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Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors

  • US 20130188970A1
  • Filed: 01/19/2013
  • Published: 07/25/2013
  • Est. Priority Date: 01/19/2012
  • Status: Abandoned Application
First Claim
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1. An apparatus comprisingan interposer substrate for supporting a plurality of opto-electronic components for creating optical output signals propagating along a longitudinal optical axisan enclosure covering the interposer substrate, the enclosure including a silicon sidewall member and a transparent lid, the silicon sidewall member etched to include a turning mirror element with a reflecting surface at a predetermined angle θ

  • , the turning mirror element for intercepting the created optical output signals and re-directing the created optical output signals through the transparent lid; and

    a coverplate disposed over and aligned with the enclosure, the coverplate including a silicon sidewall member etched to include a turning mirror element with a reflecting surface at the same predetermined angle θ

    , the coverplate turning mirror element for re-directing the optical output signals along the longitudinal axis.

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