PHOSPHOR COATING FILMS AND LIGHTING APPARATUSES USING THE SAME

• US 20130188354A1
• Filed: 12/01/2010
• Published: 07/25/2013
• Est. Priority Date: 07/19/2010
• Status: Abandoned Application

• Current Assignee: Huizhou Light Engine Limited
• Original Assignee: Huizhou Light Engine Limited
• Inventors: Shieh, Yuh-Ren, Li, Ping Kuen Eddie
• Application Number:
  US13/811,218
• Publication Number:
  US 20130188354A1
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21V 13/08 the elements being filters or photoluminescent elements and reflectors
• CPC Class Codes: F21V 13/14 the elements being filters or photoluminescent elements, reflectors and refractors
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A lighting apparatus includes a circuit board having a highly reflective top surface; at least one LED chip mounted on the top surface of the circuit board, the at least one LED chip being operable to emit light of a first color. A phosphor film having an arcuate inner surface is configured to maintain a predetermined finite distance from the at least one LED chip, the phosphor film being disposed such that light emitted from the LED chip radiates upon the phosphor film, the inner surface of the phosphor film hooding the top surface of the circuit board so as to form a multi-reflection zone to reduce light absorption by the at least one LED chip and reduce direct light leakage from between the phosphor film and the top surface of the circuit board. The phosphor film containing phosphors that down convert at least a portion of the light of the first color into light of a second color, that when mixed together with the first color produces visible white light.

Claims

1. A lighting apparatus comprising:

a circuit board having a highly reflective top surface;

at least one LED chip mounted on the top surface of the circuit board, the at least one LED chip being operable to emit light of a first color;

a phosphor film having an arcuate inner surface configured so as to maintain a predetermined finite distance from the at least one LED chip, the phosphor film being disposed such that light emitted from the LED chip radiates upon the phosphor film, the inner surface of the phosphor film hooding the top surface of the circuit board so as to form a multi-reflection zone to reduce light absorption by the at least one LED chip and reduce direct light leakage from between the phosphor film and the top surface of the circuit board, the phosphor film containing phosphors that down convert at least a portion of the light of the first color emitted by the at least one LED chip into light of a second color, having a longer wavelength than the first color, the first and second colors, when mixed together producing visible white light.

2. The lighting apparatus according to claim 1, further comprising:

a heat sink having a top surface on which the circuit board is mounted, the heatsink being disposed on a side of the circuit board opposed to the at least one LED chip to dissipate heat generated by the at least one LED chip; and

a low light diffusing or transparent cover including a lower edge configured to mate with the heat sink and to enclose the phosphor film.

3. The lighting apparatus according to claim 1, further comprising a thermal paste or grease between the circuit board and the heat sink.

4. The lighting apparatus according to claim 1, wherein the phosphor film has a multi layer structure composed of phosphor layers and a transparent supporting layer.

5. The lighting apparatus according to claim 1, wherein the phosphor film has a transparent layer containing multi-phosphor particles uniformly dispersed.

6. The lighting apparatus according to claim 1, wherein the at least one LED chip is bonded and encapsulated on the circuit board.

7. The lighting apparatus according to claim 1, wherein the light of the first color is in a wavelength range of between 300˜

500 nm.

8. The lighting apparatus according to claim 1, wherein the light of the second color is in a wavelength range of between 500˜

700 nm.

9. The lighting apparatus according to claim 2, wherein the heatsink includes a plurality of wings.

10. The lighting apparatus according to claim 2, wherein the at least one LED chip is mounted on the top surface of the circuit board by chip-on-board (COB) with silicone encapsulation.

11. The lighting apparatus according to claim 2, wherein the top surface of the circuit board is made of PCB, MCPCB, ceramic, or enamel with (or without) solder mask.

12. The lighting apparatus according to claim 2, wherein the at least one LED chip is packaged with a lead frame, and mounted on the top surface of the circuit board by a surface mount (SMT) or through-hole technique.

19. The lighting apparatus according to claim 1, wherein the lighting apparatus is a tubular embodiment or a hemispherical embodiment with an axial symmetry.

22. The lighting apparatus according to claim 1, wherein the lighting apparatus is a luminaire.

23. The lighting apparatus according to claim 10, wherein the silicone encapsulation is transparent.

24. The lighting apparatus according to claim 10, wherein the silicone encapsulation is mixed with a phosphor having a different dominant wavelength from that of the phosphor film.

26. The lighting apparatus according to claim 4, wherein the transparent supporting layer is made of transparent polymer selected from the group consisting of Polypropylene (PP), Polyethylene (PE), Polycarbonate (PC), Polyphthalamide (PPA) and Polyurethane (PU).

27. The lighting apparatus according to claim 4, wherein the transparent supporting layer is made of glass.

28. The lighting apparatus according to claim 5, wherein the transparent layer is made of transparent polymer selected from the group consisting of Polypropylene (PP), Polyethylene (PE), Polycarbonate (PC), Polyphthalamide (PPA) and Polyurethane (PU).

29. The lighting apparatus according to claim 5, wherein the transparent layer is made of glass.

13. A lighting apparatus comprising:

a circuit board with a highly light reflective top surface made of PCB, MCPCB, ceramic, or enamel with (or without) solder mask;

at least one LED chip mounted on a highly reflective top surface of the circuit board, the at least one LED chip being operable to emit light of a first color;

an phosphor film (i) having an arcuate inner surface configured so as to maintain a predetermined finite distance from the at least one LED chip, the phosphor film being disposed such that light emitted from the at least one LED chip completely and uniformly radiates upon the phosphor film, (ii) having an opening to hood the high reflective top surface of the circuit board such that a light multi-reflection zone is formed to reduce the light absorption by the at least one LED chip with little direct light leakage from gaps between the phosphor film and the highly reflective surface of circuit board, (iii) the phosphor film containing phosphors that down convert at least a portion of the light, in a range from 300˜

500 nm, of the first color emitted by the at least one LED chip into light with longer wavelength, in a range from 500˜

700 nm, of a second color, that when mixed together with the first color produces visible white light.

14. The lighting apparatus according to claim 13, further comprising:

a heat sink having a top surface on which the circuit board is mounted, the heatsink being disposed on a side of the circuit board opposed to the at least one LED chip to dissipate heat generated by the at least one LED chip; and

a low light diffusing (or transparent) cover is configured to mate with the heat sink and to enclose the phosphor film.

15. The lighting apparatus according to claim 13, further comprising a thermal paste or grease between the circuit board and the heat sink.

16. The lighting apparatus according to claim 13, wherein the phosphor film has a multi layer structure composed of phosphor layers and a transparent supporting layer.

17. The lighting apparatus according to claim 13, wherein the phosphor film has a transparent layer containing multi-phosphor particles uniformly dispersed.

18. The lighting apparatus according to claim 13, wherein the at least one LED chip is bonded and

20. The lighting apparatus according to claim 14, wherein the heatsink includes a plurality of wings.

21. The lighting apparatus according to claim 13, wherein the at least one LED chip is mounted on the highly reflective top surface of the circuit board by chip-on-board (COB) with silicone encapsulation.

25. The lighting apparatus according to claim 13, wherein the at least one LED chip is packaged with a lead frame, and mounted on the top surface of the circuit board by a surface mount (SMT) or through-hole technique.