and a ground terminal provided on a second surface thereof in the stacking direction;
a switching IC that switches an input voltage and outputs a switched voltage and that includes an input electrode that is connected to the input terminal through at least one of the component mounting electrodes, an output electrode that is connected to the output terminal through at least one of the component mounting electrodes, and a ground electrode that is connected to the ground terminal through at least one of the component mounting electrodes; and
a coil that is arranged within the multi-layer substrate in a spiral shape with an axis extending in the stacking direction, an end of the coil nearer to the first surface being connected to the input terminal or the output terminal, and an end of the coil nearer to the second surface being connected to the input electrode or the output electrode of the switching IC.
1 Assignment
0 Petitions
Accused Products
Abstract
A DC-DC converter module includes a multi-layer substrate, a switching IC, and a coil. The multi-layer substrate includes component mounting electrodes provided on the top surface and an input terminal, an output terminal, and ground terminals provided on the bottom surface. The switching IC switches an input voltage and includes an input electrode, an output electrode, and a ground electrode, and is mounted on the top surface of the substrate by connecting the electrodes to the component mounting electrodes. The coil is arranged within the multi-layer substrate in a spiral shape with an axis extending in the substrate stacking direction. The bottom surface side end of the coil is connected to the input/output electrode of the switching IC.
-
Citations
19 Claims
-
1. A DC-DC converter module comprising:
-
a multi-layer substrate including component mounting electrodes provided on a first surface thereof in a stacking direction and an input terminal, an output terminal, and a ground terminal provided on a second surface thereof in the stacking direction; a switching IC that switches an input voltage and outputs a switched voltage and that includes an input electrode that is connected to the input terminal through at least one of the component mounting electrodes, an output electrode that is connected to the output terminal through at least one of the component mounting electrodes, and a ground electrode that is connected to the ground terminal through at least one of the component mounting electrodes; and a coil that is arranged within the multi-layer substrate in a spiral shape with an axis extending in the stacking direction, an end of the coil nearer to the first surface being connected to the input terminal or the output terminal, and an end of the coil nearer to the second surface being connected to the input electrode or the output electrode of the switching IC. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A multi-layer substrate comprising:
-
a substrate body including a first surface and a second surface; component mounting electrodes provided on the first surface of the substrate body; an input electrode, an output electrode, and a ground electrode of a switching IC mounted on the component mounting electrodes; an input terminal, an output terminal, and a ground terminal provided on the second surface of the substrate body; a coil arranged within the substrate body in a spiral shape with an axis extending in a stacking direction;
whereinan end of the coil nearer to the first surface is connected to the input terminal or the output terminal, and an end of the coil nearer to the second surface is connected to the component mounting electrode to which the input electrode or the output electrode of the switching IC is connected. - View Dependent Claims (17, 18, 19)
-
Specification