Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors
First Claim
1. An apparatus comprisingan interposer substrate for supporting a plurality of opto-electronic components for creating optical output signals propagating along a longitudinal optical axisan enclosure covering the interposer substrate, the enclosure including a silicon sidewall member and a transparent lid, the silicon sidewall member etched to include a turning mirror element with a reflecting surface at a predetermined angle θ
- , the turning mirror element for intercepting the created optical output signals and re-directing the created optical output signals through the transparent lid; and
a coverplate disposed over and aligned with the enclosure, the coverplate including a silicon sidewall member etched to include a turning mirror element with a reflecting surface at the same predetermined angle θ
, the coverplate turning mirror element for re-directing the optical output signals along the longitudinal axis.
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Accused Products
Abstract
An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle θ, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure'"'"'s transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle θ as the enclosure'"'"'s turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.
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Citations
20 Claims
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1. An apparatus comprising
an interposer substrate for supporting a plurality of opto-electronic components for creating optical output signals propagating along a longitudinal optical axis an enclosure covering the interposer substrate, the enclosure including a silicon sidewall member and a transparent lid, the silicon sidewall member etched to include a turning mirror element with a reflecting surface at a predetermined angle θ - , the turning mirror element for intercepting the created optical output signals and re-directing the created optical output signals through the transparent lid; and
a coverplate disposed over and aligned with the enclosure, the coverplate including a silicon sidewall member etched to include a turning mirror element with a reflecting surface at the same predetermined angle θ
, the coverplate turning mirror element for re-directing the optical output signals along the longitudinal axis. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
- , the turning mirror element for intercepting the created optical output signals and re-directing the created optical output signals through the transparent lid; and
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12. An apparatus comprising
an interposer substrate for supporting a plurality of opto-electronic components for creating optical output signals propagating along a longitudinal optical axis an enclosure covering the interposer substrate, the enclosure including a silicon sidewall member and a transparent lid, the silicon sidewall member etched to include a turning mirror element with a reflecting surface at a predetermined angle θ - , the turning mirror element for intercepting the created optical output signals and re-directing the created optical output signals through the transparent lid;
a coverplate disposed over and aligned with the enclosure, the coverplate including a silicon sidewall member etched to include a turning mirror element with a reflecting surface at the same predetermined angle θ
, the coverplate turning mirror element for re-directing the optical output signals along the longitudinal axis, the silicon sidewall member further etched to include a pair of angled guiding features disposed on parallel surfaces orthogonal to the turning mirror element; anda silicon array connector for coupling with the coverplate, the silicon array connector including a plurality of optical signal paths for receiving the output optical signals disposed in a silicon housing, the silicon housing including angled guiding features etched on opposing faces for engaging with the coverplate guiding features and aligning the plurality of optical signal paths with the output optical signals. - View Dependent Claims (13, 14, 15, 16, 17)
- , the turning mirror element for intercepting the created optical output signals and re-directing the created optical output signals through the transparent lid;
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18. A method comprising the steps of:
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providing an interposer substrate including a plurality of opto-electronic components for creating optical output signals and; placing an enclosure over the interposer substrate in an aligned arrangement, the enclosure comprising a transparent lid and a silicon sidewall member etched to include a turning mirror element with a reflecting surface at a predetermined angle θ
, the turning mirror element aligned with the interposer for intercepting the created optical output signals and re-directing the created optical output signals through the transparent lid;attaching an aligned silicon coverplate to the transparent lid of the enclosure, the silicon coverplate including a silicon sidewall member etched to include a turning mirror element with a reflecting surface at the same predetermined angle θ
, the coverplate turning mirror element for re-directing the optical output signals along the longitudinal axis;inserting a silicon array connector into coverplate; and aligning a plurality of optical signal paths in the silicon array connector with the optical output signals. - View Dependent Claims (19, 20)
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Specification